V2201N1-F-LP

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Thermal - Heat Sinks offer a wide range of applications, and the V2201N1-F-LP is no exception. The V2201N1-F-LP is a passive heat sink designed for board level cooling, and is perfect for applications such as memory, I/O devices, and microprocessors. The V2201N1-F-LP utilizes a unique thermal design, which combines a combination of heatsinks and a fan, to effectively dissipate heat away from the system.

Thermal - Heat Sinks are designed to dissipate heat away from the system, and the V2201N1-F-LP utilizes a combination of heatsink fins and a fan for this purpose. The fan is designed to draw air away from the system, while the fins draw the heat away from the components and disperse it into the atmosphere. This combination is effective and efficient, as heat is quickly dissipated away from the system.

The design of the V2201N1-F-LP allows it to operate in a variety of temperatures, ranging from -40C to +85C. This wide temperature range makes it suitable for many applications, from industrial to consumer. The fan also offers a wide range of speeds to suit different system requirements.

The V2201N1-F-LP is a highly efficient heat sink, which utilizes aluminum fins and copper cores to efficiently dissipate heat away from the components. The fins of the V2201N1-F-LP are designed to effectively draw heat away from the components and disperse it into the atmosphere. The copper core offers superior thermal conductivity and heat dissipation.

The V2201N1-F-LP is an excellent solution for board level cooling. It is a passive heat sink that requires no active cooling, and is designed to effectively cool high-power components. The design of the V2201N1-F-LP is optimized for maximum cooling performance while providing a low-profile design. The aluminum fins and copper cores provide superior thermal conductivity and heat dissipation, ensuring maximum performance.

The V2201N1-F-LP is an ideal solution for a variety of applications, from industrial to consumer. It is perfect for applications such as memory, I/O devices, and microprocessors. The V2201N1-F-LP offers excellent performance and is easy to install.

The V2201N1-F-LP is a highly efficient heat sink, perfect for board level cooling. It utilizes a combination of heatsink fins and a fan to effectively dissipate heat away from the system. The aluminum fins and copper core provide superior thermal conductivity and heat dissipation, ensuring maximum performance and efficiency. The V2201N1-F-LP is a great solution for a variety of applications and is easy to install.

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