Electronic button ic - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
W25X10VSNIG-ND	W25X10VSNIG	Winbond Electronics	View more Series: SpiFlash Packaging: Tube Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 1Mb (128K x 8) Clock Frequency: 75MHz Write Cycle Time - Word, Page: 3ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	--
W25X10CLSNIGTR- ND	W25X10CLSNIG TR	Winbond Electronics	View more Series: SpiFlash Packaging: Tape & Reel (TR) Part Status: Active Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 1Mb (128K x 8) Clock Frequency: 104MHz Write Cycle Time - Word, Page: 800s Memory Interface: SPI Voltage - Supply: 2.3 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	--
W25X40CLSVIGTR- ND	W25X40CLSVIG TR	Winbond Electronics	View more Series: SpiFlash Packaging: Tape & Reel (TR) Part Status: Active Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 4Mb (512K x 8) Clock Frequency: 104MHz Write Cycle Time - Word, Page: 800s Memory Interface: SPI Voltage - Supply: 2.3 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-VSOP	1000 Order	5000+: $0.2329
W632GG8MB-15-ND	W632GG8MB-15	Winbond Electronics	View more Part Status: Active Memory Type: Volatile Memory Format: DRAM Technology: SDRAM - DDR3 Memory Size: 2Gb (128M x 16) Clock Frequency: 667MHz Access Time: 20ns Memory Interface: Parallel Voltage - Supply: 1.425 V ~ 1.575 V Operating Temperature: 0C ~ 95C (TC)	1000 Order	242+: $3.5587
W25X20VSNIG-ND	W25X20VSNIG	Winbond Electronics	View more Series: SpiFlash Packaging: Tube Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 2Mb (256K x 8) Clock Frequency: 75MHz Write Cycle Time - Word, Page: 3ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	--
W25X20CLSNIG-ND	W25X20CLSNIG	Winbond Electronics	View more Series: SpiFlash Packaging: Tube Part Status: Active Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 2Mb (256K x 8) Clock Frequency: 104MHz Write Cycle Time - Word, Page: 800s Memory Interface: SPI Voltage - Supply: 2.3 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	32277 Order	--
W25X10BVSNIG-ND	W25X10BVSNIG	Winbond Electronics	View more Series: SpiFlash Packaging: Tube Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 1Mb (128K x 8) Clock Frequency: 104MHz Write Cycle Time - Word, Page: 3ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	--
W632GG6MB-15TR- ND	W632GG6MB-15 TR	Winbond Electronics	View more Packaging: Tape & Reel (TR) Part Status: Active Memory Type: Volatile Memory Format: DRAM Technology: SDRAM - DDR3 Memory Size: 2Gb (128M x 16) Clock Frequency: 667MHz Access Time: 20ns Memory Interface: Parallel Voltage - Supply: 1.425 V ~ 1.575 V Operating Temperature: 0C ~ 95C (TC)	1000 Order	3000+: $2.998
W25X40VSSIG-ND	W25X40VSSIG	Winbond Electronics	View more Series: SpiFlash Packaging: Tube Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 4Mb (512K x 8) Clock Frequency: 75MHz Write Cycle Time - Word, Page: 3ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC	1000 Order	--
W25X80VSFIG-ND	W25X80VSFIG	Winbond Electronics	View more Series: SpiFlash Packaging: Tube Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 8Mb (1M x 8) Clock Frequency: 75MHz Write Cycle Time - Word, Page: 3ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	1000 Order	1+: $0
W25Q80JVSSIQTR- ND	W25Q80JVSSIQ TR	Winbond Electronics	View more Series: SpiFlash Packaging: Tape & Reel (TR) Part Status: Active Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH - NOR Memory Size: 8Mb (1M x 8) Clock Frequency: 133MHz Write Cycle Time - Word, Page: 3ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA)	1000 Order	1+: $0
W25P80VSSIGT&am p;R-ND	W25P80VSSIG T&a mp;R	Winbond Electronics	View more Series: SpiFlash Packaging: Tape & Reel (TR) Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 8Mb (1M x 8) Clock Frequency: 50MHz Write Cycle Time - Word, Page: 7ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC	1000 Order	1+: $0
W632GU8MB-15-ND	W632GU8MB-15	Winbond Electronics	View more Part Status: Active Memory Type: Volatile Memory Format: DRAM Technology: SDRAM - DDR3 Memory Size: 2Gb (128M x 16) Clock Frequency: 667MHz Access Time: 20ns Memory Interface: Parallel Voltage - Supply: 1.283 V ~ 1.45 V Operating Temperature: 0C ~ 95C (TC)	1000 Order	242+: $3.5587
