SIP050-1X26-157BLF Allicdata Electronics
Allicdata Part #:

SIP050-1X26-157BLF-ND

Manufacturer Part#:

SIP050-1X26-157BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 26POS TIN
More Detail: N/A
DataSheet: SIP050-1X26-157BLF datasheetSIP050-1X26-157BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: SIP050-1x
Packaging: Bulk 
Part Status: Obsolete
Type: SIP
Number of Positions or Pins (Grid): 26 (1 x 26)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: --
Termination Post Length: 0.095" (2.41mm)
Material Flammability Rating: UL94 V-0
Contact Resistance: --
Description

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Sockets for ICs, Transistors, are an important part of modern electronic hardware. The SIP050-1X26-157BLF is an example of one such socket, designed for easy integration into increasingly complex circuit boards. In this article, the application field and working principle of the SIP050-1X26-157BLF will be explained.

The SIP050-1X26-157BLF is a surface-mount (SMT) socket designed for use with a wide array of ICs. It is a single-row, 26-position socket, meaning that it can accept up to 26 leads at its base. The package is relatively compact, making it ideal for applications requiring high-density sockets in compact spaces. The 150-mil spacing between its grids ensures that most ICs can fit into the socket snugly.

The SIP050-1X26-157BLF has a number of features that make it desirable for many applications. First, the package design has a series of large "fingers" that allow for easy insertion and removal of ICs and transistors into the socket. This saves time and energy during the prototyping and debugging phases of a project. Second, the socket has a high contact force, which ensures that the connections are strong and secure. This reduces the chance of failure during operation.

The SIP050-1X26-157BLF is also designed to reduce crosstalk and signal degradation, which can be a major concern when dealing with small signal ICs. It does this by having multiple surfaces with different heights, which helps to disrupt EMI from entering the circuit. Finally, the socket is designed to dissipate heat quickly, making it ideal for applications that generate a large amount of heat.

The SIP050-1X26-157BLF is an incredibly versatile socket, and as such, it has a wide range of potential applications. It can be used as an adapter for microcontrollers, allowing them to be integrated into existing circuits. It can also be used in robotics and automation equipment, where its high contact force and heat dissipation abilities can offer a major advantage. Another potential application is in home appliances, where the socket\'s shock and vibration resistance can be beneficial.

In terms of its working principle, the SIP050-1X26-157BLF is relatively straightforward. It uses a contact force-pin array to ensure electrical contact between the socket and the IC. When a pin is inserted into the socket, a spring loaded contact force-pin presses against the pin, establishing a secure electrical connection. This principle is what allows the socket to provide a reliable and robust connection.

The SIP050-1X26-157BLF is an incredibly useful socket, offering a high level of functionality and performance. Its wide range of potential applications and its simple yet reliable working principle make it an ideal choice for many projects. As such, it is an invaluable asset in the world of electronics, and its importance is only likely to grow in the future.

The specific data is subject to PDF, and the above content is for reference

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