Allicdata Part #: | 819-1025-ND |
Manufacturer Part#: |
MR256A08BCYS35 |
Price: | $ 3.69 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Everspin Technologies Inc. |
Short Description: | IC RAM 256K PARALLEL 44TSOP2 |
More Detail: | MRAM (Magnetoresistive RAM) Memory IC 256Kb (32K x... |
DataSheet: | MR256A08BCYS35 Datasheet/PDF |
Quantity: | 1000 |
270 +: | $ 3.35804 |
Series: | -- |
Packaging: | Tray |
Part Status: | Active |
Memory Type: | Non-Volatile |
Memory Format: | RAM |
Technology: | MRAM (Magnetoresistive RAM) |
Memory Size: | 256Kb (32K x 8) |
Write Cycle Time - Word, Page: | 35ns |
Access Time: | 35ns |
Memory Interface: | Parallel |
Voltage - Supply: | 3 V ~ 3.6 V |
Operating Temperature: | -40°C ~ 85°C (TA) |
Mounting Type: | Surface Mount |
Package / Case: | 44-TSOP (0.400", 10.16mm Width) |
Supplier Device Package: | 44-TSOP2 |
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Memory is an essential part of computer systems, playing a key role in data storage, processing and retrieval. MR256A08BCYS35 is a modern dynamic random access memory (DRAM) device that promises improved performance and immense computing power. This article will discuss its application field and working principle.
First, it is important to understand that DRAM is used in a variety of applications, from phones to computers. DRAM is used in systems that need large amounts of memory to store, manipulate and analyze data. This includes applications such as gaming and graphic design, as well as scientific, medical and military simulations. MR256A08BCYS35 is designed to suit these and other high-power applications.
MR256A08BCYS35 is a next-generation DRAM device, featuring a high speed data rate of 1.6GHz and a large capacity of 8GB. Its speed also exceeds current generation products, allowing it to quickly store and manage larger volumes of data. This makes it ideal for high-end operations such as gaming, graphic design and scientific simulations.
The chip is part of the DDR4 memory family and supports the latest generation of technologies. It is built on TSMC’s sixth-generation 28nm process, offering improved manufacturing efficiency and cost savings. As a result, the cost of DRAM chips is reduced, making them more accessible to consumers around the world.
Turning to the working principle of MR256A08BCYS35, this DRAM device is based on a synchronous dynamic random access memory architecture. In this type of DRAM, data is stored in a tiny sub-circuit, while the read/write process is handled by an advanced controller unit. The controller also contains algorithms to detect any errors in the data and recover them, as well as to detect any irregularities in the memory. This makes it highly reliable for any intense applications.
The chip has a BL8-2 burst length with a maximum sequential access time of 6ns. This burst length is used to divide the large memory block into smaller segments, reducing the time needed to access the memory. The 8bit prefetch feature allows for quick reading of data from a certain portion of the DRAM. It also provides predictable performance for applications that require fast processing speeds.
To sum up, MR256A08BCYS35 is a next-generation DRAM device with unparalleled speed and capacity. It is designed for high-power applications such as gaming, graphic design and scientific simulations, offering enhanced performance and reliability. The chip has a synchronous dynamic random access memory architecture and a BL8-2 burst length, allowing for fast and efficient access to the memory. This makes it the perfect choice for any serious computing tasks.
The specific data is subject to PDF, and the above content is for reference
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