SIP050-1X04-157BLF Allicdata Electronics
Allicdata Part #:

SIP050-1X04-157BLF-ND

Manufacturer Part#:

SIP050-1X04-157BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 4POS TIN
More Detail: N/A
DataSheet: SIP050-1X04-157BLF datasheetSIP050-1X04-157BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Features: Closed Frame
Contact Resistance: --
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.095" (2.41mm)
Operating Temperature: --
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: SIP050-1x
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 4 (1 x 4)
Type: SIP
Part Status: Obsolete
Packaging: Bulk 
Description

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SIP050-1X04-157BLF is a type of socket intended for use with integrated circuits (ICs), transistors, and other types of semiconductor components. It is designed for surface-mount applications, and is intended for use with components that require a 0.050 inch spacing. It mounts onto a circuit board with 0.063 inch mounting holes. The socket is constructed from a thermally conductive, high-impact polymer plastic, and is resistant to environmental stress.

The SIP050-1X04-157BLF socket features four sockets for electrical connections, which provide connections to the IC, transistor, or other semiconductor components that it supports. The sockets are designed to fit the 0.050 inch pins of the components, and are electrically isolated from each other. The socket also includes two locating pins that ensure proper positioning of the device on the circuit board.

When used in an application, the SIP050-1X04-157BLF socket must be soldered to the circuit board and its leads must be connected to the appropriate circuit board terminals. The sockets then provide an electrical connection between the IC and the circuit board, as well as providing a solder join. This ensures that the component is firmly and securely attached to the circuit board.

The socket also helps to reduce the amount of heat generated by the IC during operation, as the thermally conductive material helps to dissipate the heat. This helps to improve the reliability of the IC and ensures it operates at optimum performance levels. As the socket also provides isolation between the IC and the circuit board, it helps to reduce the amount of noise generated by the IC.

The SIP050-1X04-157BLF socket is suitable for soldering and has a number of advantages over traditional socket designs. It is easier to mount onto the circuit board, and due to its heat dissipation properties, it ensures better performance from the IC. Additionally, the socket is more durable than other sockets, and its space-saving design makes it ideal for use in low-profile designs.

In summary, the SIP050-1X04-157BLF socket is an ideal solution for connecting integrated circuits (ICs), transistors, and other types of semiconductor components to a circuit board. It is designed for surface-mount applications, and is resistant to environmental stress. The socket provides a secure connection, helps with heat dissipation, and provides electrical isolation from the circuit board. Additionally, its design is space-saving, making it ideal for use in low-profile applications.

The specific data is subject to PDF, and the above content is for reference

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