Nxp decoder interface - Allicdata Electronics

Related Categories

< 210 211 212 213 214 >

Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
MC33926PNB-ND	MC33926PNB	NXP USA Inc	View more Packaging: Tray Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 3 (168 Hours) Motor Type - AC, DC: Brushed DC Function: Driver - Fully Integrated, Control and Power Stage Output Configuration: Half Bridge (2) Interface: Parallel Technology: CMOS Applications: Automotive Current - Output: 5A Voltage - Supply: 5 V ~ 28 V Voltage - Load: 5 V ~ 28 V Operating Temperature: -40C ~ 125C (TA) Mounting Type: Surface Mount Package / Case: 32-PowerQFN Supplier Device Package: 32-PQFN (8x8) Base Part Number: MC33926	4672 Order	1+: $2.9862 10+: $2.6807 100+: $2.1962 500+: $1.8696 1000+: $1.5768
MC33886PVW-ND	MC33886PVW	NXP USA Inc	View more Packaging: Tube Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 3 (168 Hours) Motor Type - AC, DC: Brushed DC Function: Driver - Fully Integrated, Control and Power Stage Output Configuration: Half Bridge (2) Interface: Parallel Technology: CMOS Applications: General Purpose Current - Output: 5A Voltage - Supply: 5 V ~ 40 V Voltage - Load: 5 V ~ 40 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 20-HSOP Base Part Number: MC33886	518 Order	--
MCIMX6DP4AVT8AB R-ND	MCIMX6DP4AVT8AB R	NXP USA Inc	View more Series: i.MX6DP Packaging: Tape & Reel (TR) Part Status: Active Core Processor: ARM Cortex-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 852MHZ Co-Processors/DSP: Multimedia; NEON SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40C ~ 125C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCPBGA (21x21)	1000 Order	500+: $34.8676
MCZ33879AEKR2TR -ND	MCZ33879AEKR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Switch Type: General Purpose Number of Outputs: 8 Ratio - Input:Output: 1:8 Output Configuration: High Side or Low Side Output Type: N-Channel Interface: SPI Voltage - Load: 5.5 V ~ 27.5 V Voltage - Supply (Vcc/Vdd): 3.1 V ~ 5.5 V Current - Output (Max): 600mA Rds On (Typ): 750 mOhm Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage Operating Temperature: -40C ~ 150C (TJ) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Base Part Number: MCZ33879	1000 Order	--
S9KEAZN64AMLC-N D	S9KEAZN64AMLC	NXP USA Inc	View more Series: Kinetis KEA Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M0+ Core Size: 32-Bit Speed: 40MHz Controller Series: Microcontrollers - MCU Connectivity: IC, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Interface: I2C, SPI, UART Number of I/O: 28 Program Memory Size: 64KB (64K x 8) Voltage - Supply: 2.7 V ~ 5.5 V Program Memory Type: FLASH EEPROM Size: 256 x 8 Mounting Type: Surface Mount RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7) Base Part Number: S9KEAZN64	26710 Order	--
MC908AB32CFUE-N D	MC908AB32CFUE	NXP USA Inc	View more Series: HC08 Packaging: Tray Part Status: Not For New Designs Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Controller Series: 8-bit Microcontrollers - MCU Connectivity: SCI, SPI Peripherals: POR, PWM Interface: SCI, SPI Number of I/O: 51 Program Memory Size: 32KB (32K x 8) Voltage - Supply: 4.5 V ~ 5.5 V Program Memory Type: FLASH EEPROM Size: 512 x 8 Mounting Type: Surface Mount RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14) Base Part Number: MC908AB32	8610 Order	--
MKE02Z64VLD4R-N D	MKE02Z64VLD4R	NXP USA Inc	View more Series: Kinetis KE02 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: ARM Cortex-M0+ Core Size: 32-Bit Speed: 40MHz Controller Series: Microcontrollers - MCU Connectivity: IC, SPI, UART/USART Peripherals: LVD, PWM, WDT Interface: I2C, SPI, UART Number of I/O: 37 Program Memory Size: 64KB (64K x 8) Voltage - Supply: 2.7 V ~ 5.5 V Program Memory Type: FLASH EEPROM Size: 256 x 8 Mounting Type: Surface Mount RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10) Base Part Number: MKE02Z64	27880 Order	--
