Allicdata Part #: | AE11391-ND |
Manufacturer Part#: |
V2200N1 |
Price: | $ 0.51 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEATSINK CPU STAMPED |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | V2200N1 Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 0.46620 |
10 +: | $ 0.44226 |
25 +: | $ 0.42008 |
50 +: | $ 0.40912 |
100 +: | $ 0.40358 |
250 +: | $ 0.37593 |
500 +: | $ 0.35381 |
1000 +: | $ 0.32064 |
5000 +: | $ 0.30958 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Not Included) |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.512" (13.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum Alloy |
Material Finish: | Natural Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The V2200N1 is a thermal-heat sink application that can help provide optimal heat transfer solutions for various electronics products. The V2200N1 is ideal for use in environments which require high heat dissipation with a small footprint. The V2200N1 has been designed to increase thermal efficiency by reducing the impact of ambient temperature on thermal components. These thermal components are usually sensitive electronics devices such as microprocessors, memory modules, high performance graphics cards and other integrated circuits.
The V2200N1 is built with a bimetallic heat sink design that consists of an outer layer of aluminum alloy and an inner layer of copper. The aluminum alloy layer acts as an insulator and protection from corrosive elements in the environment, while the copper layer is responsible for conducting heat away from the electrical components. The heat conducted away from the electrical components is then dissipated into the ambient air through the convection process. The bimetallic structure also increases heat dissipation efficiency by reducing the amount of surface area that is required during heat transfer.
The V2200N1 also offers an integrated heat spreader which has been designed to provide a larger thermal contact area for improved stability and heat dissipation. This heat spreader is made from high grade silicon and can help to reduce the amount of heat that is generated by the electronics, while also mitigating the impact of long term exposure to high ambient temperatures. The heat spreader also has the ability to reduce noise emissions due to its heat dissipation properties.
The V2200N1 is a low cost heat sink application with high efficiency and optimal thermal performance. Due to its high performance and low cost it has been widely used in a variety of electronics applications. The V2200N1 is also designed to limit power consumption and lower overall temperatures, making it ideal for applications that require high heat transfer efficiency with minimal noise emission.
The V2200N1 is also designed to provide flexibility through its versatile mounting options. The V2200N1 can be mounted in various configurations to accommodate different spaces. Additionally, the V2200N1 is compatible with popular chip coolers and has an included two-step fastening system for quick and easy installation.
Overall, the V2200N1 is an ideal thermal-heat sink solution for electronics products due to its high heat transfer efficiency, low power consumption and versatility of mounting options. Additionally, the V2200N1 is relatively inexpensive, making it a cost-effective solution for those needing an affordable heat sink application.
The specific data is subject to PDF, and the above content is for reference
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