MAX3074EEPA+ Allicdata Electronics
Allicdata Part #:

MAX3074EEPA+-ND

Manufacturer Part#:

MAX3074EEPA+

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Maxim Integrated
Short Description: IC TXRX RS485/422 8-DIP
More Detail: 1/1 Transceiver Full RS422, RS485 8-PDIP
DataSheet: MAX3074EEPA+ datasheetMAX3074EEPA+ Datasheet/PDF
Quantity: 344
Stock 344Can Ship Immediately
Specifications
Series: --
Packaging: Tube 
Part Status: Active
Type: Transceiver
Protocol: RS422, RS485
Number of Drivers/Receivers: 1/1
Duplex: Full
Receiver Hysteresis: 100mV
Data Rate: 500kbps
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP
Base Part Number: MAX3074E
Description

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MAX3074EEPA+ is a high-performance, low-power, small-size chip for use in automotive environments and applications. The chip features integrated transceiver and receiver functions, and on-chip voltage management systems. It is designed to drive high-speed data in automotive applications while maintaining a low-power footprint. MAX3074EEPA+ is ideal for applications such as car navigation, infotainment systems, vehicle diagnostics, and instrumentation.

The transceiver’s primary function is to send and receive data from external devices. It is able to send data at speeds of up to 10 Mbps in both serial and parallel modes, making it suitable for high-speed data transmission applications. The receiver that resides inside the chip allows it to receive data at up to 1000 Mbps, making it well suited for receiving data from external sources in high resolution applications.

The on-chip voltage management system enables the chip to be integrated with a variety of power sources. The system includes a coil driver to provide up to 8V of direct current, a voltage monitor to detect and monitor power source changes, and a battery sensing circuit to provide ripple free power to the chip’s internal components.

MAX3074EEPA+ features a robust isolation layer that prevents noise from reaching the chip. This isolation layer utilizes dual-layer protection, which ensures that the chip is protected from EMI/RFI interference. The chip’s low-profile, integrated package also helps reduce EMI/RFI effects, ensuring that the data being sent and received is of the highest quality.

The chip is designed using a small-footprint architecture that minimizes board space requirements and allows for easy integration into existing systems. The chip’s integrated transceivers and receivers make it easy to interface with a variety of external devices, such as LCD displays, touchscreens, and encoders. The integrated power management system ensures reliable operation of all internal components, even in environments with fluctuating power levels.

In short, MAX3074EEPA+ is an ideal choice for automotive applications. Its integrated transceivers, receivers, and power management systems make it well suited for driving high-speed data in demanding applications. The chip’s robust isolation layer ensures that data is transferred reliably and cleanly while its compact package enables easy integration into existing systems.

The specific data is subject to PDF, and the above content is for reference

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