IS61QDB22M18-250M3 Allicdata Electronics
Allicdata Part #:

IS61QDB22M18-250M3-ND

Manufacturer Part#:

IS61QDB22M18-250M3

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: ISSI, Integrated Silicon Solution Inc
Short Description: IC SRAM 36M PARALLEL 165LFBGA
More Detail: SRAM - Synchronous, QUAD Memory IC 36Mb (2M x 18) ...
DataSheet: IS61QDB22M18-250M3 datasheetIS61QDB22M18-250M3 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tray 
Part Status: Discontinued at Digi-Key
Memory Type: Volatile
Memory Format: SRAM
Technology: SRAM - Synchronous, QUAD
Memory Size: 36Mb (2M x 18)
Clock Frequency: 250MHz
Write Cycle Time - Word, Page: --
Access Time: 7.5ns
Memory Interface: Parallel
Voltage - Supply: 1.71 V ~ 1.89 V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 165-LBGA
Supplier Device Package: 165-LFBGA (15x17)
Description

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Memory Application Field and Working Principle of IS61QDB22M18-250M3

Memory is an essential component of any digital system, and IS61QDB22M18-250M3 memory is no exception. Although its application field varies, the technology at the heart of this particular memory module remains the same. In this article, we will delve into the application field and working principle of IS61QDB22M18-250M3 memory.

Application Field of IS61QDB22M18-250M3 Memory

IS61QDB22M18-250M3 memory is primarily used in embedded systems that require large amounts of non-volatile storage. It is especially popular in the automotive industry, where the technology is used in a variety of vehicles, ranging from passenger cars and trucks to heavy-duty industrial machinery. The memory can also be used in medical imaging devices and high-end audio products. Due to its speed and efficiency, as well as its small form factor, IS61QDB22M18-250M3 memory is an excellent choice for power-saving devices that require quick and reliable operation.

Working Principle of IS61QDB22M18-250M3 Memory

The IS61QDB22M18-250M3 memory module is based on Ferroelectric RAM (FRAM) technology. This type of memory consists of a special type of non-volatile cells composed of a metal-oxide-semiconductor structure that is permanently charged by an electrode. The stored data is retained even when power is not present.

The memory module contains multiple FRAM cells laid out in a grid. The cells are connected to pins that allow the cells to be read and written by a controller. When power is applied to the pins, a voltage is applied to the cells, allowing data to be written to or read from the cells. The exact voltage applied will depend on the type of data being written. For example, a \'1\' is written by applying a higher voltage to the cells than for a \'0\'.

The IS61QDB22M18-250M3 memory module is highly efficient, as it does not require a refreshing process in order to retain its data. In addition, the module is also capable of enduring a wide range of temperatures and is resistant to electromagnetic interference. As a result, it is an ideal solution for applications where reliable data storage is a must.

Conclusion

IS61QDB22M18-250M3 memory is a high-performance, efficient, and reliable solution for applications that demand high-density non-volatile storage. The technology at the heart of this memory module, Ferroelectric RAM, allows for quick reads and writes without the need for a refresh cycle. In addition, the module is highly resistant to both temperature and electromagnetic interference, making it an ideal choice for many types of embedded systems. This article has examined the application field and working principle of IS61QDB22M18-250M3 memory.

The specific data is subject to PDF, and the above content is for reference

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