V2201N1

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are a great way to transfer heat away from delicate components and get it into the air, where it can dissipate quickly. The V2201N1 is a high-performance heatsink specifically designed to accommodate high-pin-density, low-power components. Its unique design allows it to maintain excellent thermal characteristics and superior thermal performance even when applied to high-power components and high-density ICs.

The V2201N1 is designed with specially-designed fins to ensure maximum surface area contact with the thermal environment, allowing for more efficient heat transfer and more precise thermal control. Its fin design also helps to reduce turbulence, which can increase thermal performance. With its low-profile design, the V2201N1 is able to fit in tight spaces without compromising performance.

In addition to its excellent thermal characteristics, the V2201N1 has several key features that make it suitable for a variety of applications. It is designed with an integrated copper base for better thermal conductivity, and it is also designed with an airtight sealing performance, allowing it to keep out dust and moisture. Its unique fin design also helps to improve cooling performance and minimize air resistance.

The V2201N1 is a great choice for applications involving high-performance components such as CPUs, GPUs, and chipsets. Its excellent thermal performance and low-profile design make it well suited for use in laptops, desktops, and other electronic devices. It is also well suited for cooling applications in consumer electronics and industrial equipment.

The V2201N1 works by using a combination of convection and conduction to transfer heat away from the hot components so that it can be dissipated into the ambient air. Its specially shaped fins act like a radiator, forcing air to move in a vertical direction and dissipate heat faster. Its airtight performance helps to minimize turbulence and creates higher airflow, allowing for better cooling and thermal performance.

The V2201N1 is also designed with an integrated copper base for better thermal conductivity. This helps to ensure that the hot components are efficiently dissipated away from the heatsink. The copper base also helps to reduce clearance requirements, which can make it easier to install and use in tight spaces.

To further improve its thermal performance and reduce its size, the V2201N1 also includes thermal pads to cover low-power components. The thermal pads help to further improve conduction and heat transfer away from the components, allowing for better overall cooling and superior thermal performance.

In summary, the V2201N1 is an excellent heatsink designed to provide superior thermal performance even in high-pin-density and high-power devices. Its unique fin design ensures maximum surface area contact with the thermal environment, and its airtight performance minimizes turbulence and increases airflow. It is also designed with an integrated copper base and thermal pads to further improve thermal conductivity and cooling. All of these features make the V2201N1 an ideal choice for a variety of applications, especially those involving high-performance components.

The specific data is subject to PDF, and the above content is for reference