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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
W25P40VSNIGT&am p;R-ND	W25P40VSNIG T&a mp;R	Winbond Electronics	View more Series: SpiFlash Packaging: Tape & Reel (TR) Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 4Mb (512K x 8) Clock Frequency: 40MHz Write Cycle Time - Word, Page: 5ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	1+: $0
W632GG6MB-11-ND	W632GG6MB-11	Winbond Electronics	View more Part Status: Active Memory Type: Volatile Memory Format: DRAM Technology: SDRAM - DDR3 Memory Size: 2Gb (128M x 16) Clock Frequency: 933MHz Access Time: 20ns Memory Interface: Parallel Voltage - Supply: 1.425 V ~ 1.575 V Operating Temperature: 0C ~ 95C (TC)	1000 Order	198+: $3.7592
W25P80VSSIGT&am p;R-ND	W25P80VSSIG T&a mp;R	Winbond Electronics	View more Series: SpiFlash Packaging: Tape & Reel (TR) Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 8Mb (1M x 8) Clock Frequency: 50MHz Write Cycle Time - Word, Page: 7ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC	1000 Order	1+: $0
W632GG6MB-15TR- ND	W632GG6MB-15 TR	Winbond Electronics	View more Packaging: Tape & Reel (TR) Part Status: Active Memory Type: Volatile Memory Format: DRAM Technology: SDRAM - DDR3 Memory Size: 2Gb (128M x 16) Clock Frequency: 667MHz Access Time: 20ns Memory Interface: Parallel Voltage - Supply: 1.425 V ~ 1.575 V Operating Temperature: 0C ~ 95C (TC)	1000 Order	3000+: $2.998
W25X40VSSIG-ND	W25X40VSSIG	Winbond Electronics	View more Series: SpiFlash Packaging: Tube Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 4Mb (512K x 8) Clock Frequency: 75MHz Write Cycle Time - Word, Page: 3ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC	1000 Order	--
W632GG8MB-15TR- ND	W632GG8MB-15 TR	Winbond Electronics	View more Packaging: Tape & Reel (TR) Part Status: Active Memory Type: Volatile Memory Format: DRAM Technology: SDRAM - DDR3 Memory Size: 2Gb (128M x 16) Clock Frequency: 667MHz Access Time: 20ns Memory Interface: Parallel Voltage - Supply: 1.425 V ~ 1.575 V Operating Temperature: 0C ~ 95C (TC)	1000 Order	2000+: $3.1014
W25X40CLSNIGTR- ND	W25X40CLSNIG TR	Winbond Electronics	View more Series: SpiFlash Packaging: Tape & Reel (TR) Part Status: Active Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 4Mb (512K x 8) Clock Frequency: 104MHz Write Cycle Time - Word, Page: 800s Memory Interface: SPI Voltage - Supply: 2.3 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	2500+: $0.2536
W25P20VSNIG-ND	W25P20VSNIG	Winbond Electronics	View more Series: SpiFlash Packaging: Tube Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 2Mb (256K x 8) Clock Frequency: 40MHz Write Cycle Time - Word, Page: 5ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	--
W632GG6MB12I-ND	W632GG6MB12I	Winbond Electronics	View more Part Status: Active Memory Type: Volatile Memory Format: DRAM Technology: SDRAM - DDR3 Memory Size: 2Gb (128M x 16) Clock Frequency: 800MHz Access Time: 20ns Memory Interface: Parallel Voltage - Supply: 1.425 V ~ 1.575 V Operating Temperature: -40C ~ 95C (TC)	1000 Order	198+: $4.472
W632GU6MB-15-ND	W632GU6MB-15	Winbond Electronics	View more Part Status: Active Memory Type: Volatile Memory Format: DRAM Technology: SDRAM - DDR3 Memory Size: 2Gb (128M x 16) Clock Frequency: 667MHz Access Time: 20ns Memory Interface: Parallel Voltage - Supply: 1.283 V ~ 1.45 V Operating Temperature: 0C ~ 95C (TC)	1000 Order	198+: $3.5587
W25X16VSSIGT&am p;R-ND	W25X16VSSIG T&a mp;R	Winbond Electronics	View more Series: SpiFlash Packaging: Tape & Reel (TR) Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 16Mb (2M x 8) Clock Frequency: 75MHz Write Cycle Time - Word, Page: 3ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC	1000 Order	1+: $0
W25P20VSNIGT&am p;R-ND	W25P20VSNIG T&a mp;R	Winbond Electronics	View more Series: SpiFlash Packaging: Tape & Reel (TR) Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 2Mb (256K x 8) Clock Frequency: 40MHz Write Cycle Time - Word, Page: 5ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	1+: $0
W25Q64FVSH01-ND	W25Q64FVSH01	Winbond Electronics	View more Series: SpiFlash Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH - NOR Memory Size: 64Mb (8M x 8) Clock Frequency: 104MHz Write Cycle Time - Word, Page: 3ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V	1000 Order	1+: $0
W25Q64JVSSIM-ND	W25Q64JVSSIM	Winbond Electronics	View more Series: SpiFlash Part Status: Active Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH - NOR Memory Size: 64Mb (8M x 8) Clock Frequency: 133MHz Write Cycle Time - Word, Page: 3ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA)	1000 Order	--
W27C512-45Z-ND	W27C512-45Z	Winbond Electronics	View more Packaging: Tube Part Status: Obsolete Memory Type: Non-Volatile Memory Format: EEPROM Technology: EEPROM Memory Size: 512Kb (64K x 8) Access Time: 45ns Memory Interface: Parallel Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: 0C ~ 70C (TA) Mounting Type: Through Hole Package / Case: 28-DIP (0.600", 15.24mm) Supplier Device Package: 28-PDIP	1000 Order	--
CT3677-ND	CT3677	Cal Test Electronics	View more Series: Cal Test Part Status: Active Type: Test Clip, Lead, Probe Accessory Type: IC Lead Comb Kit For Use With/Related Products: Oscilloscope Probes Specifications: 0.5mm Centers	1000 Order	1+: $30.24
14-1518-11H-ND	14-1518-11H	Aries Electronics	View more Series: 518 Packaging: Bulk Part Status: Active Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination Post Length: 0.125" (3.18mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	35+: $2.0837
16-81250-10-ND	16-81250-10	Aries Electronics	View more Series: 8 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0in (5.08m) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 105C Termination Post Length: 0.140" (3.56mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A	1000 Order	40+: $2.5799
14-3518-102-ND	14-3518-102	Aries Electronics	View more Series: 518 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination Post Length: 0.125" (3.18mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	26+: $2.75
