MT29F128G08CBECBL95B3WC1-R

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

In the world of memory, the MT29F128G08CBECBL95B3WC1-R holds a unique place. This is an 8-Gigabit (1 Gb = 1 billion bytes) Multi-Chip Package (MCP) manufactured by Micron Technology, Inc. The chip houses a single monolithic NAND Flash memory die and a single Control die, both embedded in a 13x17 mm, 118-ball FBGA package. It is composed of two dies, representing two stages of complexity. It is often referred to as a two-die device, containing the memory and control die, which are connected together. It offers a variety of features and is aimed at digital storage and data integrity in the Consumer and Embedded markets.

Application Field

The internal design of this two-die device simplifies the manufacturing process by providing all of the components onto a single, small-form-factor package. This minimizes board space and reduces manufacturing costs, while still providing the performance required to address the application field. The 8-Gigabit MCP, offers a cost-effective, high-performance solution for embedded, security and consumer applications — and provides a platform that is easy to customize to fit the individual needs of the end user.

The 8G MCP is a high-performance device suited for use in many applications. The NAND Flash memory can be used as removable storage in audio, video, and photography applications. It is also used in applications such as cellular phones, digital cameras, MP3 players, and other digital devices. The device also provides the solution for system agility, allowing storage capacity to be increased over time to fit the individual needs of the user.

The device can also be used in real-time protection solutions, such as data protection and authentication, where data integrity is essential. The two-chip design simplifies integration, reducing the cost associated with software development. Its robust design increases reliability over conventional single-die solutions, making it ideal for use in stringent memory applications, such as automotive systems and industrial automation.

Working Principle

The key component of the 8-Gigabit MCP is the NAND Flash memory. This is an array of memory cells, arranged in blocks and planes on the memory die. The data is able to be stored in each cell as an electrical charge, which allows for low power consumption while still providing fast data access. The device also includes a Non-Volatile Memory (NVM) cell, powered by a separate supply, which provides improved data retention. This non-volatile memory cell can be programmed once and used for a variety of storage applications, allowing for data to be stored for prolonged periods of time.

The 8G MCP device also includes the Control die, which provides the interface between the NAND Flash and the system\'s host controller. This die contains a set of commands and instructions that manage the reading and writing of data, as well as a variety of features such as error coding, wear-leveling, and ECC. The device uses an industry-standard SPI protocol to access the memory. This interface allows for the embedded system to communicate with the device and the NAND Flash, allowing for the storage and retrieval of data.

The write circuit on the device is designed to protect the memory from unintentional write events, guarding against data corruption. The write circuit also helps to extend the life of the memory by enabling data to be written without heated stresses on the parts. The device also supports reliable programming, allowing data to be written with high accuracy.

The 8G MCP also comes with included security features, such as password locking and strong encrypted data. Encrypted data is stored in the NVM cell and is only accessible to authorized individuals. It also offers advanced error correcting capabilities, through which data stored on the device can be protected against corruption, and the device will alert the system to any errors that are detected.

The 8G MCP device is a significant asset to digital storage and data integrity applications. It offers a unique combination of features at a competitive price point, making it a powerful solution for many types of embedded and consumer applications. The reduced number of components in the package allows for easier integration, while the advanced features such as error-correcting and encryption, ensure data reliability and security.

The specific data is subject to PDF, and the above content is for reference