XCZU7EV-1FBVB900E

Series:	Zynq® UltraScale+™ MPSoC EV
Packaging:	Tray
Part Status:	Active
Architecture:	MCU, FPGA
Core Processor:	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:	--
RAM Size:	256KB
Peripherals:	DMA, WDT
Connectivity:	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:	500MHz, 600MHz, 1.2GHz
Primary Attributes:	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature:	0°C ~ 100°C (TJ)
Package / Case:	900-BBGA, FCBGA
Supplier Device Package:	900-FCBGA (31x31)
Number of I/O:	204

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System On Chip (SoC): XCZU7EV-1FBVB900E Application Field and Working Principle

A System on Chip (SoC) is an integrated circuit that incorporates most of the functions of a computer or other electronic system into a single semiconductor package. XCZU7EV-1FBVB900E is the world’s largest FPGA (Field-Programmable Gate Array) that is specifically designed to serve as an embedded SoC. Its application fields and working principles are explained here.

The Application Fields of XCZU7EV-1FBVB900E

The XCZU7EV-1FBVB900E is a highly advanced FPGA that enables multiple high-end functions to be embedded in a single chip. This makes it ideal for use in a wide range of application fields, such as:

• High-performance computing and datacenter applications, where it can be used to provide maximum scalability and performance.
• 5G applications, where its embedded flexibility, power efficiency and high compute density make it an ideal choice.
• Industrial automation, where it can be used for high-speed, real-time communications and control.
• Medical applications, where its high clock speeds make it ideal for medical diagnostic equipment.
• Automotive applications, where it can be used for embedded intelligence in connected cars and driver-assist systems.
• Robotics and IoT devices, where its digital signal processing capabilities and resource-efficient computing can be used to give maximum performance.

The Working Principles of XCZU7EV-1FBVB900E

XCZU7EV-1FBVB900E consists of an integrated array of programmable logic components, configurable interconnects and an embedded processor. Its features make it suitable for many scenarios across a various industries, as mentioned above.At the core, XCZU7EV-1FBVB900E consists of a programmable logic component (referred to as PL) and configurable interconnects (referred to as CI). The PL component is configurable by the user through the embedded soft-processor. The PL component is a highly flexible engine that can be programmed to perform logic functions, like executing algorithms and enforcing security mechanisms. This can be done through a simple to use GUI that enables users to configure their PL component.The CI provides a fast, reliable connection between the PL component and other components of the SoC. It enables an easy interconnection between the PL component and peripherals like the embedded processor, memory, and I/Os. This provides maximum levels of flexibility and performance when setting up and running XCZU7EV-1FBVB900E.The embedded processor is a large part of the XCZU7EV-1FBVB900E. It is a small, low-power processor that runs software programs written in C, C++ and other related languages. The processor is programmed through the PL component and can be used to control the features of the XCZU7EV-1FBVB900E, along with the peripherals.The XCZU7EV-1FBVB900E also has power management capabilities and an embedded memory controller. The power management capabilities allow the user to optimize the power consumption of the chip, depending on the application, and the embedded memory controller provides a high-speed connection between the memory and the processor.

Conclusion

The XCZU7EV-1FBVB900E is a powerful, feature-rich FPGA that is specifically designed for embedding in SoC applications. Its integrated array of programmable logic components, configurable interconnects, embedded processor and other features make it ideal for use in a variety of application fields, such as high-performance computing, 5G, industrial automation, medical, automotive, robotics and IoT devices. Its features make it possible to give maximum performance and flexibility in these scenarios.

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