WAVE-23-165

Series:	Wave 2x
Part Status:	Active
Type:	Board Level
Package Cooled:	BGA
Attachment Method:	Clip
Shape:	Square, Angled Fins
Length:	0.906" (23.00mm)
Width:	0.906" (23.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.650" (16.51mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.08°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Introduction

Thermal-heat sinks are an integral part of modern electronics and are used to conduct heat away from components and boards. The WAVE-23-165 heat sink is a popular model and provides efficient thermal-conductivity with good structural support. In this article, we will look at the application field and working principle of the WAVE-23-165, as well as what makes it an effective choice for thermal-heat sinks.

Application field

The WAVE-23-165 is one of the most popular options on the market for thermal-heat sink applications. It is widely used in a variety of multi-layer printed circuit board (PCB) products, especially in telecom devices and microprocessors. The WAVE-23-165 is suitable for providing high-performance thermal-conductivity in multiple power electronics due to its low thermal resistance and high-quality construction.In specific applications, the WAVE-23-165 can be combined with other thermal-heat sink solutions to provide extra cooling capacity. For example, it is compatible with both high-performance fanstacks and thin profile heatsinks. This allows users to achieve superior thermal-conductivity and stability.

Working Principle

The WAVE-23-165 works by dissipating the heat generated by components or boards into the air. This is done by conducting the heat away from the components or boards into the WAVE-23-165 heat sink. The WAVE-23-165 contains multiple fins that increase the surface area which, in turn, increases the rate of air flow around the heat sink. This, combined with the air holes at the base, helps to ensure reliable airflow.The fins provide additional cooling as they absorb heat from the components or board and dissipate it into the air. This is combined with the base plate, which is designed to effectively transfer heat from the components or board to the fins. The WAVE-23-165 also has an integrated fan speed control, which allows users to tweak the speed of airflow depending on their needs. This helps to achieve maximum cooling capacity and helps to prevent any thermal-overload.

Conclusion

The WAVE-23-165 is an effective and efficient choice for thermal-heat sinks due to its high-performance thermal-conductivity. It is widely used in multi-layer PCB products and provides superior cooling capacity. This is achieved by its combination of multiple fins which absorb and dissipate heat combined with an efficient fan speed control.

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