PC28F256P33B85A Allicdata Electronics
Allicdata Part #:

PC28F256P33B85A-ND

Manufacturer Part#:

PC28F256P33B85A

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Micron Technology Inc.
Short Description: IC FLASH 256M PARALLEL 64EASYBGA
More Detail: FLASH - NOR Memory IC 256Mb (16M x 16) Parallel 52...
DataSheet: PC28F256P33B85A datasheetPC28F256P33B85A Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Write Cycle Time - Word, Page: 85ns
Base Part Number: 28F256P33
Supplier Device Package: 64-EasyBGA (8x10)
Package / Case: 64-TBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 2.3 V ~ 3.6 V
Memory Interface: Parallel
Access Time: 85ns
Series: StrataFlash™
Clock Frequency: 52MHz
Memory Size: 256Mb (16M x 16)
Technology: FLASH - NOR
Memory Format: FLASH
Memory Type: Non-Volatile
Part Status: Obsolete
Packaging: Tray 
Description

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The PC28F256P33B85A is a high-performance, low-power non-volatile NAND flash memory device. It is used in many applications such as storage, memory, automotive, consumer and industrial markets. In addition, it is widely used in embedded systems and mobile phones. This memory device can store up to 256MB with up to 8 burst lengths and operates at a maximum frequency of 66MHz.

The PC28F256P33B85A memory device uses a two-plane architecture. This two-plane architecture is composed of two independent memory arrays, each of which is capable of storing 128MB of data. It stores bits of data in one of two independent banks in each plane. One plane is used to transfer data from one page in a write-to or read-from operation, and the other plane is used to store the data once it has been transferred. This architecture allows for higher capacities, higher performance, lower power consumption, and reduced latency when accessing data.

The PC28F256P33B85A has a wide range of features, including: read and write speeds up to 66MHz, optimized on-die programming, refined error correction, and improved reliability and endurance. It also has eight planes of NAND memory and multiple memory cell designs for reduced power consumption. The device is available in a TFBGA/Clay package, as well as a large 8x8 PICA package. It has an improved architecture with two planar memories.

The PC28F256P33B85A memory device is ideal for high-performance applications that require low power and high speed. It is commonly used for mass storage, such as in SSDs. It can also be used for embedded applications and mobile phones, offering capacity and performance. In addition, the device is reliable and easy to use. It features advanced error correction and improved endurance.

The PC28F256P33B85A memory device operating principle is based on reading and programming of NAND flash memory cells. The device operates in two modes: Read Mode and Program Mode. In Read Mode, the device reads a block of data stored in one or more NAND memory cells. In Program Mode, the device programs a block of data with data stored in memory cells. These memory cells are grouped into blocks, which can be programmed independently. The data stored in the memory cells is then written to an address specified by the system.

In order to achieve fast performance and low power consumption, the PC28F256P33B85A device utilizes an advanced architecture called the Two Plane Architecture. This architecture consists of two independent memory arrays, each of which is capable of storing 128MB of data. Each plane can transfer data from one page in a write-to or read-from operation, and store it once the data has been transferred.

The PC28F256P33B85A memory device is a high performance, low power NAND flash memory device for mass storage applications such as SSDs, mobile phones, and embedded systems. Its advanced two plane architecture and improved error correction provide high capacity and performance, while maintaining low power and reliability. It also features enhanced read and program speeds, optimized and on-die programming, refined error correction, and improved endurance and reliability. The device is available in a TFBGA/Clay package, and a large 8x8 PICA package, allowing it to be used in multiple applications.

The specific data is subject to PDF, and the above content is for reference

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