1963856-2 Allicdata Electronics
Allicdata Part #:

1963856-2-ND

Manufacturer Part#:

1963856-2

Price: $ 89.22
Product Category:

Fans, Thermal Management

Manufacturer: TE Connectivity AMP Connectors
Short Description: CFP HS KIT STS AIRFLOW, 22 FIN,
More Detail: Heat Sink
DataSheet: 1963856-2 datasheet1963856-2 Datasheet/PDF
Quantity: 1000
25 +: $ 80.30260
Stock 1000Can Ship Immediately
$ 89.22
Specifications
Series: *
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks, specifically the 1963856-2 model, is an invaluable piece of engineering technology when it comes to cooling or more accurately, the controlled management of temperatures. A heat sink can move, absorb, and dissipate heat from a component or device. By efficiently dissipating thermal energy generated by electronic components, heat sinks protect them from abnormal temperatures that may destroy programmed parameters or disable the components altogether.

How do they work?

The 1963856-2 heat sink works by taking advantage of the physical processes of thermal dynamics. Heat sinks essentially rely on two processes - conduction and convection - to cool electronic components and devices. The heat sink itself is made up of a high-grade aluminum component attached to numerous thin metal vanes through which air circulates freely. As the fan powered heat sink utilizes what\'s called forced convection, which improves the rate of heat transfer.

Heat sinks usually rely on more than one method of cooling to dissipate thermal energy. The 1963856-2, for example, employs both conduction and convection. Heat is conducted away from a component and transferred to the fins of the heat sink that sit in direct contact with the metal conductors - or the sides of the heat sink itself. Then, the fans push ambient air over the surface of the heat sink, which causes cavities of lower-pressure air to form. The process of convection occurs as the high-pressure ambient air pushes against the cavity of lower-pressure air, allowing for cooler air to flow through and over the heat sink.

1963856-2 Application Field

The 1963856-2 thermal heat sink is used in all sorts of different applications requiring heat transfer. It\'s often used in computers, video gaming systems, and other electronic devices either as a cooling device directly attached to a component or to reduce temperatures of an area filled with electronic equipment. It’s been designed for both consumer and commercial use, has a low cost, and yet is still very efficient at what it does.

The 1963856-2 is the perfect heat sink for small areas as it takes up very little space, but is still powerful enough to dissipate any amount of heat within its range. For example, it works well with electronic components such as CPU\'s, GPUs, and processors that generate high amounts of thermal energy and therefore require efficient thermal management. But, it’s also used in applications that require slower but sustained releases of heat energy such as small scale communications technologies and network devices.

Conclusion

The 1963856-2 is a great piece of technology whether it’s used for commercial or consumer purposes. It provides a cost-effective and efficient way to dissipate heat in order to protect devices and components from suffering from elevated temperatures. The added benefits of taking up minimal space and easily being installed makes the 1963856-2 thermal heat sink a fine option for cooling down components.

The specific data is subject to PDF, and the above content is for reference

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