| Allicdata Part #: | MT53B256M64D2TG-062XTES:C-ND |
| Manufacturer Part#: |
MT53B256M64D2TG-062 XT ES:C |
| Price: | $ 0.00 |
| Product Category: | Integrated Circuits (ICs) |
| Manufacturer: | Micron Technology Inc. |
| Short Description: | IC DRAM 16G 1600MHZ FBGA |
| More Detail: | SDRAM - Mobile LPDDR4 Memory IC 16Gb (256M x 64) ... |
| DataSheet: | MT53B256M64D2TG-062 XT ES:C Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | 0.00000 |
| Series: | -- |
| Part Status: | Obsolete |
| Memory Type: | Volatile |
| Memory Format: | DRAM |
| Technology: | SDRAM - Mobile LPDDR4 |
| Memory Size: | 16Gb (256M x 64) |
| Clock Frequency: | 1600MHz |
| Write Cycle Time - Word, Page: | -- |
| Memory Interface: | -- |
| Voltage - Supply: | 1.1V |
| Operating Temperature: | -30°C ~ 105°C (TC) |
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The MT53B256M64D2TG-062 XT ES:C is a dynamic random access memory, referred to as DRAM, used in various applications. It is an integrated circuit memory chip composed of millions of memory cells and associated circuitry for storing and retrieving data. It has a variety of applications, such as in computer systems, digital signal processors, embedded controllers, and gaming systems. It is also used in many consumer electronic devices like digital cameras, mobile phones, and televisions.
The MT53B256M64D2TG-062 XT ES:C operates in a "burst" access mode. This means that once the memory controller is given the memory address to read or write, it can continue to access the consecutive data locations in the same row with only one DRAM command. The DRAM chip can support both single and double data rate (DDR) access. In single data rate, one data transfer every clock cycle is allowed, while in double data rate, two data transfers per clock cycle are enabled.
The MT53B256M64D2TG-062 XT ES:C is organized as 16M × 8 bits. This means that the memory contains 16M words and each word contains 8 bits. A word is the smallest unit of storage in the DRAM. A single DRAM chip can store up to 32M bytes of data. It also supports on-die error detection and correction, which is useful for detecting and correcting data errors in production tests. The MT53B256M64D2TG-062 XT ES:C also supports an on-die thermal sensor to regulate die temperature.
The MT53B256M64D2TG-062 XT ES:C is used in various applications, including gaming systems and embedded controllers. It provides a high-performance memory interface to ensure fast data transfer. In gaming systems, it is used to store large amounts of data in an efficient manner. In embedded controllers, it is used to store and manipulate data such as instructions and constants. It is also used in consumer electronic devices such as digital cameras and mobile phones.
The working principle of the MT53B256M64D2TG-062 XT ES:C is based on the concept of dynamic storage. Dynamic storage is a method of storing data in a form where the contents can be both written and read at high speed. It is usually realized using capacitors and transistors as the two basic components. When a memory read is initiated by the memory controller, the information stored in the capacitors is read by the transistors and then sent to the output. Similarly, when a memory write is initiated, the information is written to the capacitors using the transistors.
The dynamic storage principle of the MT53B256M64D2TG-062 XT ES:C has several unique features. It has a relatively low power consumption and high density of storage, making it ideal for applications that require large amounts of data to be stored in a compact space. It also has fast access time and high data transfer rates, making it suitable for high-performance applications. Furthermore, it is highly reliable as it has on-die error detection and correction and an on-die thermal sensor, which help protect the data from corruption and overheating.
In conclusion, the MT53B256M64D2TG-062 XT ES:C is a dynamic random access memory chip used in various applications such as computer systems, embedded controllers, and digital signal processors. It has several features such as low power consumption, high density of storage, fast access time and high data transfer rates. It is highly reliable, with on-die error detection and correction and an on-die thermal sensor. The memory chip operates in a “burst” access mode which enables fast reading and writing of data.
