
Allicdata Part #: | XCZU4EG-2FBVB900E-ND |
Manufacturer Part#: |
XCZU4EG-2FBVB900E |
Price: | $ 0.69 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Xilinx Inc. |
Short Description: | IC FPGA 204 I/O 900FCBGA |
More Detail: | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dua... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 0.63000 |
Series: | Zynq® UltraScale+™ MPSoC EG |
Packaging: | Tray |
Part Status: | Active |
Architecture: | MCU, FPGA |
Core Processor: | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: | -- |
RAM Size: | 256KB |
Peripherals: | DMA, WDT |
Connectivity: | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: | 533MHz, 600MHz, 1.3GHz |
Primary Attributes: | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
Operating Temperature: | 0°C ~ 100°C (TJ) |
Package / Case: | 900-BBGA, FCBGA |
Supplier Device Package: | 900-FCBGA (31x31) |
Number of I/O: | 204 |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Embedded Systems on Chip (SoC) technology is becoming increasingly important in consumer electronic products, such as mobile phones, consumer electronics and the Internet of things, providing significant competitive advantages for companies that adopt it. The XCZU4EG-2FBVB900E is a powerful example of an Embedded System on Chip, offering integrated, high-performance, and low-power solutions to enable embedded system designers to create innovative products that meet the needs of the consumer and industrial markets. This article will discuss the features, applications and working principle of the XCZU4EG-2FBVB900E.
Features: The XCZU4EG-2FBVB900E is a 4-layer Xplained Pro™ System on Chip with a Zynq® UltraScale+™ EG platform and a 16nm FinFET process technology. It also features a dual core Arm® Cortex® A72 and a single core Arm Cortex-R5 processor. It provides up to 8GByte of DDR4 high-speed random access memory, multiple high-speed PCIe connections, DSP and FPGA acceleration, and a wide variety of I/O interfaces.
Applications: The XCZU4EG-2FBVB900E is suitable for a wide range of applications in consumer, industrial, automotive and healthcare markets. It can be used for control, monitoring and data acquisition systems; machine vision; access control and surveillance; medical imaging; and real-time embedded systems. It also offers a wide range of features and solutions, including artificial intelligence, machine learning and deep learning implementations, video and audio processing, and secure authentication.
Working Principle: The XCZU4EG-2FBVB900E is based on a Zynq UltraScale+ EG system-on-chip architecture that includes a programmable logic with up to 3.8 million system logic cells. It also features a hardened subsystem with a hardened memory management unit and a secure boot feature for applications requiring secure boot and root-of-trust. Additionally, the XCZU4EG-2FBVB900E is designed for efficient power management, with a wide range of adjustable core frequencies and supply voltages, allowing designers to tailor their applications for the required performance and power consumption.
The XCZU4EG-2FBVB900E is an example of a powerful and versatile Embedded System on Chip design, offering an extendable development platform for the consumer and industrial markets. Its integrated and hardened subsystems, high-performance processor and graphical subsystem, wide feature set and efficient power management make it an ideal platform for developing a wide variety of applications.
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