BF2030WH6814XTSA1 Allicdata Electronics
Allicdata Part #:

BF2030WH6814XTSA1TR-ND

Manufacturer Part#:

BF2030WH6814XTSA1

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: Infineon Technologies
Short Description: MOSFET N-CH 8V 40MA SOT343
More Detail: RF Mosfet N-Channel 5V 10mA 800MHz 23dB PG-SOT343...
DataSheet: BF2030WH6814XTSA1 datasheetBF2030WH6814XTSA1 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Noise Figure: 1.5dB
Current - Test: 10mA
Power - Output: --
Voltage - Rated: 8V
Package / Case: SC-82A, SOT-343
Supplier Device Package: PG-SOT343-4
Base Part Number: BF2030
Series: --
Packaging: Tape & Reel (TR) 
Part Status: Obsolete
Transistor Type: N-Channel
Frequency: 800MHz
Gain: 23dB
Voltage - Test: 5V
Current Rating: 40mA
Description

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BF2030WH6814XTSA1 is a type of radio frequency (RF) metal–oxide–semiconductor field-effect transistor (MOSFET) device. This type of MOSFET is commonly used for RF amplifiers, RF switches, and other RF applications such as radar and satellite communications. This type of MOSFET has various features such as low gate input capacitance, low drain source capacitance, low gate-drain capacitance, and high voltage operation.

Application Field

BF2030WH6814XTSA1 MOSFETs are widely used in various RF applications, such as RF amplifier, RF switches, and RF protection devices. They are particularly suitable for applications in which the gate capacitance topology needs to remain low, such as low noise amplifiers, high frequency oscillators, applications such as switch-mode power supplies. Furthermore, they are also used in microwave and wireless communication systems, radar, and satellite communication.

Working Principle

The working principle of the BF2030WH6814XTSA1 MOSFET is based on the MOSFET structure, which consists of four layers: the source, gate, drain, and substrate. The source and drain regions are doped with n-type material. The gate region is typically made from polysilicon and metal layers. A gate oxide layer is also created to insulate the metal layer from the substrate.

When voltage is applied to the gate, current flows between the source and drain regions as a result of a MOSFET action in which electrons are attracted to the area of lower charge. In this way, the gate voltage controls the current between the source and drain. In addition, the device is also characterized by low gate input capacitance, low drain source capacitance, low gate-drain capacitance, and high voltage operations.

The specific data is subject to PDF, and the above content is for reference

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