The specific data is subject to PDF, and the above content is for reference
| Part Number | Manufacturer | Price | Quantity | Description |
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| MT53D512M32D2DS-053 AIT:D | Micron Techn... | -- | 1000 | IC DRAM 16G 1866MHZSDRAM ... |
| MT53D256M64D4NY-046 XT:B | Micron Techn... | 0.0 $ | 1000 | IC DRAM 16G 2133MHZSDRAM ... |
| MT53D1G64D8SQ-053 WT:E | Micron Techn... | 0.0 $ | 1000 | IC DRAM 64G 1866MHZSDRAM ... |
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| MT53B512M64D4PV-053 WT:C TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 32G 1866MHZ FBGAS... |
| MT53B256M64D2TP-062 XT ES:C TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 16G 1600MHZ FBGAS... |
| MT53B128M32D1NP-062 WT:A | Micron Techn... | 0.0 $ | 1000 | IC DRAM 4G 1600MHZSDRAM -... |
| MT53B512M64D4NW-062 WT:D | Micron Techn... | 0.0 $ | 1000 | IC DRAM 32G 1600MHZSDRAM ... |
| MT53D1024M32D4NQ-053 WT:D | Micron Techn... | 0.0 $ | 1000 | IC DRAM 32G 1866MHZ FBGAS... |
| MT53D384M32D2DS-053 WT:C TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 12G 1866MHZSDRAM ... |
| MT53D1024M32D4DT-046 AAT:D | Micron Techn... | 0.0 $ | 1000 | IC DRAM 32G 2133MHZ FBGAS... |
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| MT53D384M32D2DS-046 AUT:C | Micron Techn... | 0.0 $ | 1000 | IC DRAM 12G 2133MHZSDRAM ... |
| MT53D512M64D4NZ-046 WT:E | Micron Techn... | 0.0 $ | 1000 | IC DRAM 32G 2133MHZSDRAM ... |
| MT53B768M32D4NQ-062 WT:B TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 24G 1600MHZ FBGAS... |
| MT53D256M64D4NY-046 XT:B TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 16G 2133MHZSDRAM ... |
| MT53D512M64D4NW-046 WT:D TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 32G 2133MHZSDRAM ... |
| MT53D512M16D1Z11MWC2 | Micron Techn... | 0.0 $ | 1000 | LPDDR4 8G DIE 512MX16Memo... |
| MT53B512M64D4NK-062 WT:B TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 32G 1600MHZ FBGAS... |
| MT53D768M32D4CB-053 WT:C | Micron Techn... | 0.0 $ | 1000 | IC DRAM 24G 1866MHZ FBGAS... |
| MT53D768M64D8NZ-046 WT:E TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 48G 2133MHZ FBGAS... |
| MT53D1024M64D8NW-046 WT ES:D | Micron Techn... | 0.0 $ | 1000 | IC DRAM 64G 2133MHZ FBGAS... |
| MT53D384M16D1NY-046 XT ES:D | Micron Techn... | 0.0 $ | 1000 | LPDDR4 6G 384MX16 FBGAMem... |
| MT53D8DBNZ-DC | Micron Techn... | 0.0 $ | 1000 | SPECIAL/CUSTOM LPDDR4Memo... |
| MT53D256M64D4KA-046 XT:ES B TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 16G 2133MHZ FBGAS... |
| MT53D768M64D4SQ-046 WT ES:A TR | Micron Techn... | 0.0 $ | 1000 | LPDDR4 48G 768MX64 FBGA W... |
| MT53B512M64D4NJ-062 WT ES:B TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 32G 1600MHZ FBGAS... |
| MT53D384M32D2DS-053 AAT:C | Micron Techn... | 0.0 $ | 1000 | IC DRAM 12G 1866MHZSDRAM ... |
| MT53D1024M64D8WF-053 WT:D | Micron Techn... | 0.0 $ | 1000 | IC DRAM 64G 1866MHZSDRAM ... |
| MT53D384M32D2DS-053 AIT:C TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 12G 1866MHZSDRAM ... |
| MT53B512M64D4NZ-062 WT ES:D | Micron Techn... | 0.0 $ | 1000 | IC DRAM 32G 1600MHZ FBGAS... |
| MT53D1024M64D8NW-062 WT ES:D TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 64G 1600MHZ FBGAS... |
| MT53D512M64D4CR-053 WT:D TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 32G 1866MHZ FBGAS... |
| MT53B512M64D4NW-062 WT ES:C | Micron Techn... | 0.0 $ | 1000 | IC DRAM 32G 1600MHZ FBGAS... |
| MT53B256M64D2TG-062 XT:C | Micron Techn... | 0.0 $ | 1000 | IC DRAM 16G 1600MHZSDRAM ... |
| MT53D768M64D8SQ-046 WT:E TR | Micron Techn... | 0.0 $ | 1000 | IC DRAM 48G 2133MHZ FBGAS... |
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MT53B256M64D2TG-062 XT ES:C Datasheet/PDF