WAVE-35-15 Allicdata Electronics
Allicdata Part #:

345-1537-ND

Manufacturer Part#:

WAVE-35-15

Price: $ 1.39
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: ANCHOR HEATSINK 35X35X15MM
More Detail: Heat Sink BGA Aluminum Alloy Board Level
DataSheet: WAVE-35-15 datasheetWAVE-35-15 Datasheet/PDF
Quantity: 999
1 +: $ 1.26630
10 +: $ 1.23606
25 +: $ 1.20254
50 +: $ 1.13576
100 +: $ 1.06898
250 +: $ 1.00218
500 +: $ 0.96877
1000 +: $ 0.86855
5000 +: $ 0.85185
Stock 999Can Ship Immediately
$ 1.39
Specifications
Series: Wave 3x
Part Status: Active
Type: Board Level
Package Cooled: BGA
Attachment Method: Clip
Shape: Square, Angled Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.15°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are essential to keeping electronic devices and systems working at their peak performance. The thermal challenge is addressed through components designed to dissipate or absorb excess heat. In the field of electronics cooling, heat sinks are among the most important tools used to efficiently manage heat. The variety of heat sink designs is ever-growing, and the WAVE-35-15 heat sink is an example of the latest in cooling technologies.

The WAVE-35-15 heat sink has a thermal resistance of 0.36 K/W and is designed for applications ranging from 1-2 watt to 12 watt. It is constructed using a wave-formed aluminum frame with a sheet of high-conductive material attached to the visible side. This design optimizes heat distribution, transferring it away from the device core and into the atmosphere via convection or radiation. Both models feature surface treatments of either high purity aluminum plated with a nickel-chromium alloy or black anodized aluminum for superior corrosion resistance.

The WAVE-35-15 design also increases cooling performance by increasing the surface area and improving the ability of heat to dissipate evenly across the surface. It also includes channels in the frame’s structure, which can be used to increase air-flow and further improve performance. This heat sink is designed for use with CPUs and chipsets, offering unparalleled value in its price-to-performance ratio.

The WAVE-35-15 is optimized for natural convection cooling, in which heat is transferred from the device to ambient air by relying exclusively on natural air flow. Natural convection works most efficiently when there is a good supply of air, and this heat sink helps direct the air to the hottest parts of the device. It should be noted, however, that a fan may be necessary to ensure adequate cooling in more extreme circumstances.

The WAVE-35-15 heat sink is designed to provide increased efficiency and cooling performance for any electronic device. Its efficient wave-form design increases the surface area and channels air to the hottest components. It also has a high thermal resistance rating and corrosion-resistant surface treatments for extra durability. The WAVE-35-15 heat sink offers an effective solution for thermal management, and can be used in a variety of applications for CPUs and chipsets.

The specific data is subject to PDF, and the above content is for reference

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