
Allicdata Part #: | BS250KL-TR1-E3TR-ND |
Manufacturer Part#: |
BS250KL-TR1-E3 |
Price: | $ 0.00 |
Product Category: | Discrete Semiconductor Products |
Manufacturer: | Vishay Siliconix |
Short Description: | MOSFET P-CH 60V 270MA TO92-18RM |
More Detail: | P-Channel 60V 270mA (Ta) 800mW (Ta) Through Hole T... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | 0.00000 |
Vgs(th) (Max) @ Id: | 3V @ 250µA |
Package / Case: | TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Supplier Device Package: | TO-92-18RM |
Mounting Type: | Through Hole |
Operating Temperature: | -55°C ~ 150°C (TJ) |
Power Dissipation (Max): | 800mW (Ta) |
FET Feature: | -- |
Vgs (Max): | ±20V |
Gate Charge (Qg) (Max) @ Vgs: | 3nC @ 15V |
Series: | TrenchFET® |
Rds On (Max) @ Id, Vgs: | 6 Ohm @ 500mA, 10V |
Drive Voltage (Max Rds On, Min Rds On): | 4.5V, 10V |
Current - Continuous Drain (Id) @ 25°C: | 270mA (Ta) |
Drain to Source Voltage (Vdss): | 60V |
Technology: | MOSFET (Metal Oxide) |
FET Type: | P-Channel |
Part Status: | Obsolete |
Packaging: | Tape & Reel (TR) |
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A BS250KL-TR1-E3 is an insulated gate field-effect transistor (IGFET) constructed as a single, internally-dxied N-Channel MOSFET. This device is distinguished from other FET types in that it features a higher electric field mobility capability than any other type. This internal structure has been designed to provide a maximum performance in power handling and excellent frequency response in low-to-medium power applications. The device is also tolerant to electrostatic discharge (ESD).
The BS250KL-TR1-E3 is particularly useful in applications where power supply efficiency, power handling, and low-to-medium switching speed are desired. Typical applications include motor control, power rectification and power conditioning, power converters and power inverters, power switching and conversion circuits, small and medium-scale energy harvesting systems, as well as in radio frequency (RF) transmission and reception circuits.
The BS250KL-TR1-E3 device consists of a single N-channel FET transistor formed by two interconnected semiconduction regions. The input regionacts as a control gate, while the output region serves as the drain. An insulating layer and oxide interface are used to isolate these two regions from one another. A voltage-variable isolator (VVI) serves to maintain the input and output regions of the device in isolation. This structure allows for improved power handling and voltage operations over longer periods of time, while mitigating the risk of shorting between the two regions.
The BS250KL-TR1-E3 device operates as an electrical switch. When no voltage is supplied to the gate, the MOSFET is in the off-state and current flow is prevented. When the correct voltage is supplied to the gate, the MOSFET is switched on, allowing current to flow between the source and the drain. The voltage at the gate must exceed the threshold voltage of the device for it to switch on. This threshold voltage is determined by a number of factors, such as temperature, channel doping, channel geometry, and channel orientation.
The drain-source cutoff voltage of the BS250KL-TR1-E3 device is typical of most FETs, in that it is fairly low; this allows for lower power consumption in operating the device. In addition, due to its insulated gate structure, the BS250KL-TR1-E3 features high performance even in high-frequency conditions. There is also a greater degree of on-state resistance than with traditional conduction channels, meaning lower power consumption even when the device is in the on-state. This leads to improved power efficiency in the device and improved thermal stability in its applications.
The BS250KL-TR1-E3 is designed to operate in an environment of 100oC or less and handles power from 1W up to 20W maximum. It also features low gate-source capacitance, improved Drain-Source breakdown voltage, improved gate charge values for charge-sensitive applications, and a convenient two-pinConnect solution.
In conclusion, the BS250KL-TR1-E3 device is a single internally-dyed N-channel MOSFET. It is ideal for applications in which high performance, power efficiency, and switching speed are desired. The device offers improved power handling capability and excellent frequency response, while still being resistant to ESD. Its low gate-source capacitance, improved drain-source breakdown voltage, and small size make it an excellent choice for low-power applications.
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