DS1411-009#

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The DS1411-009# memory connector is a 6-pin PC card socket designed to provide electronic products with the ability to interface with the user\'s system in an external card slot. It is typically used in applications that require a portable, user-friendly solution such as laptop computers, point-of-sale terminals, and embedded systems. This PC card socket is designed with standard features that provide reliable connection and data transmission between the electronic equipment and the user\'s PC system.

The connector has two halves, a top and bottom, which form the PC card socket. The top half consists of the printed circuit board (PCB) and connection pins while the bottom half is designed with an interior plastic hot swap tray for the PC card. The interior hot swap tray features two contact springs to ensure that the PC card is properly seated in the PC card socket. The internal male pin is soldered into the printed circuit board while the external contact is exposed in the form of six "fingers" on the outside of the PC card socket.

In order to ensure precise connection and data transmission, the DS1411-009# connector is designed with numerous features. These features include contoured pins for easy insertion of the PC card and a locking mechanism that secures the PC card in place. Additionally, the PC card socket is designed with gold-plated contact areas and a self-aligning assembly for reduced electrical resistance and enhanced data signal integrity.

The connector also features low-profile design that reduces the overall system size. The connector also features an integrated EMI/RFI shielding cover to reduce electromagnetic interference. Lastly, the DS1411-009# connector is rated up to 2A and features a contact resistance of 60mΩ maximum.

The DS1411-009# memory connector provides the user with a cost-effective, reliable solution for interfacing their electronic equipment with their PC system. This PC card socket can be used in a wide variety of applications from embedded systems to laptops. Additionally, the integrated EMI/RFI shielding and self-aligning design features reduce electrical resistance and improve data signal integrity while the low-profile design reduces the system overall size.

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