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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
MC9S12A128CPVE- ND	MC9S12A128CPVE	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IC, SCI, SPI Peripherals: PWM, WDT Number of I/O: 91 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20) Base Part Number: MC9S12A128	1000 Order	1+: $14.5026 10+: $13.378 100+: $11.4241 500+: $10.372
DSP56F807VF80-N D	DSP56F807VF80	NXP USA Inc	View more Series: 56F8xx Packaging: Tray Part Status: Obsolete Core Processor: 56800 Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Size: 120KB (60K x 16) Program Memory Type: FLASH RAM Size: 4K x 16 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 160-BGA Supplier Device Package: 160-MAPBGA (15x15) Base Part Number: DSP56F807	1000 Order	1+: $0
MC9S12D64VFU-ND	MC9S12D64VFU	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Obsolete Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IC, SCI, SPI Peripherals: PWM, WDT Number of I/O: 59 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14) Base Part Number: MC9S12D64	1000 Order	1+: $0
MC9S12DG128CPV- ND	MC9S12DG128CPV	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Obsolete Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IC, SCI, SPI Peripherals: PWM, WDT Number of I/O: 91 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20) Base Part Number: MC9S12DG128	1000 Order	--
MC9S08RG60CFGE- ND	MC9S08RG60CFGE	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Obsolete Core Processor: S08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10) Base Part Number: MC9S08RG60	1000 Order	1+: $0
MC34845CEP-ND	MC34845CEP	NXP USA Inc	View more Packaging: Tray Part Status: Active Type: DC DC Regulator Topology: Step-Up (Boost) Internal Switch(s): Yes Number of Outputs: 6 Voltage - Supply (Min): 5V Voltage - Supply (Max): 21V Voltage - Output: 8 V ~ 60 V Current - Output / Channel: 2.3A (Switch) Frequency: 600kHz Dimming: PWM Applications: Backlight Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 24-UFQFN Exposed Pad Supplier Device Package: 24-QFN-EP (4x4) Base Part Number: MC34845	1000 Order	2450+: $0.8418
568-11493-2-ND	SSL2109AT/1,118	NXP USA Inc	View more Series: GreenChip Packaging: Tape & Reel (TR) Part Status: Discontinued at Digi-Key Type: AC DC Offline Switcher Topology: Flyback, Step-Down (Buck), Step-Up (Boost) Internal Switch(s): No Number of Outputs: 1 Voltage - Supply (Min): 8V Voltage - Supply (Max): 16V Voltage - Output: 600V Applications: Lighting Operating Temperature: -40C ~ 125C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO Base Part Number: SSL2109	1000 Order	1+: $0
568-3484-5-ND	TDA8566Q/N2,112	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Type: Class B Output Type: 2-Channel (Stereo) Max Output Power x Channels @ Load: 55W x 2 @ 2 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -40C ~ 85C (TA) Supplier Device Package: DBS17P Package / Case: 17-SIP Formed Leads Base Part Number: TDA8566	1000 Order	1+: $0
MPC93R51FA-ND	MPC93R51FA	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Type: Clock Driver, Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer PLL: Yes with Bypass Input: LVCMOS, LVPECL Output: LVCMOS Number of Circuits: 1 Ratio - Input:Output: 2:9 Differential - Input:Output: Yes/No Frequency - Max: 240MHz Divider/Multiplier: Yes/Yes Voltage - Supply: 3.135 V ~ 3.465 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7) Base Part Number: MPC93R51	1000 Order	1+: $0
568-10622-2-ND	PEMI2STD/WM,115	NXP USA Inc	View more Series: PEMI2STD Packaging: Tape & Reel (TR) Part Status: Obsolete Type: Low Pass Filter Order: 2nd Technology: RC (Pi) Number of Channels: 2 Resistance - Channel (Ohms): 200 Values: R = 200 Ohms, C = 16pF (Total) ESD Protection: Yes Operating Temperature: -40C ~ 85C Applications: Data Lines for Mobile Devices Mounting Type: Surface Mount Package / Case: SOT-665 Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm) Height: 0.024" (0.60mm)	1000 Order	1+: $0
568-6203-2-ND	BFR30,215	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete FET Type: N-Channel Drain to Source Voltage (Vdss): 25V Current - Drain (Idss) @ Vds (Vgs=0): 4mA @ 10V Current Drain (Id) - Max: 10mA Voltage - Cutoff (VGS off) @ Id: 5V @ 0.5nA Input Capacitance (Ciss) (Max) @ Vds: 4pF @ 10V Power - Max: 250mW Operating Temperature: 150C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SOT-23 (TO-236AB) Base Part Number: BFR30	1000 Order	1+: $0
