Allicdata Part #: | MT29F1G08ABBDAH4-ITE:D-ND |
Manufacturer Part#: |
MT29F1G08ABBDAH4-ITE:D |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Micron Technology Inc. |
Short Description: | IC FLASH 1G PARALLEL 63VFBGA |
More Detail: | FLASH - NAND Memory IC 1Gb (128M x 8) Parallel |
DataSheet: | MT29F1G08ABBDAH4-ITE:D Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | -- |
Part Status: | Obsolete |
Memory Type: | Non-Volatile |
Memory Format: | FLASH |
Technology: | FLASH - NAND |
Memory Size: | 1Gb (128M x 8) |
Write Cycle Time - Word, Page: | -- |
Memory Interface: | Parallel |
Voltage - Supply: | 1.7 V ~ 1.95 V |
Operating Temperature: | -40°C ~ 85°C (TA) |
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Memory
Dynamic Random Access Memory (DRAM) is a type of semiconductor memory employed in a wide variety of applications. It utilizes an integrated circuit design containing an array of flip flop cells made up of transistors and capacitors to store data on a volatile basis. One example of DRAM technology is the MT29F1G08ABBDAH4-ITE:D, a 16Gigabit device that incorporates advanced memory and low power consumption.
The MT29F1G08ABBDAH4-ITE:D offers a reliable storage solution with a high endurance factor and performance levels that are tailored to customer needs. One of its most common uses is in the field of consumer electronics, such as in gaming consoles and smart phones. This memory is an ideal solution for applications requiring high performance, long service life and low power consumption. With features such as a fast write speed and triple data rate (TDR) technology, the MT29F1G08ABBDAH4-ITE:D can provide highly efficient data storage for these types of applications.
The working principle of the MT29F1G08ABBDAH4-ITE:D is that it operates with an internal array of memory cells. Each cell, or bit, is comprised of a single transistor and a capacitor. The data contained by each bit can be either stored or read by either charging or discharging the cells using the electrical current applied to the device. When the charge of the capacitor is greater than the threshold voltage applied, a logic “1” is stored in the cell, and when the charge is lower, a logic “0” is stored in the cell.
In order to allow for fast read/write speeds, the MT29F1G08ABBDAH4-ITE:D incorporates an advanced data control system that incorporates TDR technology. This technology allows the device to quickly detect data stored within the memory cells, enabling faster read/write operations. Additionally, the device’s internal design also makes use of a redundant column architecture which provides higher efficiency and robust data performance.
The MT29F1G08ABBDAH4-ITE:D also utilizes a highly efficient power management system to reduce the power consumption of the device. By utilizing two voltage regulators, one for the control logic and the other for the row array, the device dynamically manages power needs for optimal power efficiency. This feature helps to extend battery life in mobile devices that utilize this memory device, as well as reduce the energy requirements of other applications that use this device.
The MT29F1G08ABBDAH4-ITE:D’s integrated circuit design, along with its advanced data control system and power management system, makes it a desirable choice for numerous applications that require high reliability, performance, and power efficiency. From gaming consoles and smart phones, to servers and laptops, this device can provide users with the stable and consistent storage capabilities that are essential for a variety of digital tasks.
The specific data is subject to PDF, and the above content is for reference
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