SIP050-1X29-160BLF

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The SIP050-1X29-160BLF is part of the sockets for ICs, transistors product line. Sockets for ICs and transistors are special high-density pin grid array (PGA) packages that are used to securely and reliably mount a variety of integrated circuits (ICs) and transistors to printed circuit boards. The SIP050-1X29-160BLF features an adjustable accuracy of 0.45mm to equalize the pin positions both in the x- and y-axes, providing reliable and repeatable contact forces on the integrated component without excessive mechanical stress. With this socket package, ICs of up to 29 pins can be replaced with ease and no soldering is required.

The SIP050-1X29-160BLF is suitable for applications in many different industries due to its proven capabilities and reliable design. Examples include medical and processing equipment, satellite communication systems, and personal communication devices. The SIP050-1X29-160BLF is well-suited to applications that require a compact design with high contact reliability.

The SIP050-1X29-160BLF is an adjustable pin grid array socket that can be used to mount various ICs and transistors. It has a grid of 29 by 50 pins and is designed to fit in a 0.5 inch space. The pins are adjustable so that integrated components can be securely and consistently mounted without excessive mechanical stress on the components. The pins are adjustable both in the x- and y-axes with an accuracy of 0.45mm.

The SIP050-1X29-160BLF is designed with a spring-loaded socket which ensures a reliable connection with minimal stress on the ICs and transistors. The inner dimensions of the socket are designed to securely hold ICs and transistors with up to 29 pins. The outer dimensions of the socket ensure that it can fit into tight spaces. The socket is designed to withstand a wide range of temperatures, making it suitable for use in a variety of environments.

The SIP050-1X29-160BLF also features a high-temperature resistant insulation body which prevents damage to the pins and ICs. The insulation body also helps to minimize thermal degradation of the socket package and is designed to maintain its contact reliability even in harsh environments.

The SIP050-1X29-160BLF is designed with an EMI shield to eliminate the risk of interference with other electrical components. The shield helps to reduce radio frequency interference (RFI) into and out of the socket, and it helps protect the socket and its components from the effects of high-intensity magnetic fields.

Overall, the SIP050-1X29-160BLF is an essential component for a wide range of applications due to its remarkable design and high performance. Its adjustable accuracy, compact size, and EMI shielding make it an ideal choice for mounting ICs and transistors in space-constrained environments where reliability is essential. The SIP050-1X29-160BLF can also help reduce the time and cost associated with replacing or upgrading ICs, making it a great cost-saving option for many applications.

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