XCZU4EG-2FBVB900I

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System on chip (SoC) technologies have been a major enabler for embedded applications for a number of decades. SoCs have enabled engineers to squeeze multiple functions into a single space and price package, allowing for radical improvements in computing power and energy efficiency. The Xilinx Zynq UltraScale+ MPSoC family enables designers to combine up to six independent application processor cores with an FPGA fabric that can aggregate multiple peripherals and integration of wireless protocols. XCZU4EG-2FBVB900I is one of the new SoCs to have been released, promising better system performance.

The XCZU4EG-2FBVB900I SoC is a full featured ARM Cortex-A53 + Cortex-R5 System on Chip that is specifically designed for high-end embedded applications. The ARM Cortex-A53 and Cortex-R5 are the two of the most advanced application processor cores in the ARM product lineup, with each core featuring ultra-low power consumption and the ability to run multiple compute intense tasks with little impact on overall system performance. The A53 core is especially optimized for mobile and low-power applications while the R5 core offers higher performance with more sophisticated processor instruction execution.

The Zynq UltraScale+ MPSoC also features a wide range of integrated blocks such as a high-performance FPGA with up to 900k logic elements for integrated verification, debug, and real-time control and trace functionality. The FPGA also enables blazingly fast device communication with features like Advanced eXtensible Interface (AXI), Low Power Inter Connect (LPIC) and Serial Rapid I/O (SRIO). In addition to the FPGA fabric, the Zynq UltraScale+ MPSoC integrates Gigabit Ethernet, USB 3.0, PCIe, SPI, and UART protocols.

The XCZU4EG-2FBVB900I SoC\'s advanced ARM cores, integrated FPGA fabric, and multi-protocol support makes it an ideal solution for designing high performance embedded systems. Power consumption and thermal control can be optimized with the Xilinx’s on-chip power management core and its Dynamic Voltage and Frequency Scaling (DVFS) technology. With up to three device memory banks to choose from, designers can optimize for cost or performance depending on the application.

The versatile nature of the XCZU4EG-2FBVB900I SoC enables designers to design a wide variety of embedded systems with a single device. The FPGA fabric can be used to implement custom coprocessors, accelerators, and communication bridges to connect multiple subsystems and offload tasks from the processor cores. The combination of the ARM cores and FPGA fabric enable designers to design high-performance, low-power, and cost effective embedded systems without having to use a complex stack of multiple ICs.

The XCZU4EG-2FBVB900I SoC can be used for a wide range of applications and use cases, from high-performance sensor data collection to complex image and video processing. Its advanced processor cores, FPGA fabric, and flexible peripherals make it an ideal solution for designers in need of a versatile and cost effective system on chip for embedded applications. With its combination of high performance, low power, and system-level integration, the XCZU4EG-2FBVB900I SoC is a perfect fit for many different embedded applications.

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