XCZU7EG-3FFVC1156E Allicdata Electronics
Allicdata Part #:

XCZU7EG-3FFVC1156E-ND

Manufacturer Part#:

XCZU7EG-3FFVC1156E

Price: $ 2.77
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 360 I/O 1156FCBGA
More Detail: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dua...
DataSheet: XCZU7EG-3FFVC1156E datasheetXCZU7EG-3FFVC1156E Datasheet/PDF
Quantity: 1000
1 +: $ 2.52000
Stock 1000Can Ship Immediately
$ 2.77
Specifications
Series: Zynq® UltraScale+™ MPSoC EG
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: --
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 667MHz, 1.5GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)
Number of I/O: 360
Description

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Introduction to Embedded - System On Chip (SoC)
The term of Embedded - System On Chip (SoC) is a combination of hardware and software integration to create a complete system, often referred to as a “system-on-a-chip”. It refers to chip that embeds a full microprocessor based system alongside memories, peripheral interfaces and other dedicated components. It\'s the equivalent of combining a microcontroller, processor, memory and extra hardware blocks onto a single chip.

XCZU7EG-3FFVC1156E – Application Field and Working Principle
The Xilinx XCZU7EG-3FFVC1156E is a SOC chip designed using a 7nm FinFET+ process. It is composed of two core complexes which are integrated with a reconfigurable, real-time, high performance processor. It is the latest, most powerful and smallest member of the Xilinx Zynq UltraScale+ family, making the Xilinx XCZU7EG-3FFVC1156E an ideal solution for embedded-solution applications.

The XCZU7EG-3FFVC1156E is capable of providing up to 896K logic elements, 1.8 million LUTs and 8 million FFs with dedicated DSP slices. This SOC chip is designed to provide high throughput, low latency and scalable performance. Additionally, it enables flexible memory configurations, integrated multiple high-speed transceivers and several blocks of I/O resources which are designed to reduce time-to-market.

The Xilinx XCZU7EG-3FFVC1156E is well-suited for a wide range of embedded design applications such as automation and control, industrial networking and communication, video and image processing, automotive, aerospace, defense and other premium embedded applications. The highly integrated nature of the XCZU7EG-3FFVC1156E enables designers to implement complex systems with high performance, low latency, and high scalability.

For customization, the chip comes with the high-level optimization tool, Vivado Design Suite, which simplifies and accelerates the design process. The platform allows more flexibility, faster design time, and better optimization of the system resources. Vivado also allows design teams to explore the possibilities of using high-level synthesis (HLS) to generate hardware accelerators.

In addition, the XCZU7EG-3FFVC1156E has a high-performance processor subsystem and a range of integrated peripherals including DDR4/LPDDR4/QDR4 memory controllers, PCIe Gen4 interfaces, Gigabit Ethernet and USB 3.0 controllers, Imager Interfaces, Programmable Logic Interface (PLI), and FPUs. This allows the chip to be easily connected to external peripherals.

The XCZU7EG-3FFVC1156E also provides easy connection to non-volatile memory, which means designers can store configurations, data and program codes on the chip. It can also be used for real-time analysis, as the processor subsystem has a range of dedicated debug modules and trace techniques.

To sum up, the Xilinx XCZU7EG-3FFVC1156E is an ideal solution for embedded-solution applications. It provides scalability, flexibility, low latency and high performance. With the right resources and development tools, the XCZU7EG-3FFVC1156E can enable embedded designs to reach high performance and time-to-market goals.

The specific data is subject to PDF, and the above content is for reference

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