Nxp lighting controller - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
BF1201WR,135-ND	BF1201WR,135	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: N-Channel Dual Gate Frequency: 400MHz Gain: 29dB Voltage - Test: 5V Current Rating: 30mA Noise Figure: 1dB Current - Test: 15mA Voltage - Rated: 10V Package / Case: SC-82A, SOT-343 Supplier Device Package: CMPAK-4 Base Part Number: BF1201	1000 Order	1+: $0
568-6164-2-ND	BF545B,215	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: N-Channel JFET Current Rating: 15mA Voltage - Rated: 30V Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23) Base Part Number: BF545	1000 Order	1+: $0
568-8458-2-ND	BFU760F,115	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 2.8V Frequency - Transition: 45GHz Noise Figure (dB Typ @ f): 0.4dB ~ 0.5dB @ 1.5GHz ~ 2.4GHz Power - Max: 220mW DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V Current - Collector (Ic) (Max): 70mA Operating Temperature: 150C (TJ) Mounting Type: Surface Mount Package / Case: SOT-343F Supplier Device Package: 4-DFP Base Part Number: BFU760	3000 Order	3000+: $0.1032 6000+: $0.0965 15000+: $0.0898 30000+: $0.0887
568-5598-ND	BF245A,112	NXP USA Inc	View more Packaging: Bulk Part Status: Obsolete Transistor Type: N-Channel JFET Frequency: 100MHz Voltage - Test: 15V Current Rating: 6.5mA Noise Figure: 1.5dB Voltage - Rated: 30V Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3 Base Part Number: BF245	1000 Order	1+: $0
MRF6S21060MR1-N D	MRF6S21060MR1	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: LDMOS Frequency: 2.12GHz Gain: 15.5dB Voltage - Test: 28V Current - Test: 610mA Power - Output: 14W Voltage - Rated: 68V Package / Case: TO-270-4 Supplier Device Package: TO-270 WB-4 Base Part Number: MRF6S21060	1000 Order	1+: $0
MRF9060LR1-ND	MRF9060LR1	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: LDMOS Frequency: 945MHz Gain: 17dB Voltage - Test: 26V Current - Test: 450mA Power - Output: 60W Voltage - Rated: 65V Package / Case: NI-360 Supplier Device Package: NI-360 Base Part Number: MRF9060	1000 Order	--
MRF1570NT1-ND	MRF1570NT1	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: LDMOS Frequency: 470MHz Gain: 11.5dB Voltage - Test: 12.5V Current - Test: 800mA Power - Output: 70W Voltage - Rated: 40V Package / Case: TO-272-8 Supplier Device Package: TO-272-8 Wrap Base Part Number: MRF1570	1000 Order	1+: $0
MRF7S18170HSR5- ND	MRF7S18170HSR5	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: LDMOS Frequency: 1.81GHz Gain: 17.5dB Voltage - Test: 28V Current - Test: 1.4A Power - Output: 50W Voltage - Rated: 65V Package / Case: NI-880S Supplier Device Package: NI-880S Base Part Number: MRF7S18170	1000 Order	1+: $0
568-11518-2-ND	BFU550XRR	NXP USA Inc	View more Series: Automotive, AEC-Q101 Packaging: Tape & Reel (TR) Part Status: Active Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 12V Frequency - Transition: 11GHz Noise Figure (dB Typ @ f): 0.7dB @ 900MHz Gain: 21.5dB Power - Max: 450mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V Current - Collector (Ic) (Max): 50mA Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: SOT-143R Supplier Device Package: SOT-143R Base Part Number: BFU550	3000 Order	3000+: $0.0539 6000+: $0.0509 15000+: $0.0464 30000+: $0.0434 75000+: $0.0398
568-1654-2-ND	BFS520,115	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 15V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz Power - Max: 300mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V Current - Collector (Ic) (Max): 70mA Operating Temperature: 175C (TJ) Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Supplier Device Package: SOT-323-3 Base Part Number: BFS520	1000 Order	1+: $0
PDTA123EK,115-N D	PDTA123EK,115	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1): 2.2 kOhms Resistor - Emitter Base (R2): 2.2 kOhms DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500A, 10mA Current - Collector Cutoff (Max): 1A Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK Base Part Number: PDTA123	1000 Order	1+: $0