W632GU8MB15I-ND	W632GU8MB15I	Winbond Electronics	View more Part Status: Active Memory Type: Volatile Memory Format: DRAM Technology: SDRAM - DDR3 Memory Size: 2Gb (128M x 16) Clock Frequency: 667MHz Access Time: 20ns Memory Interface: Parallel Voltage - Supply: 1.283 V ~ 1.45 V Operating Temperature: -40C ~ 95C (TC)	1000 Order	242+: $4.472
W632GG6MB-11-ND	W632GG6MB-11	Winbond Electronics	View more Part Status: Active Memory Type: Volatile Memory Format: DRAM Technology: SDRAM - DDR3 Memory Size: 2Gb (128M x 16) Clock Frequency: 933MHz Access Time: 20ns Memory Interface: Parallel Voltage - Supply: 1.425 V ~ 1.575 V Operating Temperature: 0C ~ 95C (TC)	1000 Order	198+: $3.7592
W25P40VSNIGT&am p;R-ND	W25P40VSNIG T&a mp;R	Winbond Electronics	View more Series: SpiFlash Packaging: Tape & Reel (TR) Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 4Mb (512K x 8) Clock Frequency: 40MHz Write Cycle Time - Word, Page: 5ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	1+: $0
W25X40CLSSIG-ND	W25X40CLSSIG	Winbond Electronics	View more Series: SpiFlash Packaging: Tube Part Status: Active Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 4Mb (512K x 8) Clock Frequency: 104MHz Write Cycle Time - Word, Page: 800s Memory Interface: SPI Voltage - Supply: 2.3 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC	1000 Order	--
W25P20VSNIGT&am p;R-ND	W25P20VSNIG T&a mp;R	Winbond Electronics	View more Series: SpiFlash Packaging: Tape & Reel (TR) Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 2Mb (256K x 8) Clock Frequency: 40MHz Write Cycle Time - Word, Page: 5ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	1+: $0
W25Q64FVSH01-ND	W25Q64FVSH01	Winbond Electronics	View more Series: SpiFlash Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH - NOR Memory Size: 64Mb (8M x 8) Clock Frequency: 104MHz Write Cycle Time - Word, Page: 3ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V	1000 Order	1+: $0
W25P20VSNIG-ND	W25P20VSNIG	Winbond Electronics	View more Series: SpiFlash Packaging: Tube Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 2Mb (256K x 8) Clock Frequency: 40MHz Write Cycle Time - Word, Page: 5ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	--
W632GG6KB-09-ND	W632GG6KB-09	Winbond Electronics	View more Part Status: Discontinued at Digi-Key Memory Type: Volatile Memory Format: DRAM Technology: SDRAM - DDR3 Memory Size: 2Gb (128M x 16) Clock Frequency: 1066MHz Access Time: 20ns Memory Interface: Parallel Voltage - Supply: 1.425 V ~ 1.575 V Operating Temperature: 0C ~ 95C (TC)	1000 Order	1+: $0
W25X16VSSIG-ND	W25X16VSSIG	Winbond Electronics	View more Series: SpiFlash Packaging: Tube Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 16Mb (2M x 8) Clock Frequency: 75MHz Write Cycle Time - Word, Page: 3ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC	1000 Order	--
W25X32VSSIGT&am p;R-ND	W25X32VSSIG T&a mp;R	Winbond Electronics	View more Series: SpiFlash Packaging: Tape & Reel (TR) Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 32Mb (4M x 8) Clock Frequency: 75MHz Write Cycle Time - Word, Page: 3ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC	1000 Order	1+: $0
W25P10VSNIGT&am p;R-ND	W25P10VSNIG T&a mp;R	Winbond Electronics	View more Series: SpiFlash Packaging: Tape & Reel (TR) Part Status: Obsolete Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 1Mb (128K x 8) Clock Frequency: 40MHz Write Cycle Time - Word, Page: 5ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	1+: $0
W632GG8MB15I-ND	W632GG8MB15I	Winbond Electronics	View more Part Status: Active Memory Type: Volatile Memory Format: DRAM Technology: SDRAM - DDR3 Memory Size: 2Gb (128M x 16) Clock Frequency: 667MHz Access Time: 20ns Memory Interface: Parallel Voltage - Supply: 1.425 V ~ 1.575 V Operating Temperature: -40C ~ 95C (TC)	1000 Order	242+: $4.472
W25Q80JVUXIQTR- ND	W25Q80JVUXIQ TR	Winbond Electronics	View more Series: SpiFlash Packaging: Tape & Reel (TR) Part Status: Active Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH - NOR Memory Size: 8Mb (1M x 8) Clock Frequency: 133MHz Write Cycle Time - Word, Page: 3ms Memory Interface: SPI Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40C ~ 85C (TA)	1000 Order	1+: $0
W632GU6KB11I-ND	W632GU6KB11I	Winbond Electronics	View more Part Status: Discontinued at Digi-Key Memory Type: Volatile Memory Format: DRAM Technology: SDRAM - DDR3 Memory Size: 2Gb (128M x 16) Clock Frequency: 933MHz Access Time: 20ns Memory Interface: Parallel Voltage - Supply: 1.283 V ~ 1.45 V Operating Temperature: -40C ~ 95C (TC)	1000 Order	1+: $0