MC9S12XF512MLM- ND	MC9S12XF512MLM	NXP USA Inc	View more Series: HCS12X Packaging: Tray Part Status: Not For New Designs Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 88 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20) Base Part Number: MC9S12XF512	180 Order	1+: $164.17
568-14586-ND	MC17XSF500EK	NXP USA Inc	View more Packaging: Tube Part Status: Last Time Buy Switch Type: General Purpose Number of Outputs: 5 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 7 V ~ 18 V Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): 5.5A Rds On (Typ): 17 mOhm Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO Operating Temperature: -40C ~ 125C (TA) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Base Part Number: MC17XSF500	42 Order	1+: $3.9249 10+: $3.5431 100+: $2.9335 500+: $2.5544 1000+: $2.2248
568-13563-ND	MCIMX6U6AVM10AC	NXP USA Inc	View more Series: i.MX6DL Packaging: Tray Part Status: Active Core Processor: ARM Cortex-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40C ~ 125C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	60 Order	1+: $29.4021 10+: $27.4283 100+: $23.8149
MC10XS4200BFKR2 -ND	MC10XS4200BFKR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 8 V ~ 36 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 6A Rds On (Typ): 10 mOhm (Max) Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO Operating Temperature: -40C ~ 125C (TA) Package / Case: 23-PowerQFN Supplier Device Package: 23-PQFN (12x12)	1000 Order	1200+: $3.5735
MCIMX6D7CZK08AE -ND	MCIMX6D7CZK08AE	NXP USA Inc	View more Series: i.MX6D Part Status: Active Core Processor: ARM Cortex-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40C ~ 105C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection	1000 Order	189+: $33.3966
568-13549-ND	MC33984CHFK	NXP USA Inc	View more Packaging: Tray Part Status: Active Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:2 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 6 V ~ 27 V Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Rds On (Typ): 4 mOhm (Max) Features: Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40C ~ 150C (TJ) Package / Case: 16-PowerQFN Supplier Device Package: 16-PQFN (12x12) Base Part Number: MC33984	1001 Order	1+: $7.1316 10+: $6.4436 100+: $5.3346 500+: $4.6453 1000+: $4.0459
MC35XS3400CHFK- ND	MC35XS3400CHFK	NXP USA Inc	View more Packaging: Tray Part Status: Active Switch Type: General Purpose Number of Outputs: 4 Ratio - Input:Output: 1:4 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 6 V ~ 20 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 6A Rds On (Typ): 35 mOhm (Max) Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40C ~ 150C (TJ) Package / Case: 24-PowerQFN Supplier Device Package: 24-PQFN (12x12) Base Part Number: MC35XS3400	1000 Order	168+: $2.8089
MC33HB2001EK-ND	MC33HB2001EK	NXP USA Inc	View more Packaging: Tube Part Status: Active Output Configuration: Half Bridge (2) Applications: DC Motors, General Purpose Interface: SPI Load Type: Inductive Technology: Power MOSFET Rds On (Typ): 125 mOhm LS (Max), 125 mOhm HS (Max) Voltage - Supply: 5 V ~ 28 V Voltage - Load: 5 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Features: Slew Rate Controlled Fault Protection: Over Temperature, Over Voltage, UVLO Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	182 Order	1+: $4.2273 10+: $3.8165 100+: $3.16 500+: $2.7517 1000+: $2.3966
MC33186VW1R2-ND	MC33186VW1R2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Output Configuration: Half Bridge (2) Applications: DC Motors, General Purpose, Solenoids Interface: Logic Load Type: Inductive Technology: Bi-CMOS Rds On (Typ): 150 mOhm Current - Output / Channel: 5A Voltage - Supply: 5 V ~ 28 V Voltage - Load: 5 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Features: Status Flag Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO Mounting Type: Surface Mount Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 20-HSOP Base Part Number: MC33186	1000 Order	1+: $0