PDTB123TS,126-N D	PDTB123TS,126	NXP USA Inc	View more Packaging: Tape & Box (TB) Part Status: Obsolete Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1): 2.2 kOhms DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 5V Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 500nA Power - Max: 500mW Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3 Base Part Number: PDTB123	1000 Order	1+: $0
568-3040-5-ND	74LVT32D,112	NXP USA Inc	View more Series: 74LVT Packaging: Tube Part Status: Obsolete Logic Type: OR Gate Number of Circuits: 4 Number of Inputs: 2 Voltage - Supply: 2.7 V ~ 3.6 V Current - Output High, Low: 20mA, 32mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 3.2ns @ 3.3V, 50pF Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width) Base Part Number: 74LVT32	1000 Order	1+: $0
568-10792-2-ND	PMGD130UN,115	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete FET Type: 2 N-Channel (Dual) FET Feature: Logic Level Gate Drain to Source Voltage (Vdss): 20V Current - Continuous Drain (Id) @ 25C: 1.2A Rds On (Max) @ Id, Vgs: 145 mOhm @ 1.2A, 4.5V Vgs(th) (Max) @ Id: 1V @ 250A Gate Charge (Qg) (Max) @ Vgs: 1.3nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 83pF @ 10V Power - Max: 390mW Operating Temperature: -55C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 6-TSSOP, SC-88, SOT-363 Supplier Device Package: 6-TSSOP	1000 Order	1+: $0
PH2369,126-ND	PH2369,126	NXP USA Inc	View more Packaging: Tape & Box (TB) Part Status: Obsolete Transistor Type: NPN Current - Collector (Ic) (Max): 200mA Voltage - Collector Emitter Breakdown (Max): 15V Vce Saturation (Max) @ Ib, Ic: 250mV @ 1mA, 10mA Current - Collector Cutoff (Max): 400nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V Power - Max: 500mW Frequency - Transition: 500MHz Operating Temperature: 150C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	1000 Order	1+: $0
568-14038-ND	LS1046AXN8T1A	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	--
MCIMX6L8DVN10AC R-ND	MCIMX6L8DVN10AC R	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	1000+: $10.1419
LS1026ASN8T1A-N D	LS1026ASN8T1A	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	60+: $57.045
MKE02Z64VQH2-ND	MKE02Z64VQH2	NXP USA Inc	View more Series: Kinetis KE02 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M0+ Core Size: 32-Bit Speed: 20MHz Connectivity: IC, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 57 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	88 Order	1+: $2.0853 10+: $1.8743 100+: $1.5356
KMSC8122MP8000- ND	KMSC8122MP8000	NXP USA Inc	View more Series: StarCore Packaging: Tray Part Status: Obsolete Type: SC140 Core Interface: DSI, Ethernet, RS-232 Clock Rate: 500MHz Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.20V Operating Temperature: 0C ~ 90C (TJ) Mounting Type: Surface Mount Package / Case: 431-BFBGA, FCBGA Supplier Device Package: 431-FCPBGA (20x20) Base Part Number: MSC8122	1000 Order	1+: $0
MSC8251TVT1000B -ND	MSC8251TVT1000B	NXP USA Inc	View more Series: StarCore Packaging: Tray Part Status: Obsolete Type: SC3850 Single Core Interface: Ethernet, IC, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Operating Temperature: -40C ~ 105C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29) Base Part Number: MSC8251	1000 Order	1+: $0
MSC8254SVT1000B -ND	MSC8254SVT1000B	NXP USA Inc	View more Series: StarCore Packaging: Tray Part Status: Obsolete Type: SC3850 Quad Core Interface: Ethernet, IC, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Operating Temperature: 0C ~ 105C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29) Base Part Number: MSC8254	1000 Order	1+: $0
MSC8254SAG1000B -ND	MSC8254SAG1000B	NXP USA Inc	View more Series: StarCore Packaging: Tray Part Status: Obsolete Type: SC3850 Quad Core Interface: Ethernet, IC, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Operating Temperature: 0C ~ 105C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	1000 Order	1+: $0
568-11709-ND	LPC18S57JET256E	NXP USA Inc	View more Series: LPC18xx Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, IC, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, IS, LCD, POR, PWM, WDT Number of I/O: 164 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 256-LBGA Supplier Device Package: 256-LBGA (17x17)	13 Order	1+: $9.0972 10+: $8.3633 100+: $7.063 500+: $6.2831 1000+: $5.7631