CT3677-ND	CT3677	Cal Test Electronics	View more Series: Cal Test Part Status: Active Type: Test Clip, Lead, Probe Accessory Type: IC Lead Comb Kit For Use With/Related Products: Oscilloscope Probes Specifications: 0.5mm Centers	1000 Order	1+: $30.24
28-6518-10M-ND	28-6518-10M	Aries Electronics	View more Series: 518 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination Post Length: 0.125" (3.18mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	34+: $3.5324
1109681-648100P CSMINIMUM-ND	1109681-648 1 00 PCS MINIMUM	Aries Electronics	View more Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Brass Mounting Type: Through Hole Features: Spacer Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination Post Length: 0.125" (3.18mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	100+: $26.8302
C8116-ND	C8116-04	Aries Electronics	View more Series: Edge-Grip, C81 Packaging: Bulk Part Status: Obsolete Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0in (5.08m) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 105C Termination Post Length: 0.675" (17.15mm) Material Flammability Rating: UL94 V-0 Current Rating: 1.5A	1000 Order	40+: $1.7719
A401-ND	14-3518-10	Aries Electronics	View more Series: 518 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination Post Length: 0.125" (3.18mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	3968 Order	1+: $0.9828 25+: $0.7104 100+: $0.5812 500+: $0.4649 1000+: $0.4133 5000+: $0.3358 10000+: $0.3293
24-3518-10T-ND	24-3518-10T	Aries Electronics	View more Series: 518 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination Post Length: 0.125" (3.18mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	80+: $1.0206
A818AR-ND	16-3518-101	Aries Electronics	View more Series: 518 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0in (0.25m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination Post Length: 0.125" (3.18mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	30+: $2.4098
A836AR-ND	20-3501-30	Aries Electronics	View more Series: 501 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0in (5.08m) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.690" (17.52mm) Material Flammability Rating: UL94 V-0 Current Rating: 1.5A	1000 Order	20+: $3.5204
10-2822-90TWR-N D	10-2822-90TWR	Aries Electronics	View more Series: Vertisockets 800 Packaging: Bulk Part Status: Active Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0in (5.08m) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6 Termination Post Length: 0.145" (3.68mm) Material Flammability Rating: UL94 V-0 Current Rating: 1.5A	1000 Order	17+: $4.1443
06-3508-31-ND	06-3508-31	Aries Electronics	View more Series: 508 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 6 (2 x 3) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0in (0.76m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 125C Termination Post Length: 0.500" (12.70mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	17+: $4.158
14-6823-90C-ND	14-6823-90C	Aries Electronics	View more Series: Vertisockets 800 Packaging: Bulk Part Status: Active Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0in (0.76m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 105C Termination Post Length: 0.140" (3.56mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	16+: $4.4907
16-820-90C-ND	16-820-90C	Aries Electronics	View more Series: Vertisockets 800 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0in (0.76m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0in (5.08m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 105C Termination Post Length: 0.140" (3.56mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	14+: $4.8951
14-8300-310C-ND	14-8300-310C	Aries Electronics	View more Series: 8 Packaging: Bulk Part Status: Active Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0in (0.76m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0in (0.25m) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55C ~ 105C Termination Post Length: 0.140" (3.56mm) Material Flammability Rating: UL94 V-0 Current Rating: 3A	1000 Order	13+: $5.2261

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