BUK221-50DY,118 -ND	BUK221-50DY,118	NXP USA Inc	View more Series: TOPFET Packaging: Tape & Reel (TR) Part Status: Obsolete Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: On/Off Voltage - Load: 5.5 V ~ 35 V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 4A Rds On (Typ): 73 mOhm Input Type: Non-Inverting Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40C ~ 150C (TJ) Package / Case: TO-263-7, DPak (6 Leads + Tab), TO-263CB Supplier Device Package: D2PAK Base Part Number: BUK2	1000 Order	1+: $0
MCIMX6D4AVT08AE R-ND	MCIMX6D4AVT08AE R	NXP USA Inc	View more Series: i.MX6D Packaging: Tape & Reel (TR) Part Status: Active Core Processor: ARM Cortex-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 852MHZ Co-Processors/DSP: Multimedia; NEON SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40C ~ 125C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCPBGA (21x21)	1000 Order	500+: $29.0416
PIP3102-R,118-N D	PIP3102-R,118	NXP USA Inc	View more Series: TOPFET Packaging: Tape & Reel (TR) Part Status: Obsolete Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: Low Side Output Type: N-Channel Interface: On/Off Voltage - Load: 50V (Max) Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 30A Rds On (Typ): 21 mOhm Input Type: Non-Inverting Features: Status Flag Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage Package / Case: TO-263-5, DPak (4 Leads + Tab), TO-263BB Supplier Device Package: SOT-426 Base Part Number: PIP3102-R	1000 Order	1+: $0
MC33186VW1-ND	MC33186VW1	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Output Configuration: Half Bridge (2) Applications: DC Motors, General Purpose, Solenoids Interface: Logic Load Type: Inductive Technology: Bi-CMOS Rds On (Typ): 150 mOhm Current - Output / Channel: 5A Voltage - Supply: 5 V ~ 28 V Voltage - Load: 5 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Features: Status Flag Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO Mounting Type: Surface Mount Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 20-HSOP Base Part Number: MC33186	1000 Order	1+: $0
MC10XS3435DHFK- ND	MC10XS3435DHFK	NXP USA Inc	View more Packaging: Tray Part Status: Active Switch Type: General Purpose Number of Outputs: 4 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 6 V ~ 20 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 6A Rds On (Typ): 10 mOhm (Max), 35 mOhm (Max) Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40C ~ 150C (TJ) Package / Case: 24-PowerQFN Supplier Device Package: 24-PQFN (12x12) Base Part Number: MC10XS3435	1000 Order	840+: $2.732
S9S12G128AMLL-N D	S9S12G128AMLL	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Controller Series: 16-bit Microcontrollers - MCU Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Interface: SCI, SPI Number of I/O: 86 Program Memory Size: 128KB (128K x 8) Voltage - Supply: 3.13 V ~ 5.5 V Program Memory Type: FLASH EEPROM Size: 4K x 8 Mounting Type: Surface Mount RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14) Base Part Number: S9S12	450 Order	--
568-13541-ND	MCIMX6DP7CVT8AB	NXP USA Inc	View more Series: i.MX6DP Packaging: Tray Part Status: Active Core Processor: ARM Cortex-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40C ~ 105C (TA) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCPBGA (21x21)	42 Order	1+: $41.9454 10+: $39.8488 100+: $35.9162
MCF5213CAF80-ND	MCF5213CAF80	NXP USA Inc	View more Series: MCF521x Packaging: Tray Part Status: Not For New Designs Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, IC, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 55 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14) Base Part Number: MCF5213	2077 Order	--
568-13540-ND	MCIMX6DP6AVT8AB	NXP USA Inc	View more Series: i.MX6DP Packaging: Tray Part Status: Active Core Processor: ARM Cortex-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 852MHZ Co-Processors/DSP: Multimedia; NEON SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40C ~ 125C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCPBGA (21x21)	60 Order	1+: $43.7598 10+: $41.5705 100+: $37.4681
