SIP050-1X18-157BLF Allicdata Electronics
Allicdata Part #:

SIP050-1X18-157BLF-ND

Manufacturer Part#:

SIP050-1X18-157BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 18POS TIN
More Detail: N/A
DataSheet: SIP050-1X18-157BLF datasheetSIP050-1X18-157BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: SIP050-1x
Packaging: Bulk 
Part Status: Obsolete
Type: SIP
Number of Positions or Pins (Grid): 18 (1 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: --
Termination Post Length: 0.095" (2.41mm)
Material Flammability Rating: UL94 V-0
Contact Resistance: --
Description

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Sockets for ICs, Transistors, and their many applications, can be divided into several categories. One such category is SIP050-1X18-157BLF. This socket is a newly-developed IC Socket for ICs, and is designed to support multiple chip-size ICs, e.g. DIP, SOP, and TSOP. It has eighteen pins and measures 5.08 mm in height, which gives it a high density compared to other alternatives, making it perfect for applications where space is a major consideration.

The SIP050-1X18-157BLF IC Socket is designed for use in a high-frequency digital-circuit environment, and it works by isolating high-frequency signals from other components. The pins are configured in an array that helps to ensure that no signal interference occurs with other signals in the system. Additionally, the socket has a double layer at the inner contact level that helps to keep the contact area clean and protected from abrasion. This ensures a longer lifespan and a better connection for any component that is plugged into the socket.

The SIP050-1X18-157BLF IC Socket can be used in a variety of applications, such as connections for integrated circuit manufacturers, printed circuit builders, communication equipment, cameras, and other devices. It can also be used for testing, insertion, and probing applications. Some of its uses include connecting integrated circuits to other devices, such as microprocessors, power inverters, and communication networks. It is also used to connect ICs to printed circuit boards. The socket can connect and disconnect signals at high speeds, and it has a low insertion force rating.

The SIP050-1X18-157BLF IC Socket functions thanks to a combination of mechanical and electrical characteristics. The socket contains a number of metal pins that make contact with the IC chip during insertion. The metal pins are arranged in several ways, depending on the application. Some devices use single-row pins, while others use a double-row configuration. Each pin also has different sizes, depending on the application.

The SIP050-1X18-157BLF IC Socket has several features that make it a great choice for many different applications. Its surface-mount design makes it easy to install and remove, and its low insertion force rating helps protect the components from damage when inserting or removing the IC chip. Additionally, the socket has a plated gold contacts on the pins that help ensure a reliable connection between the IC chip and the socket. This makes the connection stronger and more reliable, which leads to a better performance from the device.

The SIP050-1X18-157BLF IC Socket is an ideal choice for a variety of applications. It is designed to be a reliable, high-performance socket for any application that requires high-frequency data transfer. Its low insertion force rating helps to protect components from damage during installation and removal, and its plated gold contacts provide a strong and reliable connection. This socket is highly recommended for any application where space is a major consideration.

The specific data is subject to PDF, and the above content is for reference

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