DRV5033AJQDBZR Sensors, Transducers

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1. Description

The DRV5033AJQDBZR device is a chopper-stabilized Hall Effect Sensor that offers a magnetic sensing solution with superior sensitivity stability over temperature and integrated protection features. The DRV5033 responds the same to both polarities of magnetic field direction. When the applied magnetic flux density exceeds the BOP threshold, the DRV5033 open-drain output goes low. The output stays low until the field decreases to less than BRP, and then the output goes to high impedance. The output current sink capability is 30 mA. A wide operating voltage range from 2.5 to 38 V with reverse polarity protection up to –22 V makes the device suitable for a wide range of industrial applications. Internal protection functions are provided for reverse supply conditions, load dump, and output short circuit or over current.

2. Features

    1. Digital Omnipolar-Switch Hall Sensor

    2. Superior Temperature Stability

        – BOP ±10% Over Temperature

    3. Multiple Sensitivity Options (BOP / BRP):

        – ±3.5 / ±2 mT (FA, see Device Nomenclature)

        – ±6.9 / ±3.5 mT (AJ, see Device Nomenclature)

    4. Detects North and South Magnetic Field

    5. Supports a Wide Voltage Range

        – 2.5 to 38 V

        – No External Regulator Required

    6. Wide Operating Temperature Range

        – TA = –40 to 125°C (Q, see Device Nomenclature)

    7. Open Drain Output (30-mA Sink)

    8. Fast 35-µs Power-On Time

    9. Small Package and Footprint

        – Surface Mount 3-Pin SOT-23 (DBZ)

        – 2.92 mm × 2.37 mm

        – Through-Hole 3-Pin TO-92 (LPG)

        – 4.00 mm × 3.15 mm

  10. Protection Features

        – Reverse Supply Protection (up to –22 V)

        – Supports up to 40-V Load Dump

        – Output Short-Circuit Protection

        – Output Current Limitation

3. Applications

     1. Docking Detection

    2. Door Open and Close Detection

    3. Proximity Sensing

    4. Valve Positioning

    5. Pulse Counting

4. Pin Configuration

5. PACKAGE OUTLINE