Osc vco 204-206mhz smd .3x.3 - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
XCZU4CG-2FBVB90 0E-ND	XCZU4CG-2FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	--
XCZU5EG-1FBVB90 0E-ND	XCZU5EG-1FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $0.63
XCZU5EG-2FBVB90 0I-ND	XCZU5EG-2FBVB90 0I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU4CG-1FBVB90 0E-ND	XCZU4CG-1FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	--
XCZU4EG-2FBVB90 0E-ND	XCZU4EG-2FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $0.63
XCZU9EG-L2FFVC9 00E-ND	XCZU9EG-L2FFVC9 00E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 599K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.89
XCZU4EV-2FBVB90 0I-ND	XCZU4EV-2FBVB90 0I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	--
XCZU7CG-1FBVB90 0I-ND	XCZU7CG-1FBVB90 0I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU4CG-1FBVB90 0I-ND	XCZU4CG-1FBVB90 0I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $0.63
XCZU7EG-2FBVB90 0E-ND	XCZU7EG-2FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU6EG-1FFVC90 0E-ND	XCZU6EG-1FFVC90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 469K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $0.63
XCZU15EG-1FFVC9 00I-ND	XCZU15EG-1FFVC9 00I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 747K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $2.52
XCZU4EG-3FBVB90 0E-ND	XCZU4EG-3FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU15EG-2FFVC9 00E-ND	XCZU15EG-2FFVC9 00E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 747K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $2.52
XCZU9CG-L2FFVC9 00E-ND	XCZU9CG-L2FFVC9 00E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 599K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.89
XCZU6CG-2FFVC90 0E-ND	XCZU6CG-2FFVC90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 469K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	--
XCZU7EG-L2FBVB9 00E-ND	XCZU7EG-L2FBVB9 00E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.89
XCZU7EG-3FBVB90 0E-ND	XCZU7EG-3FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 667MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $2.52
XCZU15EG-3FFVC9 00E-ND	XCZU15EG-3FFVC9 00E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 667MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 747K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $3.78
XCZU15EG-1FFVC9 00E-ND	XCZU15EG-1FFVC9 00E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 747K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.89
XCZU6CG-1FFVC90 0E-ND	XCZU6CG-1FFVC90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 469K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $0.63
XCZU5CG-2FBVB90 0I-ND	XCZU5CG-2FBVB90 0I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	--
XCZU7CG-2FBVB90 0E-ND	XCZU7CG-2FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU5EG-2FBVB90 0E-ND	XCZU5EG-2FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	--
XCZU7EG-L1FBVB9 00I-ND	XCZU7EG-L1FBVB9 00I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU9EG-1FFVC90 0I-ND	XCZU9EG-1FFVC90 0I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 599K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU9EG-2FFVC90 0E-ND	XCZU9EG-2FFVC90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 599K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.89
XCZU5EG-3FBVB90 0E-ND	XCZU5EG-3FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.89
XCZU7EV-2FBVB90 0I-ND	XCZU7EV-2FBVB90 0I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	--
XCZU7EV-L2FBVB9 00E-ND	XCZU7EV-L2FBVB9 00E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.89
XCZU15EG-L2FFVC 900E-ND	XCZU15EG-L2FFVC 900E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 747K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $3.15
XCZU4EG-2FBVB90 0I-ND	XCZU4EG-2FBVB90 0I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	--
XCZU7EV-1FBVB90 0E-ND	XCZU7EV-1FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU7EV-2FBVB90 0E-ND	XCZU7EV-2FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.89
XCZU4CG-L2FBVB9 00E-ND	XCZU4CG-L2FBVB9 00E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $0.63
XCZU5EV-2FBVB90 0E-ND	XCZU5EV-2FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU5EG-L2FBVB9 00E-ND	XCZU5EG-L2FBVB9 00E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU6CG-L2FFVC9 00E-ND	XCZU6CG-L2FFVC9 00E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 469K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU7EV-L1FBVB9 00I-ND	XCZU7EV-L1FBVB9 00I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.89
XCZU4EV-1FBVB90 0I-ND	XCZU4EV-1FBVB90 0I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $0.63

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