RC28F160C3BD70A Allicdata Electronics
Allicdata Part #:

853981-ND

Manufacturer Part#:

RC28F160C3BD70A

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Micron Technology Inc.
Short Description: IC FLASH 16M PARALLEL 64EASYBGA
More Detail: FLASH - Boot Block Memory IC 16Mb (1M x 16) Parall...
DataSheet: RC28F160C3BD70A datasheetRC28F160C3BD70A Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tray 
Part Status: Obsolete
Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - Boot Block
Memory Size: 16Mb (1M x 16)
Write Cycle Time - Word, Page: 70ns
Access Time: 70ns
Memory Interface: Parallel
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TBGA
Supplier Device Package: 64-EasyBGA (10x13)
Base Part Number: 28F160C3
Description

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The RC28F160C3BD70A is a Flash Memory device, designed by Spansion, that consists of an 16-Mbit (2M x 8) Flash memory for mobile applications. RC28F160C3BD70A is an ideal solution for cellphones and other mobile applications, as its memory capacity is large for these kinds of applications.

The RC28F160C3BD70A uses an industry-standard, 1.8-Volt only, advanced V-Power Flash Architecture and Boot Block architectures that is power-efficient and offers reliable, fast, and low-power operation. The device is packaged in a dual in-line package (DIP), and is suitable for a wide range of industrial and consumer environments.

The RC28F160C3BD70A is a Single Power Flash Memory, which means that it can be powered using either a supply voltage of 1.26~1.9V or 3.3V. This feature saves the user money since a dual power supply is not required; RC28F160C3BD70A can address up to 4 banks simultaneously, allowing up to 8Mbit of data to be addressed within a given time-frame, doubling the amount of data that can be accessed compared to single-banked Flash memory.

The device also contains several different functions, including Chip enable (CE#) and Write enable (WE#) pins, which are used to enable and control the device’s internal memory. The RC28F160C3BD70A also contains a programmable address latch (PAL) and a Data Input Buffer (DIB), which are used to temporarily store data that is to be read or written by the device.

Working principle of the RC28F160C3BD70A is described below. The device is powered on, setting the voltage to a voltage that is compatible with the ROM. Once the device is powered, the internal ROM is initialized by sending a start command. Once the ROM is initialized, the user can specify the target location to write data, or can specify the target location to read data.

When writing data, the PAL is used to store the address that is to be written to and the data is stored in the DIB, which is then written to the ROM. When reading the data, the address is specified and the resulting data is stored in the internal ROM, which can then be sent to the external device.

In mobile applications, the RC28F160C3BD70A provides fast access time and low power consumption to allow for longer battery life, which is essential for mobile applications. It can also be used for quick and reliable code upgrades. Furthermore, RC28F160C3BD70A is an excellent choice for applications such as cellphones that require large memory, as the 16-Mbit Flash memory can provide plenty of storage.

In conclusion, the RC28F160C3BD70A is an ideal device for mobile applications due to its robust feature set, fast access time, and power efficiency. Its leading-edge technology makes it suitable for various applications, such as cell phones, navigation systems, digital cameras, wearables, and more. Thanks to its flexible architecture, it is also a great choice for code upgrades and large data storage.

The specific data is subject to PDF, and the above content is for reference

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