SIP050-1X15-160BLF Allicdata Electronics
Allicdata Part #:

SIP050-1X15-160BLF-ND

Manufacturer Part#:

SIP050-1X15-160BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 15POS GOLD
More Detail: N/A
DataSheet: SIP050-1X15-160BLF datasheetSIP050-1X15-160BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Features: Closed Frame
Contact Resistance: --
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.095" (2.41mm)
Operating Temperature: --
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: SIP050-1x
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 15 (1 x 15)
Type: SIP
Part Status: Obsolete
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

SIP050-1X15-160BLF is a socket designed for discrete integrated circuit (IC) and transistor applications. It provides a stable electrical interface between the surface-mounted device package and the printed circuit board. This socket is designed to meet reliable performance requirements in a wide range of high-density applications.

Features

SIP050-1X15-160BLF sockets can support up to 10GHz performance and feature high accuracy and repeatability across multiple insertions. The four positions provide stress relief capability for any one site without affecting the performance of the other locations. The socket is designed to be polarization-keyed and compliant with IEC 61000-4-2 static discharge requirements. The socket also includes an optional guard band feature that provides an additional measure of protection against EMI/RFI.

Material and Structure

SIP050-1X15-160BLF sockets are made of thermoplastic and LCP materials, which are suited for higher performing applications such as ultra low-voltage, high current DC and AC drives. The sockets are designed with a low profile making them suitable for high-density board layout requirements. The socket includes a high-contact-pressure spring-loaded contact system offering secure, reliable contact for low-pin-count applications.

Working Principle

The SIP050-1X15-160BLF socket works on the same principle as a traditional socket. The surface-mount IC or transistor is placed into the socket, making contact with the metal contact pads. These metal contact pads establish an electrical connection between the IC or transistor and the printed circuit board. This connection allows signals to pass between the IC/transistor and the board, providing the necessary electrical functionality.

Application Field

SIP050-1X15-160BLF sockets are well suited for applications requiring high performance, low-profile, high-density ICs and transistors. It is suitable for a wide range of applications in consumer electronics, computers, automotive, medical, and communication system designs. It can also be used in instrumentation and process control applications where signals need to be kept secure and reliable.

The specific data is subject to PDF, and the above content is for reference

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