GD25Q127CZIGY Allicdata Electronics
Allicdata Part #:

GD25Q127CZIGY-ND

Manufacturer Part#:

GD25Q127CZIGY

Price: $ 1.13
Product Category:

Integrated Circuits (ICs)

Manufacturer: GigaDevice Semiconductor (HK) Limited
Short Description: NOR FLASH
More Detail: FLASH - NOR Memory IC 128Mb (16M x 8) SPI - Quad I...
DataSheet: GD25Q127CZIGY datasheetGD25Q127CZIGY Datasheet/PDF
Quantity: 1000
4800 +: $ 1.03285
Stock 1000Can Ship Immediately
$ 1.13
Specifications
Series: --
Packaging: Tray 
Part Status: Active
Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - NOR
Memory Size: 128Mb (16M x 8)
Clock Frequency: 104MHz
Write Cycle Time - Word, Page: 12µs, 2.4ms
Memory Interface: SPI - Quad I/O
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Description

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GD25Q127CZIGY is a single chip Flash Memory device specially designed to replace conventional Flash memory devices, including parallel-connected Flash memory devices. As a single chip Flash Memory device, GD25Q127CZIGY is widely used in many applications, such as FPGA configuration, EPROM and EAROM replacement, Data flash, and embedded Flash memory applications.

The GD25Q127CZIGY device is an advanced Flash Memory solution for the world\'s highest density applications. It features a wide operating voltage range (1.7V to 1.95V) and a large memory capacity (128Mbit, 8MByte). It combines many benefits, including high-endurance, low-power consumption, secure operation, and fast, reliable write/erase performance, making it suitable for a variety of applications.

The GD25Q127CZIGY device uses the same advanced non-volatile process as other Flash Memory chips, making it highly reliable, durable and cost-effective. In addition, the device supports a wide temperature range (–40°C through +125°C). The device operates with a single or double data rate with read/program speeds up to 133MHz/133MHz.

The GD25Q127CZIGY device also features an industry-leading combination of advanced features, including On-the-Fly programming, serial access mode, DualSPI and QuadSPI, advanced protection features, and secure read/write features. These features make the device suitable for a broad range of applications, from small, portable consumer electronics to large industrial and automotive systems.

The working principle of GD25Q127CZIGY can be summarized as follows. The device is built with a low-power CMOS process technology, in which the internal components are organized in an array of 16,384 cells. Each cell consists of an N-channel MOSFET with its gate connected to an erasing window through which electrons can be injected into the cell. A voltage pulse is applied to the gate of the cell, inducing a current through the cell which causes electrons to be injected into the cell.

The electrons in the cell will accumulate if the cell is in the erased state, and form the stored data. When the electrons are applied to the cells the voltage on the gate is changed, which changes the current through the cells and the stored electrons are drained from the cells. By doing this the stored data can be programmed (or erased).

The GD25Q127CZIGY device supports a wide range of application fields, such as data flash, FPGA configuration, EPROM and EAROM replacement, embedded Flash memory applications, and secure data storage. In addition, the device can be used for non-volatile data storage and code storage. The device is also ideal for embedded applications. It supports a wide temperature range, on-the-fly programming and data read/write speeds up to 133MHz/133MHz.

In summary, the GD25Q127CZIGY device is a highly advanced single chip Flash Memory solution for high density applications. It offers low power consumption, fast, reliable write/erase performance, and secure data storage. It can be used for a variety of embedded applications and its features make it highly suitable for consumer electronics, industrial and automotive applications.

The specific data is subject to PDF, and the above content is for reference

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