568-12407-2-ND	PCF85263ATT1/AJ	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Type: Clock/Calendar Features: Alarm, Leap Year, Watchdog Timer Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Interface: IC, 2-Wire Serial Voltage - Supply: 0.9 V ~ 5.5 V Voltage - Supply, Battery: 0.9 V ~ 5.5 V Current - Timekeeping (Max): 0.885A @ 3.3V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Supplier Device Package: 10-TSSOP	995 Order	2500+: $0.2672 5000+: $0.2539
MC9S08PA4VTGR-N D	MC9S08PA4VTGR	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	1000 Order	5000+: $0.31
MC9S08QG4CDNER- ND	MC9S08QG4CDNER	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	2500+: $0.863
MKE02Z32VLD2R-N D	MKE02Z32VLD2R	NXP USA Inc	View more Series: Kinetis KE02 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: ARM Cortex-M0+ Core Size: 32-Bit Speed: 20MHz Connectivity: IC, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 37 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	1000 Order	1500+: $0.9437
S9S08SG8E2MTJR- ND	S9S08SG8E2MTJR	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP Base Part Number: S9S08SG8	1000 Order	--
MC908QB4CDWER-N D	MC908QB4CDWER	NXP USA Inc	View more Series: HC08 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC Base Part Number: MC908QB4	1000 Order	1000+: $1.4703
S9S08EL16F1MTLR -ND	S9S08EL16F1MTLR	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	1000 Order	5000+: $1.9104
S9S12P128J0VFT- ND	S9S12P128J0VFT	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 6K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: S9S12P128	1000 Order	1300+: $2.1943
MC9S08GT8AMFDE- ND	MC9S08GT8AMFDE	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: MC9S08GT8	1000 Order	260+: $2.5524
568-11347-ND	LPC1548JBD64QL	NXP USA Inc	View more Series: LPC15xx Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 72MHz Connectivity: CANbus, IC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 44 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 20K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 24x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	1000 Order	160+: $3.2386
MK10DN512ZVLK10 -ND	MK10DN512ZVLK10	NXP USA Inc	View more Series: Kinetis K10 Packaging: Tray Part Status: Not For New Designs Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SD, SPI, UART/USART Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 37x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12) Base Part Number: MK10DN512	1000 Order	--
MK40DX256VLL7-N D	MK40DX256VLL7	NXP USA Inc	View more Series: Kinetis K40 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: CANbus, IC, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, IS, LCD, LVD, POR, PWM, WDT Number of I/O: 66 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 34x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14) Base Part Number: MK40DX256	1000 Order	--
S912XET512BCAGR -ND	S912XET512BCAGR	NXP USA Inc	View more Series: HCS12X Packaging: Tape & Reel (TR) Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	1000 Order	500+: $7.4359
MK27FN2M0AVMI15 -ND	MK27FN2M0AVMI15	NXP USA Inc	View more Series: Kinetis K27F Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 150MHz Connectivity: EBI/EMI, IC, QSPI, SDHC, SPI, UART/USART, USB Peripherals: DMA, IS, PWM, WDT Number of I/O: 120 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 1M x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 16b SAR, D/A 2x6b, 1x12b Oscillator Type: Internal/External Operating Temperature: -40C ~ 105C (TA) Package / Case: 169-LFBGA Supplier Device Package: 169-MAPBGA (9x9)	1000 Order	260+: $10.0311
MC68HC11E0CFNE3 -ND	MC68HC11E0CFNE3	NXP USA Inc	View more Series: HC11 Packaging: Tube Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Type: ROMless RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1) Base Part Number: MC68HC11	1000 Order	23+: $10.5783
SP5745CBK1AVMH6 R-ND	SP5745CBK1AVMH6 R	NXP USA Inc	View more Series: MPC57xx Part Status: Active Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, IC, LINbus, SPI Peripherals: DMA, IS, POR, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA)	1000 Order	1500+: $10.9514

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