568-13492-ND	S9KEAZN32AMLC	NXP USA Inc	View more Series: Kinetis KEA Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M0+ Core Size: 32-Bit Speed: 40MHz Connectivity: IC, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Interface: I2C, SPI, UART Number of I/O: 28 Program Memory Size: 32KB (32K x 8) Voltage - Supply: 2.7 V ~ 5.5 V Program Memory Type: FLASH EEPROM Size: 256 x 8 Mounting Type: Surface Mount RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7) Base Part Number: S9KEAZN32	1250 Order	--
S912XET256W1MAL -ND	S912XET256W1MAL	NXP USA Inc	View more Series: HCS12X Packaging: Tray Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Controller Series: Microcontrollers - MCU Connectivity: CANbus, EBI/EMI, IC, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Interface: SCI, SPI Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Voltage - Supply: 1.72 V ~ 5.5 V Program Memory Type: FLASH EEPROM Size: 4K x 8 Mounting Type: Surface Mount RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20) Base Part Number: S912	6684 Order	--
MC16XSD200FK-ND	MC16XSD200FK	NXP USA Inc	View more Packaging: Tray Part Status: Active Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 8 V ~ 36 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 3A Rds On (Typ): 16 mOhm (Max) Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40C ~ 150C (TJ) Package / Case: 23-PowerQFN Supplier Device Package: 23-PQFN (12x12)	1000 Order	--
568-13584-ND	MC33880PEW	NXP USA Inc	View more Packaging: Tube Part Status: Active Switch Type: General Purpose Number of Outputs: 8 Ratio - Input:Output: 1:8 Output Configuration: High Side or Low Side Output Type: N-Channel Interface: SPI Voltage - Load: 5.5 V ~ 24.5 V Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Current - Output (Max): 800mA Rds On (Typ): 550 mOhm Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage Operating Temperature: -40C ~ 150C (TJ) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC Base Part Number: MC33880	40 Order	1+: $3.8619 10+: $3.4682 100+: $2.8414 500+: $2.4188 1000+: $2.04
568-14235-ND	MC34932EK	NXP USA Inc	View more Packaging: Tube Part Status: Active Output Configuration: Half Bridge (4) Applications: DC Motors, General Purpose Interface: Logic Load Type: Inductive Technology: Power MOSFET Rds On (Typ): 120 mOhm Current - Output / Channel: 5A Voltage - Supply: 5 V ~ 36 V Voltage - Load: 5 V ~ 36 V Operating Temperature: -40C ~ 150C (TJ) Features: Status Flag Fault Protection: Current Limiting, Over Temperature, Short Circuit, UVLO Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Base Part Number: MC34932	514 Order	1+: $4.0887 10+: $3.6937 100+: $3.0581 500+: $2.6629 1000+: $2.3193
568-13538-ND	MCIMX6DP5EYM1AB	NXP USA Inc	View more Series: i.MX6DP Packaging: Tray Part Status: Active Core Processor: ARM Cortex-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20C ~ 105C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-LFBGA, FCBGA Supplier Device Package: 624-FCPBGA (21x21)	60 Order	1+: $37.5984 10+: $35.3191 100+: $31.6732
568-13539-ND	MCIMX6DP6AVT1AB	NXP USA Inc	View more Series: i.MX6DP Packaging: Tray Part Status: Active Core Processor: ARM Cortex-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40C ~ 125C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCPBGA (21x21)	60 Order	--
MC9S08SH8CTGRTR -ND	MC9S08SH8CTGR	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Interface: I2C, SCI, SPI Number of I/O: 13 Program Memory Size: 8KB (8K x 8) Voltage - Supply: 2.7V ~ 5.5V Program Memory Type: FLASH Mounting Type: Surface Mount RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP Base Part Number: MC9S08SH8	22511 Order	--
