S70GL02GS12FHVV23 Allicdata Electronics
Allicdata Part #:

S70GL02GS12FHVV23-ND

Manufacturer Part#:

S70GL02GS12FHVV23

Price: $ 12.38
Product Category:

Integrated Circuits (ICs)

Manufacturer: Cypress Semiconductor Corp
Short Description: IC FLASH 2G PARALLEL 64FBGA
More Detail: FLASH - NOR Memory IC 2Gb (128M x 16) Parallel 12...
DataSheet: S70GL02GS12FHVV23 datasheetS70GL02GS12FHVV23 Datasheet/PDF
Quantity: 1000
1600 +: $ 11.24790
Stock 1000Can Ship Immediately
$ 12.38
Specifications
Series: GL-S
Packaging: Tape & Reel (TR) 
Part Status: Active
Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - NOR
Memory Size: 2Gb (128M x 16)
Write Cycle Time - Word, Page: --
Access Time: 120ns
Memory Interface: Parallel
Voltage - Supply: 1.65 V ~ 3.6 V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Supplier Device Package: 64-FBGA (11x13)
Description

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Memory

S70GL02GS12FHVV23 is a type of memory device developed using NAND flash memory technology. It is the ideal solution for high-density storage applications. It offers exceptional performance, low power consumption, and a small footprint, making it suitable for a wide range of medium density applications.

Application field

S70GL02GS12FHVV23 memory devices are used in a variety of applications, including embedded systems, medical systems, aerospace, automotive, consumer electronics, and industrial automation. It is also suitable for ultra-high-density storage applications such as mobile phones, digital cameras, MP3 players, and portable media players. In addition, S70GL02GS12FHVV23 memory devices are used in digital recording and playback devices such as digital video cameras and hard-disk drives.

Working principle

S70GL02GS12FHVV23 memory devices employ a unique NAND flash memory architecture that allows for very low power consumption and high performance. The memory is split into two banks, which allow for two operations to be executed in parallel. The memory is also divided into two planes, which allow for two write operations to be performed at the same time. The architecture also allows for independent read and write operations, as well as random access to the memory. The NAND architecture also allows for error-checking and correction (ECC) to be performed on the data stored in the memory device. This ensures that data is stored reliably and securely.

S70GL02GS12FHVV23 memory devices utilize a high-speed bus interface. The memory device is interfaced with the system host via either a Serial Advanced Technology Attachment (SATA) interface or a Peripheral Component Interconnect Express (PCIe) interface. The memory controller in the system ensures that data is efficiently transferred from the memory device to the system.

S70GL02GS12FHVV23 memory devices support various flash management features, such as wear-leveling, garbage collection, and error correction. Wear-leveling helps ensure that data is evenly spread across the memory and garbage collection helps move data from the used sectors to the free sectors. This helps maintain the performance and reliability of the device. Error correction helps ensure data is stored reliably.

Conclusion

S70GL02GS12FHVV23 memory devices are a great choice for high-density storage applications. They offer high performance, low power consumption, and a small form factor. In addition, the NAND architecture and various flash management features ensure data is stored reliably and securely.

The specific data is subject to PDF, and the above content is for reference

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