SIP1X32-011BLF Allicdata Electronics
Allicdata Part #:

SIP1X32-011BLF-ND

Manufacturer Part#:

SIP1X32-011BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 32POS GOLD
More Detail: N/A
DataSheet: SIP1X32-011BLF datasheetSIP1X32-011BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Features: Closed Frame
Contact Resistance: --
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: --
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: SIP1x
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 32 (1 x 32)
Type: SIP
Part Status: Obsolete
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, Transistors are used in various applications, and SIP1X32-011BLF is no exception. This product is widely used in the fields of industrial control, communication, medical care equipment, and other fields. As one of the most advanced product of sockets in this field, SIP1X32-011BLF is especially suitable for applications where the space and power are limited.

The SIP1X32-011BLF itself is a low-voltage socket containing 32 pins. It\'s a 100% surface mount technology product, with 0.8 mm pitch, 0.8 mm height, and 1 mm width. It\'s made of hardened Polyimide film and the contact area is Phoenix Gold plated for the best possible signal response. The socket is designed to couple ICs and transistors to a PCB, with a strongly reinforced body and thermoplastic for better temperature endurance and performance.

SIP1X32-011BLF\'s working principle is quite simple. It consists of 32 pins which are arranged in a grid pattern. When an IC or transistor is inserted into the socket, the pins connect to the IC\'s terminals. When a signal or some data is sent to a pin, it is then sent through the connected device and onward. This principle makes it suitable for use in analog and digital communication, as well as in power circuits.

One of the most attractive feature of SIP1X32-011BLF is that it can provide both power and signal connections. This feature helps reduce the cost and time drastically that it would otherwise take to connect multiple components on the PCBs. It also features a low thermal resistance, which ensures reliable operation even in high temperatures. The contact resistance of the socket is also low, so the signals are transmitted accurately and reliably.

The physical structure of SIP1X32-011BLF also offers a number of advantages, which includes greater shock resistance and vibration resistance, leading to longer life and better reliability. It is also designed to reduce the contact inductance, which can improve signals transmission and reduce interference. Moreover, users can also benefit from its easy installation because it can be mounted without using screws, thanks to its pressure welding and insulation technology.

SIP1X32-011BLF has the advantage over other sockets for ICs and transistors in terms of performance, reliability, and complexity. Its small size and excellent performance make it perfect for industrial control, communications, medical care equipment, and other fields. With its highly reliable performance and low thermal resistance, SIP1X32-011BLF can offer users a safe and reliable solution for various applications.

The specific data is subject to PDF, and the above content is for reference

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