XCZU9EG-1FFVB1156I Allicdata Electronics
Allicdata Part #:

XCZU9EG-1FFVB1156I-ND

Manufacturer Part#:

XCZU9EG-1FFVB1156I

Price: $ 1.89
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 328 I/O 1156FCBGA
More Detail: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dua...
DataSheet: XCZU9EG-1FFVB1156I datasheetXCZU9EG-1FFVB1156I Datasheet/PDF
Quantity: 1000
1 +: $ 1.89000
10 +: $ 1.84000
100 +: $ 1.76000
1000 +: $ 1.61000
10000 +: $ 1.31000
Stock 1000Can Ship Immediately
$ 1.89
Specifications
Series: Zynq® UltraScale+™ MPSoC EG
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: --
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)
Number of I/O: 328
Description

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System On Chip (SoC) is a type of integrated circuit design where all fabrication is done on a single layer of silicon substrate. It integrates multiple components such as CPU, memory, communication interface, and other computationally intensive resources into one single chip to supply an overall solution.

The XCZU9EG-1FFVB1156I is one of the far-reaching Cortex-A53 processor based System On Chip (SoC). It has an integrated dual core ARM Cortex-A53 processor and clock as high as 1.2GHz. The 16nm UltraScale+ FPGA features a wide range of configurable resources available through various selectable I/O protocols such as PCI Express, OTP, and Ethernet. XCZU9EG-1FFVB1156I is a high-efficiency solution for embedded systems which allows the development of powerful single board solutions.

The XCZU9EG-1FFVB1156I is primarily designed for utilization of embedded applications such as digital signal processing, image processing, and industrial automation. With its high level of integration, it reduces the cost of connecting peripheral components and improves system efficiency. This SOC enables a range of device applications by providing an optimized single board solution.

With its Dual ARM Cortex-A53 processor, the XCZU9EG-1FFVB1156I has the capability to provide increased processing resources at a fraction of the cost and space. It also integrates peripheral components such as DDR3, DRAM, PCI Express, FMC and EDMA interfaces, which allow the flexibility to develop applications in fields including medical imaging, aerospace and defense, data center, and Industrial Automation.

The XCZU9EG-1FFVB1156I SOC is based on the Xilinx IP family which enables the development of a range of applications with different levels of performance. It provides a number of features such as Multi-core processing and high-speed DDR3 memory, durable deployed circuits and highly efficient power management, and capacity for multi-channel data communication. In addition, XCZU9EG-1FFVB1156I can easily and smoothly process multiple tasks in the application, including parallel processing and multiple frame rate in embedded calculations.

The working principle of XCZU9EG-1FFVB1156I is to utilize its integrated FPGA fabric and system control to achieve the desired performance. The fabric has the capability to quickly configure the device I/O, elements, and other resources to accommodate the specific requirements of different applications. The system control is important in order to manage the use of memory, buses and other resources within the SOC architecture. It also provides an on-chip controller which can control multiple operations in the device with a single high-speed bus.

XCZU9EG-1FFVB1156I is an excellent device for embedded applications. It helps reduce costs, improve system performance and reduces energy consumption. This highly integrated SOC enables the development of modern, highly efficient, and complex solutions for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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