SIP1X14-041BLF Allicdata Electronics
Allicdata Part #:

SIP1X14-041BLF-ND

Manufacturer Part#:

SIP1X14-041BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 14POS GOLD
More Detail: N/A
DataSheet: SIP1X14-041BLF datasheetSIP1X14-041BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Features: Closed Frame
Contact Resistance: --
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: --
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: SIP1x
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 14 (1 x 14)
Type: SIP
Part Status: Obsolete
Packaging: Bulk 
Description

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Sockets for Integrated Circuits (ICs), Transistors, and other electronic components have been a common feature in electrical equipment for decades. The SIP1X14-041BLF is a type of 14 position socket designed for mounting integrated circuits to PCBs (Printed Circuit Boards). This type of socket is employed in various applications, ranging from communications and automotive to industrial and military electronic systems. Its purpose is to allow the electrical connection of integrated circuits to the circuit board with ease and reliability.

The SIP1X14-041BLF is a multi-pin medium-sized surface mount socket with a ceramic substrate. It is usually mounted on the board using solder paste and is designed to accept a 14-pin dual in-line package (DIP) IC. This socket has a maximum current rating of 500mA and can operate up to 8GHz. The socket is also rated up to military specs and can be used in applications that require the toughest testing standards.

The working principle of the SIP1X14-041BLF socket involves the use of two metal contacts on each side of the socket. These contacts are connected to the circuit board and the IC via a set of pins. As the IC is inserted into the socket, the two contacts make electrical contact with the IC and the PCB, thus allowing for an electrical connection. The socket also provides a secure mechanical connection between the IC and the board. The socket’s ceramic substrate provides very low inductance, which is essential for high-speed, high-frequency applications.

The SIP1X14-041BLF socket has a variety of applications in communications and automotive technology, industrial equipment, and military electronics. It is used in cellular phones and base transceiver stations for communications, in automotive control systems for controlling fuel and emission systems, and in medical imaging equipment. The socket is also used in robotic systems for assembling components and in military navigation systems for detecting missile threats. It is especially useful in these applications because of its ability to maintain a reliable connection in high specification environments with regard to test acceptance and reliability.

The SIP1X14-041BLF socket is a versatile solution for connecting ICs to PCBs in order to achieve reliable operation. Its use is widespread, and it can be found in a variety of different applications. Its construction allows for reliable electrical contact between the IC and the PCB while maintaining a secure mechanical connection. The socket’s ceramic substrate ensures low inductance, making it suitable for high-speed, high-frequency applications. The socket is also compliant with demanding testing standards, making it suitable for use in harsh environments. The SIP1X14-041BLF is an ideal solution for providing reliable, long-term electrical connection between integrated circuits and PCBs in various applications.

The specific data is subject to PDF, and the above content is for reference

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