06-3503-31-ND	06-3503-31	Aries Electronics	View more Series: 503 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 6 (2 x 3) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.500" (12.70mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	22+: $3.538
30-6513-11-ND	30-6513-11	Aries Electronics	View more Series: Lo-PROfile, 513 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 30 (2 x 15) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination Post Length: 0.125" (3.18mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	19+: $3.7283
20-810-90-ND	20-810-90	Aries Electronics	View more Series: Vertisockets 800 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole, Right Angle, Vertical Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6 Termination Post Length: 0.145" (3.68mm) Material Flammability Rating: UL94 V-0 Current Rating: 1.5A	1000 Order	7+: $8.3106
32-8540-610C-ND	32-8540-610C	Aries Electronics	View more Series: 8 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0in (0.76m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 105C Termination Post Length: 0.140" (3.56mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	6+: $8.9324
40-6621-30-ND	40-6621-30	Aries Electronics	View more Series: 6621 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0in (5.08m) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole, Bottom Entry; Through Board Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 105C Termination Post Length: 0.150" (3.81mm) Material Flammability Rating: UL94 V-0 Current Rating: 1.5A	1000 Order	5+: $9.7335
24-C182-21-ND	24-C182-21	Aries Electronics	View more Series: EJECT-A-DIP Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.040" (1.02mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	6+: $10.6775
40-C300-31-ND	40-C300-31	Aries Electronics	View more Series: EJECT-A-DIP Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.040" (1.02mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	4+: $14.364
28-6572-16-ND	28-6572-16	Aries Electronics	View more Series: 57 Packaging: Bulk Part Status: Active Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0in (5.08m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination Post Length: 0.110" (2.78mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A	1000 Order	11+: $16.6898
42-6551-16-ND	42-6551-16	Aries Electronics	View more Series: 55 Packaging: Bulk Part Status: Active Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0in (1.27m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0in (1.27m) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination Post Length: 0.110" (2.78mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A	1000 Order	56+: $28.194
36-1518-10H-ND	36-1518-10H	Aries Electronics	View more Series: 518 Packaging: Bulk Part Status: Active Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 36 (2 x 18) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination Post Length: 0.125" (3.18mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	28+: $2.5373
A784AR-ND	08-6820-90C	Aries Electronics	View more Series: Vertisockets 800 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0in (0.76m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 105C Termination Post Length: 0.140" (3.56mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	23+: $3.3565
08-8900-310C-ND	08-8900-310C	Aries Electronics	View more Series: 8 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0in (0.76m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 105C Termination Post Length: 0.140" (3.56mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	20+: $3.562
18-3513-11H-ND	18-3513-11H	Aries Electronics	View more Series: Lo-PROfile, 513 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination Post Length: 0.125" (3.18mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	20+: $3.7422
40-6518-102-ND	40-6518-102	Aries Electronics	View more Series: 518 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination Post Length: 0.125" (3.18mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	16+: $4.3797
08-3508-31-ND	08-3508-31	Aries Electronics	View more Series: 508 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0in (0.76m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.500" (12.70mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	14+: $5.054
28-6551-10-ND	28-6551-10	Aries Electronics	View more Series: 55 Packaging: Bulk Part Status: Active Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0in (5.08m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination Post Length: 0.110" (2.78mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A	1000 Order	54+: $5.731
32-3554-10-ND	32-3554-10	Aries Electronics	View more Series: 55 Packaging: Bulk Part Status: Active Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0in (5.08m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination Post Length: 0.110" (2.78mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A	1000 Order	16+: $7.1214
40-3551-10-ND	40-3551-10	Aries Electronics	View more Series: 55 Packaging: Bulk Part Status: Active Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0in (5.08m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination Post Length: 0.110" (2.78mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A	1000 Order	56+: $7.6239
28-3570-10-ND	28-3570-10	Aries Electronics	View more Series: 57 Packaging: Bulk Part Status: Active Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0in (5.08m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination Post Length: 0.110" (2.78mm) Material Flammability Rating: UL94 V-0 Current Rating: 1A	1000 Order	10+: $7.6343
40-6503-20-ND	40-6503-20	Aries Electronics	View more Series: 503 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 105C Termination Post Length: 0.360" (9.14mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	8+: $8.3286
40-6820-90C-ND	40-6820-90C	Aries Electronics	View more Series: Vertisockets 800 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0in (0.76m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 105C Termination Post Length: 0.140" (3.56mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	7+: $8.4393

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