MT29RZ2B1DZZHGWD-18I.83G Allicdata Electronics
Allicdata Part #:

MT29RZ2B1DZZHGWD-18I.83G-ND

Manufacturer Part#:

MT29RZ2B1DZZHGWD-18I.83G

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Micron Technology Inc.
Short Description: IC FLASH RAM 2G PARALLEL 533MHZ
More Detail: FLASH - NAND, DRAM - LPDDR2 Memory IC 2Gb (256M x ...
DataSheet: MT29RZ2B1DZZHGWD-18I.83G datasheetMT29RZ2B1DZZHGWD-18I.83G Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Part Status: Last Time Buy
Memory Type: Non-Volatile
Memory Format: FLASH, RAM
Technology: FLASH - NAND, DRAM - LPDDR2
Memory Size: 2Gb (256M x 8)(NAND), 1G (32M x 32)(LPDDR2)
Clock Frequency: 533MHz
Write Cycle Time - Word, Page: --
Memory Interface: Parallel
Voltage - Supply: 1.8V
Operating Temperature: -40°C ~ 85°C (TA)
Description

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Memory is ubiquitous in all electronic applications today. The storage capacity of memory is amazing – one single memory device today holds hundreds or even thousands of times more data than a single device that did a decade ago. The MT29RZ2B1DZZHGWD-18I.83G memory belongs to the family of components known as Micron (formerly Crucial) SDRAM, which is a type of Dynamic Random Access Memory (DRAM). It is a type of semiconductor memory capable of great speeds, low latency, and tremendous amounts of data storage.

MT29RZ2B1DZZHGWD-18I.83G memory has the capability of speeds up to 18 Gbps. It is capable of up to 2133MT / s of data rate on a 64-bit bus, which is double the rate of the prior DDR3 memory technology. It can power down very quickly when not in use, allowing it to have a very low power consumption. It also has a self-refreshing mode, which enables it to perform continuous refreshes while operating at a much lower frequency. This memory is also very well known for its high endurance and high-temperature operation.

The MT29RZ2B1DZZHGWD-18I.83G memory is ideal for applications that require quick access to data with minimal latency, such as gaming, server applications, data streaming, and high-performance embedded applications. This memory can be used in desktops, notebooks, servers, and workstations, as well as in embedded systems such as robotics and industrial control. It has features such as Error-Correcting Code (ECC), Partial Array Self-Refresh (PASR), and high-performance interrupt handling. It also supports a variety of memory operations, such as read, write, and refresh.

The working principle of the MT29RZ2B1DZZHGWD-18I.83G SDRAM is a variation of the technique known as dynamic random access memory (DRAM). This type of memory is based on a matrix of switches or transistors connected by a shared row and column conductors. The DRAM constantly monitors the state of these cells, or switches, and destroys their current state if it changes, requiring data to be written again. This means that data is read and written very quickly, and the entire process can be done within nanoseconds.

The DRAM operates by storing different states of data in a regular pattern across the memory array. When the memory needs to be accessed, the corresponding address of the desired data is sent to the controller. This address is then decoded, and the correct row and column of the memory cells are activated. The row and/or column then reveals the data stored in the memory cells. The controller can then initialize the memory and send back the requested data to the processor.

The main advantage of the MT29RZ2B1DZZHGWD-18I.83G SDRAM is its excellent power efficiency, speed, and data storage capacity. In addition, its low operational latency, high temperature operation and high endurance makes it ideal for embedded applications such as robotics and industrial control, or workstations and servers with high data throughput demand. Its ability to self-refresh also makes it an ideal choice for consumer electronics and gaming applications that require low latency and minimal power consumption.

The specific data is subject to PDF, and the above content is for reference

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