S9KEAZN64AMLC Allicdata Electronics
Allicdata Part #:

S9KEAZN64AMLC-ND

Manufacturer Part#:

S9KEAZN64AMLC

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: NXP USA Inc
Short Description: IC MCU 32BIT 64KB FLASH 32LQFPARM® Cortex®-M0+ Kin...
More Detail: N/A
DataSheet: S9KEAZN64AMLC datasheetS9KEAZN64AMLC Datasheet/PDF
Quantity: 26710
Stock 26710Can Ship Immediately
Specifications
Series: Kinetis KEA
Packaging: Tray 
Part Status: Active
Applications: --
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 40MHz
Controller Series: Microcontrollers - MCU
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Interface: I2C, SPI, UART
Number of I/O: 28
Program Memory Size: 64KB (64K x 8)
Voltage - Supply: 2.7 V ~ 5.5 V
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Mounting Type: Surface Mount
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)
Base Part Number: S9KEAZN64
Description

Due to market price fluctuations,if you need to purchase or consult the price.You can contact us or emial to us:   sales@allicdata.com


1. Feature

    1. Operating characteristics

        – Voltage range: 2.7 to 5.5 V

        – Flash write voltage range: 2.7 to 5.5 V

        – Temperature range (ambient): -40 to 125°C

    2. Performance

        – Up to 40 MHz Arm® Cortex-M0+ core and up to 20 MHz bus clock

        – Single cycle 32-bit x 32-bit multiplier

        – Single-cycle I/O access port

    3. Memory and memory interfaces

        – Flash memory up to 64 KB

        – EEPROM up to 256 B

        – Up to 4 KB RAM

    4. Bell

        – Oscillator (OSC) - supports 32.768 kHz crystal or 4 MHz to 20 MHz crystal or ceramic resonator; select Low power or high gain oscillator

        – Internal Clock Source (ICS) - Internal FLL Internal or external reference, 31.25 kHz prescaled internal reference for 40 MHz systems and core clock.

        – Internal 1 kHz Low Power Oscillator (LPO)

    5. System peripherals

        – Power Management Module (PMC) with three power supplies Modes: run, wait, stop

        – Low Voltage Detection (LVD) with reset or interrupt, Alternative itinerary

        – Watchdog (WDOG) with independent clock source

        – Programmable cyclic redundancy check module (CRC)

        – Serial Wire Debug Interface (SWD)

        – Bit Manipulation Engine (BME)

    6. Security and Integrity Module

        – 64-bit unique identification (ID) number for each chip

    7. Human-Machine Interface

        – Up to 57 general purpose input/output (GPIO)

        – Up to 22 General Purpose Input/Output (GPIO)

        – Up to 14 General Purpose Input/Output (GPIO)

        – Two keyboard interrupt modules (KBI) up to 8 bits

        – External Interrupt (IRQ)

    8. Analog module

        – One 12-bit SAR ADC, up to 16 channels, in Stop mode, optional hardware trigger (ADC)

        – Two analog comparators including a 6-bit DAC and programmable reference input (ACMP)

    9. Timer

        – One 6-channel FlexTimer/PWM (FTM)

        – Two 2-channel FlexTimer/PWM (FTM)

        – A 2-channel Periodic Interrupt Timer (PIT)

        – Real Time Clock (RTC)

  10. Communication Interface

        – Two SPI modules (SPI)

        – Up to three UART modules (UART)

        – One I2C module (I2C)

  11. Package options

        – 64-pin LQFP

        – 32-pin LQFP

2. Electromagnetic Compatibility

Electromagnetic compatibility (EMC) performance is highly dependent on The environment where the MCU is located. Board Design and Layout, Circuit Topology Selection, location and characteristics of external components and MCU software Operation plays an important role in EMC performance.

3. Thermal characteristics

For operating temperature range, power dissipation, and package thermal resistance. Power consumption on I/O pins is generally small Power consumption in on-chip logic and voltage regulator circuits, which is determined by the user and not controlled by the MCU design. Taking PI/O into account for power calculations, determine the difference between the actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. The difference between pin voltage and VSS or VDD can be large unless under abnormally high pin current (heavy load) small.


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