SIP050-1X29-157BLF Allicdata Electronics
Allicdata Part #:

SIP050-1X29-157BLF-ND

Manufacturer Part#:

SIP050-1X29-157BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 29POS TIN
More Detail: N/A
DataSheet: SIP050-1X29-157BLF datasheetSIP050-1X29-157BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: SIP050-1x
Packaging: Bulk 
Part Status: Obsolete
Type: SIP
Number of Positions or Pins (Grid): 29 (1 x 29)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: --
Termination Post Length: 0.095" (2.41mm)
Material Flammability Rating: UL94 V-0
Contact Resistance: --
Description

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SIP050-1X29-157BLF can be classified as sockets for ICs, transistors that are used for electronic components. This socket enables the user to mount the device in the application with no soldering required. Designed to support a wide range of standard ICs, the SIP050-1X29-157BLF delivers electrical and mechanical reliability through its durable plastic case and phosphor bronze contacts. The built-in PCB orientation safety feature helps protect the socket and its components against damage from misalignment. With the right selection of various accessories, a high quality product can be achieved.

The application fields of the SIP050-1X29-157BLF encompass a wide range of industries with a variety of electronic components. A few examples are consumer electronics, communication devices, computer, automotive and medical. Depending on the specific requirements of the customer, the socket can be assembled for prototyping to full production. The capability to customize is also important for some higher-end applications that require the designed-in features specific to their market standards. This socket is also suitable for both through-hole and surface mount installation.

The working principle of the SIP050-1X29-157BLF starts with the user inserting the component into the socket. Through the application of force, the component will be securely held in place by the metal tabs of the socket. With its rugged construction, the socket is designed to keep the component secure and prevent it from breaking while in use. The contacts of the socket will then connect the component to the circuit board, allowing a successful connection. Through this connection, power from the circuit board will power the component, allowing it to be functional.

SIP050-1X29-157BLF provides a secure, reliable and cost-effective method for mounting ICs and transistors. With its rugged construction and variation of accessories, this socket is compatible with different types of circuits. Whether it is a prototyping or a production application, this socket provides an easy and economical method for connecting and powering ICs and transistors.

The specific data is subject to PDF, and the above content is for reference

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