568-3345-2-ND	PIP212-12M,518	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Output Configuration: Half Bridge Applications: Synchronous Buck Converters Interface: PWM Load Type: Inductive Technology: DrMOS Rds On (Typ): 1.9 mOhm LS, 6.5 mOhm HS Current - Output / Channel: 35A Current - Peak Output: 60A Voltage - Supply: 3.3 V ~ 16 V Voltage - Load: 24V (Max) Operating Temperature: -55C ~ 150C (TJ) Features: Bootstrap Circuit, 5V Regulated Output Fault Protection: Over Temperature, UVLO Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8) Base Part Number: PIP212-12M	1000 Order	1+: $0
MCIMX6DP6AVT8AB R-ND	MCIMX6DP6AVT8AB R	NXP USA Inc	View more Series: i.MX6DP Packaging: Tape & Reel (TR) Part Status: Active Core Processor: ARM Cortex-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 852MHZ Co-Processors/DSP: Multimedia; NEON SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40C ~ 125C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCPBGA (21x21)	1000 Order	500+: $36.374
ADC1015S065HNC1 :5-ND	ADC1015S065HNC1 :5	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Number of Bits: 10 Sampling Rate (Per Second): 65M Number of Inputs: 1 Input Type: Differential, Single Ended Data Interface: LVDS - Parallel, Parallel Configuration: S/H-ADC Ratio - S/H:ADC: 1:1 Number of A/D Converters: 1 Architecture: Pipelined Reference Type: External, Internal Voltage - Supply, Analog: 2.85 V ~ 3.4 V, 5V Voltage - Supply, Digital: 1.65 V ~ 3.6 V Operating Temperature: -40C ~ 85C Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6) Base Part Number: ADC1015S	1000 Order	4000+: $4.3403
MC50XS4200BEK-N D	MC50XS4200BEK	NXP USA Inc	View more Packaging: Tube Part Status: Active Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 8 V ~ 36 V Voltage - Supply (Vcc/Vdd): 3.3 V ~ 5 V Current - Output (Max): 1.2A Rds On (Typ): 50 mOhm Features: Slew Rate Controlled Fault Protection: Open Load Detect, Over Temperature Operating Temperature: -40C ~ 125C (TA) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Base Part Number: MC50XS4200	126 Order	1+: $4.2273 10+: $3.8165 100+: $3.16 500+: $2.7517 1000+: $2.3966
BUK215-50Y,118- ND	BUK215-50Y,118	NXP USA Inc	View more Series: TOPFET Packaging: Tape & Reel (TR) Part Status: Obsolete Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: On/Off Voltage - Load: 5.5 V ~ 35 V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 9A Rds On (Typ): 28 mOhm Input Type: Non-Inverting Features: Status Flag Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: 150C (TJ) Package / Case: TO-263-5, DPak (4 Leads + Tab), TO-263BB Supplier Device Package: SOT-426 Base Part Number: BUK2	1000 Order	1+: $0
MCIMX6Q7CZK08AE -ND	MCIMX6Q7CZK08AE	NXP USA Inc	View more Series: i.MX6Q Part Status: Active Core Processor: ARM Cortex-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40C ~ 105C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection	1000 Order	189+: $41.137
MC34932EKR2-ND	MC34932EKR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Output Configuration: Half Bridge (4) Applications: DC Motors, General Purpose Interface: Logic Load Type: Inductive Technology: Power MOSFET Rds On (Typ): 120 mOhm Current - Output / Channel: 5A Voltage - Supply: 5 V ~ 36 V Voltage - Load: 5 V ~ 36 V Operating Temperature: -40C ~ 150C (TJ) Features: Status Flag Fault Protection: Current Limiting, Over Temperature, Short Circuit, UVLO Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Base Part Number: MC34932	1000 Order	1000+: $2.3193

< 210 211 212 213 214 >

Hot Searches: nxp decoder interface on decoder interface nxp encoder interface nxp converter interface adsantec decoder interface analog decoder interface akm decoder interface broadcom decoder interface burr decoder interface cirrus decoder interface conexant decoder interface cypress decoder interface fairchild decoder interface freescale decoder interface kinnum decoder interface harris decoder interface holtek decoder interface infineon decoder interface intersil decoder interface lantic decoder interface

Search Result:nxp decoder interface

Related Categories