SIP050-1X22-157BLF Allicdata Electronics
Allicdata Part #:

SIP050-1X22-157BLF-ND

Manufacturer Part#:

SIP050-1X22-157BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 22POS TIN
More Detail: N/A
DataSheet: SIP050-1X22-157BLF datasheetSIP050-1X22-157BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: SIP050-1x
Packaging: Bulk 
Part Status: Obsolete
Type: SIP
Number of Positions or Pins (Grid): 22 (1 x 22)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: --
Termination Post Length: 0.095" (2.41mm)
Material Flammability Rating: UL94 V-0
Contact Resistance: --
Description

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The SIP050-1X22-157BLF socket is a device designed for ICs, transistors, and discrete components. It is a surface mount device that is very versatile and is easy to use. The socket is designed to provide electrical isolation and secure contact between the component and the board. It is made up of a substrate, dielectric insulation and the contact pads. The device is highly reliable and efficient in operation.

The SIP050-1X22-157BLF socket is capable of accommodating ICs, transistors, and other discrete components. It can handle up to a maximum of twenty-two pins. It has a dielectric insulation that is rated to withstand temperatures up to 100°C. It also has a contact resistance of up to 0.2 ohms. It is RoHS compliant and is UL listed.

The SIP050-1X22-157BLF socket is primarily used in applications where ICs, transistors, and other discrete components need to be securely connected to the board. It is widely used in industrial and consumer electronics, medical and industrial systems, and automotive applications. It is also used for prototyping and testing of devices.

The working principle of the SIP050-1X22-157BLF socket is quite simple. The device consists of a layer of dielectric insulation between two metal contact pads. When the pins of a component are inserted into the device, the contact pads create a secure connection. This connection provides electrical isolation and ensures that the signal is securely transferred from the component to the board.

The SIP050-1X22-157BLF socket is a highly reliable device that is designed to provide a secure connection between ICs, transistors, and other discrete components and the board. It has excellent electrical insulation properties and is certified for use in various applications. It is also easy to use and can be used for prototyping and testing of devices.

The specific data is subject to PDF, and the above content is for reference

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