AFT09S200W02SR3 -ND	AFT09S200W02SR3	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active	1000 Order	250+: $54.5427
A2T09VD250NR1-N D	A2T09VD250NR1	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Transistor Type: LDMOS (Dual) Frequency: 920MHz Gain: 22.5dB Voltage - Test: 48V Current - Test: 1A Power - Output: 65W Voltage - Rated: 105V Package / Case: TO-270-6 Variant, Flat Leads Supplier Device Package: TO-270WB-6A	1000 Order	500+: $59.4765
AFT09S220-02NR3 -ND	AFT09S220-02NR3	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Transistor Type: LDMOS Frequency: 920MHz Gain: 19.5dB Voltage - Test: 28V Current - Test: 1.4A Power - Output: 54W Voltage - Rated: 70V Package / Case: OM-780-2 Supplier Device Package: OM-780-2	1000 Order	250+: $69.0058
568-2399-ND	BLF4G22S-100,11 2	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Transistor Type: LDMOS Frequency: 2.11GHz ~ 2.17GHz Gain: 13.5dB Voltage - Test: 28V Current Rating: 12A Current - Test: 900mA Power - Output: 25W Voltage - Rated: 65V Package / Case: SOT-502B Supplier Device Package: SOT502B	1000 Order	1+: $0
MRF372R5-ND	MRF372R5	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: LDMOS Frequency: 857MHz ~ 863MHz Gain: 17dB Voltage - Test: 32V Current Rating: 17A Current - Test: 800mA Power - Output: 180W Voltage - Rated: 68V Package / Case: NI-860C3 Supplier Device Package: NI-860C3	1000 Order	1+: $0
568-11512-2-ND	BFU530XAR	NXP USA Inc	View more Series: Automotive, AEC-Q101 Packaging: Tape & Reel (TR) Part Status: Active Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 12V Frequency - Transition: 11GHz Noise Figure (dB Typ @ f): 0.7dB @ 900MHz Gain: 22dB Power - Max: 450mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V Current - Collector (Ic) (Max): 40mA Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: TO-253-4, TO-253AA Supplier Device Package: SOT-143B Base Part Number: BFU530	1000 Order	3000+: $0.0879 6000+: $0.0822 15000+: $0.0765 30000+: $0.0754
568-14260-ND	SPC5644AF0MVZ3	NXP USA Inc	View more Series: MPC56xx Qorivva Packaging: Tray Part Status: Active Core Processor: e200z4 Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 151 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 324-BBGA Supplier Device Package: 324-TEPBGA (23x23) Base Part Number: SPC5644	1000 Order	--
S9S08RNA8W2CTJR -ND	S9S08RNA8W2CTJR	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: IC, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	1000 Order	5000+: $0.8966
MC9S08QG4CFKE-N D	MC9S08QG4CFKE	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN-EP (4x4) Base Part Number: MC9S08QG4	1000 Order	--
S9S12ZVL8F0CLC- ND	S9S12ZVL8F0CLC	NXP USA Inc	View more Series: S12 MagniV Packaging: Tray Part Status: Active Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: IC, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 19 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	1000 Order	1250+: $1.0937
568-4951-ND	LPC1113FHN33/30 1,5	NXP USA Inc	View more Series: LPC1100 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: IC, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7) Base Part Number: LPC1113	1000 Order	260+: $1.2121
LPC1342FHN33,51 8-ND	LPC1342FHN33,51 8	NXP USA Inc	View more Series: LPC13xx Packaging: Tape & Reel (TR) Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 72MHz Connectivity: IC, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7) Base Part Number: LPC1342	1000 Order	4000+: $1.2233
S9S08AW32E7CFDE -ND	S9S08AW32E7CFDE	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 38 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: S9S08AW32	1000 Order	1300+: $2.1433
MK10DX64VLK7R-N D	MK10DX64VLK7R	NXP USA Inc	View more Series: Kinetis K10 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SPI, UART/USART Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 31x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12) Base Part Number: MK10DX64	1000 Order	1000+: $2.2113
