XCZU6CG-2FFVC900I

Series:	Zynq® UltraScale+™ MPSoC CG
Packaging:	Tray
Part Status:	Active
Architecture:	MCU, FPGA
Core Processor:	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:	--
RAM Size:	256KB
Peripherals:	DMA, WDT
Connectivity:	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:	533MHz, 1.3GHz
Primary Attributes:	Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature:	-40°C ~ 100°C (TJ)
Package / Case:	900-BBGA, FCBGA
Supplier Device Package:	900-FCBGA (31x31)
Number of I/O:	204

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System On Chip (SoC) - XCZU6CG-2FFVC900I Application Field and Working Principle

System On Chip (SoC) is an important field of embedded systems integrating multiple functional units into a compact chip. The XCZU6CG-2FFVC900I is a powerful and flexible high-performance multiprocessor architecture FPGA from Xilinx, with important features aimed at hardware designers such as hardware based verification support, accelerator cores, distributed memory, high-speed block RAMs, power efficient design capabilities and more.In this article, we will discuss the application field of XCZU6CG-2FFVC900I, its working principle and the advantages of using this versatile chipset.

Application Field

The XCZU6CG-2FFVC900I has numerous applications such as high-performance computing, artificial intelligence (AI) applications, communications, industrial controls, medical imaging and so on.For high-performance computing, the XCZU6CG-2FFVC900I targets HPC clustering, data centers and other deployment scenarios which require high-performance computing-based solutions. It is particularly useful for applications that require parallel processing and data throughput scalability.For AI applications, the XCZU6CG-2FFVC900I can be used to speed-up pre- and post-processing, enabling AI technologies such as computer vision and deep learning to run more efficiently and accurately by leveraging the on-chip accelerator cores.The XCZU6CG-2FFVC900I can also be used for applications in telecommunication, automotive, aerospace and defense industries. The distributed memory structure and high-speed interconnects of the device make it well suited for wide-area communications, enabling them to make use of the high performance and energy efficiency benefits of FPGA technologies.

Working principle

The XCZU6CG-2FFVC900I is based on Xilinx’s UltraScale+ architecture which is designed to deliver high performance and low-power consumption.It incorporates Xilinx’s exclusive UltraScale+ fabric which is an arranged set of various-sized blocks in a hierarchical structure. At the top level, it contains large number of configurable logic blocks, also known as CLBs, each with a flexible architecture for efficient utilization of FPGA resources. Furthermore, the device includes embedded memory blocks of varying sizes, high-density distributed RAM, high-speed block RAMs, dual-channel SerDes phase-locked loops and high-speed transceivers. It also includes several on-chip accelerators such as PolarFire, Ethernet MAC, DMA and AI engines, aiming to reduce power consumption and accelerate the speed of processing for a wide range of applications.In addition, the XCZU6CG-2FFVC900I comes equipped with various power efficient capabilities such as SRAM retention, adaptive voltage scaling and variable speed clock. The two-handle locking mechanism also helps manage the device configuration in a secure and straightforward way.

Advantages of Using the XCZU6CG-2FFVC900I

The XCZU6CG-2FFVC900I is an ideal choice for those looking for a high-performance and power-efficient FPGA solution.The first major advantage of this device over other FPGAs is its ultra-high performance and low power consumption. That is made possible by the advanced UltraScale+ fabric, which enables users to directly program the chip for efficient utilization of resources.The XCZU6CG-2FFVC900I also provides several on-chip accelerators for streamlining workflow and enhancing power efficiency. It has dual-channel SerDes, Ethernet MAC, DMA and AI engines, as well as a PolarFire accelerator for low latency and power-efficient AI processing.In addition, it features the two-handle locking mechanism which allows users to securely store and manage the device configuration, while the integrated power management provides energy efficiency in a variety of applications.The XCZU6CG-2FFVC900I is also designed to be compatible with software development tools, enabling designers to quickly and easily create and debug applications. This makes it suitable for high-performance computing, AI, communications, industrial and medical imaging applications. Overall, the XCZU6CG-2FFVC900I offers an impressive combination of features, which makes it an ideal choice for many embedded applications. The advent of more powerful FPGAs like XCZU6CG-2FFVC900I has become a reality and it is clear that they hold great promise for the future. This device, with its powerful and efficient features, is the perfect fit for a range of applications and will be at the heart of many embedded systems in the future.

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