CYD09S18V18-200BBXC Allicdata Electronics
Allicdata Part #:

428-2034-ND

Manufacturer Part#:

CYD09S18V18-200BBXC

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Cypress Semiconductor Corp
Short Description: IC SRAM 9M PARALLEL 256FBGA
More Detail: SRAM - Dual Port, Synchronous Memory IC 9Mb (512K ...
DataSheet: CYD09S18V18-200BBXC datasheetCYD09S18V18-200BBXC Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Write Cycle Time - Word, Page: --
Base Part Number: CYD09S18
Supplier Device Package: 256-FBGA (17x17)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.42 V ~ 1.58 V, 1.7 V ~ 1.9 V
Memory Interface: Parallel
Access Time: 3.3ns
Series: --
Clock Frequency: 200MHz
Memory Size: 9Mb (512K x 18)
Technology: SRAM - Dual Port, Synchronous
Memory Format: SRAM
Memory Type: Volatile
Part Status: Obsolete
Packaging: Tray 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Memory refers to the existence of the contents of substance or information technology, or is use for short-term memory. In the same way, CYD09S18V18-200BBXC is a special type of memory device that is designed to perform memory functions with high precision and efficiency.

Application Field

As a specialized memory device, the applications of CYD09S18V18-200BBXC are quite varied. First of all, it can be used in high speed testing and measuring instruments that require reliable, precise and non-volatile memory operations. This memory device is excellent for applications in automated production, industrial controls, robotics and aerospace application. In addition, it can also be used in factories, vehicles and motorbikes.

Secondly, because of its unique design, the CYD09S18V18-200BBXC memory device can also be used in cell phones and other communication devices, such as modems and network modules. This device is equipped with excellent characteristics, such as low power consumption, high speed and reliable operation, making it useful for fields such as cell phones and wireless communication.

Thirdly, this type of memory device can be used in embedded systems and system-on-chip (SoC) products as well. This is because of its high-performance design and its ability to easily adapt to a wide range of fitting requirements. Embedded systems can benefit from the precise and reliable operation of the CYD09S18V18-200BBXC device, making it an ideal solution for applications that require a precise, efficient and dependable memory.

Working Principle

The working principle of the CYD09S18V18-200BBXC memory device is based on the design of a two-layer planar capacitor storage array. This storage array is made of two layers of polysilicon material, separated by an insulator. The polysilicon material serves as the memory storage area, while the surrounding material serves as a reference voltage. To write or store data, a certain voltage is applied to the polysilicon layer, and the resulting electric field causes tiny structures called “data cells” to be created. These data cells can be read back when the data cell is polarized again.

In order to achieve its high-precision and reliable operation, the CYD09S18V18-200BBXC memory device uses a special read principle called Substrate Noise I-Time (SNI-Time) architecture. This architecture allows data cells to be read precisely and quickly, providing a high efficiency with read/write speeds of up to 5 Megahertz (MHz).

It is also worth noting that the CYD09S18V18-200BBXC is an extremely reliable and dependable device. Its planar storage array is constructed using a double-sided build process and optimized interconnects, resulting in an extremely robust and reliable memory device.

Conclusion

The CYD09S18V18-200BBXC memory device is a cutting-edge storage device used in a wide variety of applications. Its high-precision and efficient operation make it suitable for applications such as high-speed testing and measuring equipment, embedded systems, cellular phones and other communication devices. The Substrate Noise I-Time architecture also provides a reliable and fast read/write speed of up to 5 MHz. The device\'s planar construction and double-sided build process also ensure a reliable and robust operation.

The specific data is subject to PDF, and the above content is for reference

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