XCZU4EG-2FBVB900E Allicdata Electronics
Allicdata Part #:

XCZU4EG-2FBVB900E-ND

Manufacturer Part#:

XCZU4EG-2FBVB900E

Price: $ 0.69
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 204 I/O 900FCBGA
More Detail: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dua...
DataSheet: XCZU4EG-2FBVB900E datasheetXCZU4EG-2FBVB900E Datasheet/PDF
Quantity: 1000
1 +: $ 0.63000
Stock 1000Can Ship Immediately
$ 0.69
Specifications
Series: Zynq® UltraScale+™ MPSoC EG
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: --
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 600MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
Number of I/O: 204
Description

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Embedded Systems on Chip (SoC) technology is becoming increasingly important in consumer electronic products, such as mobile phones, consumer electronics and the Internet of things, providing significant competitive advantages for companies that adopt it. The XCZU4EG-2FBVB900E is a powerful example of an Embedded System on Chip, offering integrated, high-performance, and low-power solutions to enable embedded system designers to create innovative products that meet the needs of the consumer and industrial markets. This article will discuss the features, applications and working principle of the XCZU4EG-2FBVB900E.

Features: The XCZU4EG-2FBVB900E is a 4-layer Xplained Pro™ System on Chip with a Zynq® UltraScale+™ EG platform and a 16nm FinFET process technology. It also features a dual core Arm® Cortex® A72 and a single core Arm Cortex-R5 processor. It provides up to 8GByte of DDR4 high-speed random access memory, multiple high-speed PCIe connections, DSP and FPGA acceleration, and a wide variety of I/O interfaces.

Applications: The XCZU4EG-2FBVB900E is suitable for a wide range of applications in consumer, industrial, automotive and healthcare markets. It can be used for control, monitoring and data acquisition systems; machine vision; access control and surveillance; medical imaging; and real-time embedded systems. It also offers a wide range of features and solutions, including artificial intelligence, machine learning and deep learning implementations, video and audio processing, and secure authentication.

Working Principle: The XCZU4EG-2FBVB900E is based on a Zynq UltraScale+ EG system-on-chip architecture that includes a programmable logic with up to 3.8 million system logic cells. It also features a hardened subsystem with a hardened memory management unit and a secure boot feature for applications requiring secure boot and root-of-trust. Additionally, the XCZU4EG-2FBVB900E is designed for efficient power management, with a wide range of adjustable core frequencies and supply voltages, allowing designers to tailor their applications for the required performance and power consumption.

The XCZU4EG-2FBVB900E is an example of a powerful and versatile Embedded System on Chip design, offering an extendable development platform for the consumer and industrial markets. Its integrated and hardened subsystems, high-performance processor and graphical subsystem, wide feature set and efficient power management make it an ideal platform for developing a wide variety of applications.

The specific data is subject to PDF, and the above content is for reference

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