XR33152IDTR-F

Series:	--
Packaging:	Tape & Reel (TR)
Part Status:	Active
Type:	Transceiver
Protocol:	RS422, RS485
Number of Drivers/Receivers:	1/1
Duplex:	Half
Receiver Hysteresis:	170mV
Data Rate:	250kbps
Voltage - Supply:	3 V ~ 5.5 V
Operating Temperature:	-40°C ~ 85°C
Mounting Type:	Surface Mount
Package / Case:	8-SOIC (0.154", 3.90mm Width)
Supplier Device Package:	8-SOIC

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The XR33152IDTR-F is an interface driver, receiver, and transceiver - all-in-one chip - that is designed to solve the problem of transferring data between two or more devices. It is a versatile, high-speed, low-power solution that is optimized for applications such as small form factor, long-distance sensing, and power management.The XR33152IDTR-F features a high-speed, multi-protocol data transfer interface that supports both LVDS and E-Lins standards as well as up to 8-bit and 10-bit data buses. It is a low-power solution with an operating current of only 70mA and a power consumption of only 200mW.The XR33152IDTR-F has a wide range of applications. It can be used in applications such as automotive, industrial, medical, communication, and video game consoles. In automotive applications, it can be used in navigation systems and in-car infotainment systems, as well as in safety systems such as airbag deployment and adaptive lighting. It can be used in industrial applications for monitoring and controlling temperature, humidity, and other environmental conditions. It can also be used in medical applications for patient monitoring and home health care. In communications, it can be used for remote access and control, as well as for transferring data between two or more networked devices. And in video game consoles, it can be used to transfer data between multiple game controllers and consoles.The working principle of the XR33152IDTR-F is simple. It is designed to receive digital data and convert it into analog form so it can be transmitted over a digital interface. In addition, it can be used to convert digital data back into analog form at the receiving end. It can do this at very high speeds with very little power consumed.The XR33152IDTR-F is implemented in a single-die flip-chip pack, which is designed to simplify board layout and reduce installation time. It also features integrated ESD protection and a built-in power down mode, both of which are designed to reduce power consumption and extend battery life. Additionally, the XR33152IDTR-F features thermal management features such as an integrated thermal diode and on-chip heat spreader.In summary, the XR33152IDTR-F is an all-in-one chip that combines a high-speed, low-power interface driver, receiver, and transceiver in one. It is optimized for high-speed data transmission in applications such as automotive, industrial, medical, communication, and video game consoles. Its integrated thermal management features ensure an extended battery life, while its small form factor and low-profile design make it ideal for a plethora of applications.

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