XR33058IDTR-F Allicdata Electronics
Allicdata Part #:

XR33058IDTR-F-ND

Manufacturer Part#:

XR33058IDTR-F

Price: $ 1.32
Product Category:

Integrated Circuits (ICs)

Manufacturer: MaxLinear, Inc.
Short Description: IC TXRX 1/1 RS422/RS485 8SOIC
More Detail: 1/1 Transceiver Half RS422, RS485 8-SOIC
DataSheet: XR33058IDTR-F datasheetXR33058IDTR-F Datasheet/PDF
Quantity: 1000
2500 +: $ 1.19902
Stock 1000Can Ship Immediately
$ 1.32
Specifications
Series: --
Packaging: Tape & Reel (TR) 
Part Status: Active
Type: Transceiver
Protocol: RS422, RS485
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 170mV
Data Rate: 20Mbps
Voltage - Supply: 3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SOIC
Description

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The XR33058IDTR-F is a type of Interface, Drivers, Receivers, Transceivers which is available as an integrated circuit package. It features an integrated driver, receiver, and transceiver that enables interface between two communication buses. It is primarily used when a certain type of communication is required between the two buses such as RS-232, I2C, SPI and CAN.The XR33058IDTR-F was designed by Exar Corporation and its main purpose is to offer improved interface between different types of communication busses. It offers improved communication speeds, wider bandwidth and greater reliability for industrial, automotive and other applications.

The XR33058IDTR-F offers a single chip solution for applications requiring high-speed communication between two different busses. It is an easy-to-use device that provides efficient communication between single-wire and multiple-wire communication buses. The device is also compliant with various popular communication protocols like RS-232, I2C, SPI, and CAN. It features various features such as low power consumption and high communication speeds making it ideal for both low and high-volume data transfers.

The working principle of the XR33058IDTR-F revolves around two different types of communication busses, the master bus and the slave bus. The device uses two separate transceivers on the master and slave busses. The main purpose of the device is to facilitate data transfer between the two busses. The master bus is responsible for initiating communication and the slave bus is responsible for responding to the commands sent by the master.

The XR33058IDTR-F is further divided into two main components, the main logic and the communication core. The main logic is responsible for the communication between the master and slave busses, while the communication core is responsible for managing the flow of data between the two busses. The main logic of the device conatins several status registers and counters that allow it to monitor and respond to various conditions. For example, it can monitor the speed of the transmission, the error rate, the data throughput and other associated criteria.

The communication core of the XR33058IDTR-F is responsible for generating the required waveforms and manipulating data that is flowing between the two busses. It works in three stages, encoding, decoding and transmitting the data. During encoding, the communication core encodes the data received from the master bus into a predetermined waveform pattern. This pattern is then transmitted over the slave bus. During decoding, the communication core receives the data and decodes it by recognizing the waveform pattern it generated during the encoding process.

The XR33058IDTR-F device can be used across a wide range of applications due to its compact size, high data throughput and low power consumption. It is suitable for real-time communication applications such as sensors and actuators based on different communication protocols including Ethernet, RS-485, USB, Serial and I2C. The device is also suitable for automotive, telecom and industrial applications requiring efficient communication between two different busses.

In conclusion, the XR33058IDTR-F is a powerful and efficient device for interconnecting two different busses for industrial, automotive and other applications. It offers excellent communication speeds, wider bandwidth and low power consumption in a single chip solution. Its main components, the main logic and the communication core, enable it to handle data transmission between different busses, making it suitable for a wide range of real-time and high-volume applications.

The specific data is subject to PDF, and the above content is for reference

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