MCF51JF64VLF-ND	MCF51JF64VLF	NXP USA Inc	View more Series: MCF51Jx Packaging: Tray Part Status: Active Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: EBI/EMI, IC, SPI, UART/USART, USB OTG Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 11x12b, D/A 1x12b Oscillator Type: External Operating Temperature: -40C ~ 105C (TA) Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MCF51JF64	1000 Order	250+: $2.5525
S9S12G96ACLH-ND	S9S12G96ACLH	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 3K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	1000 Order	160+: $2.5799
MCF51JF128VHS-N D	MCF51JF128VHS	NXP USA Inc	View more Series: MCF51Jx Packaging: Tray Part Status: Active Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: EBI/EMI, IC, SPI, UART/USART, USB OTG Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 9x12b, D/A 1x12b Oscillator Type: External Operating Temperature: -40C ~ 105C (TA) Package / Case: 44-VFLGA Exposed Pad Supplier Device Package: 44-MAPLGA (5x5) Base Part Number: MCF51JF128	1000 Order	490+: $2.7273
S9S12G128AVLH-N D	S9S12G128AVLH	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	1000 Order	160+: $2.973
S912ZVC19F0MKH- ND	S912ZVC19F0MKH	NXP USA Inc	View more Series: S12 MagniV Packaging: Tray Part Status: Active Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, IC, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 16x10b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	1000 Order	800+: $3.1053
S912ZVHL64F1CLQ -ND	S912ZVHL64F1CLQ	NXP USA Inc	View more Series: S12 MagniV Packaging: Tray Part Status: Active Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, IC, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	1000 Order	300+: $3.3951
S9S12G240F0MLH- ND	S9S12G240F0MLH	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 240KB (240K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 11K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	1000 Order	--
MC9S08AC128MFGE -ND	MC9S08AC128MFGE	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 38 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10) Base Part Number: MC9S08AC128	1000 Order	800+: $3.447
S912XHY256F0VLL R-ND	S912XHY256F0VLL R	NXP USA Inc	View more Series: HCS12X Packaging: Tape & Reel (TR) Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 40MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 76 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 8K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40C ~ 105C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	1000 Order	1000+: $3.7677
MK22FN1M0VLK12R -ND	MK22FN1M0VLK12R	NXP USA Inc	View more Series: Kinetis K20 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 27x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	1000 Order	1000+: $4.8347
MC56F84565VLK-N D	MC56F84565VLK	NXP USA Inc	View more Series: 56F8xxx Packaging: Tray Part Status: Active Core Processor: 56800EX Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, IC, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 68 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 16x12b, 8x16b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12) Base Part Number: MC56F845	1000 Order	96+: $5.321
S912XEG128BMAAR -ND	S912XEG128BMAAR	NXP USA Inc	View more Series: HCS12X Packaging: Tape & Reel (TR) Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	1000 Order	750+: $5.545
SPC5604BACLL6R- ND	SPC5604BACLL6R	NXP USA Inc	View more Series: MPC56xx Qorivva Packaging: Tape & Reel (TR) Part Status: Active Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, IC, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	1000 Order	1000+: $5.5804
MK51DN512ZCLL10 -ND	MK51DN512ZCLL10	NXP USA Inc	View more Series: Kinetis K50 Packaging: Tray Part Status: Not For New Designs Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: IC, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, IS, LCD, LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 35x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14) Base Part Number: MK51DN512	1000 Order	--
S912XEQ384J3VAG R-ND	S912XEQ384J3VAG R	NXP USA Inc	View more Series: HCS12X Packaging: Tape & Reel (TR) Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40C ~ 105C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	1000 Order	--

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