SIP1X20-011BLF Allicdata Electronics
Allicdata Part #:

SIP1X20-011BLF-ND

Manufacturer Part#:

SIP1X20-011BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 20POS GOLD
More Detail: N/A
DataSheet: SIP1X20-011BLF datasheetSIP1X20-011BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Features: Closed Frame
Contact Resistance: --
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: --
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: SIP1x
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 20 (1 x 20)
Type: SIP
Part Status: Obsolete
Packaging: Bulk 
Description

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Sockets for ICs, Transistors

SIP1X20-011BLF is one type of socket and it is generally used for Integrated Circuits (ICs) and transistors. It has a wide variety of applications in communication and telecommunications. This article will discuss the application field and working principle of SIP1X20-011BLF.

Application Field of SIP1X20-011BLF

SIP1X20-011BLF sockets are mainly designed for installations with limited space requirements in high density form factors. They are most commonly used in communication and telecommunications, such as telephone switches, radio stations, telecom and communication networks, digital video broadcasting systems, and so on. This high-performance socket can also be used in many other applications, such as television, computer systems, electro-mechanical systems, consumer electronics, manufacturing and production processes, robotic applications, laboratory instruments, and so on.

The unique design of SIP1X20-011BLF sockets enables them to be applied in a wide range of applications without complexity, and with a large working range of high temperature environments. Additionally, these sockets impose very low insertion and extraction forces, delivering effortless movement during operational use.

Working Principle of SIP1X20-011BLF

SIP1X20-011BLF sockets are typically made of an insulated housing with two separate sections: the open area inside the housing, and the exterior surface. The open area houses the components, like Integrated Circuits (ICs) and transistors. The knob on the exterior surface is used for insertion and extraction. The exterior surface of the socket has two sections: one for connection of the electrical signals and the other for visually inspecting the components.

When a component is placed inside the socket, a spring-loaded contact is used to connect the component to the electrical connection points on the corresponding terminals. As the component is inserted, the contact spring compresses and the contacts expand to create a secure electrical connection. The connection created is known as pin-in-socket contact.

When a component needs to be removed from the socket, all that needs to be done is to press the knob on the exterior surface of the socket. This releases the mechanisms keeping the contacts pressed and the spring pushes the contacts back. This releases the electrical connection and thus the component can be removed from the socket.

Conclusion:

SIP1X20-011BLF sockets are used for Integrated Circuits (ICs) and transistors, and are mainly used in communication and telecommunications. They have a wide range of applications due to their unique design. The working principle of SIP1X20-011BLF sockets is based on pin-in-socket contact that is achieved with the use of a spring-loaded contact.

The specific data is subject to PDF, and the above content is for reference

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