SIP1X30-041BLF Allicdata Electronics
Allicdata Part #:

SIP1X30-041BLF-ND

Manufacturer Part#:

SIP1X30-041BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 30POS GOLD
More Detail: N/A
DataSheet: SIP1X30-041BLF datasheetSIP1X30-041BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Features: Closed Frame
Contact Resistance: --
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: --
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: SIP1x
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 30 (1 x 30)
Type: SIP
Part Status: Obsolete
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, transistors, and other electronic components are designed to provide a secure electrical connection and enable an array of functions while protecting the devices from environmental hazards. The SIP1X30-041BLF socket from CMT Inc. is the ultimate example of a specialized socket solution and a reliable electrical connection that is designed to stand the test of time. This article will discuss the application field and working principle of the SIP1X30-041BLF socket.

The SIP1X30-041BLF socket was designed to meet certain application criteria, including: low current consumption, acceptance of small and medium-sized ICs, wide temperature tolerance, and low cost. The SIP1X30-041BLF socket has a wide array of parameters that set it apart from other socket solutions, including a maximum board temperature rating of 105°C, an adjustable contact pressure ranging from 0.3-1.5N, reliable contact quality on double-sided and four-sided surface mount boards, and compatibility with 0.3-0.8mm thick substrates. This makes it ideal for use in applications ranging from consumer electronics to industrial automation.

In terms of operation, the SIP1X30-041BLF socket ensures that there is a secure connection between the device and the board, providing reliable power and signal transfer. It features an open frame design that helps reduce material costs, and can accommodate ICs up to 1.20mm in height. This makes it an ideal choice for a variety of surface mount ICs.

The working principle of the SIP1X30-041BLF socket is based on its unique design. The socket is made from an elastomer body, and the spring-loaded contacts feature an open design so that the contacts remain secure when placed on the device or the board. The contact points are designed so that they can be adjusted to different contact pressures, which helps ensure reliable signal transfer. Additionally, the socket features a low contact resistance and the substrate material is made from a thermally stable polymer for better temperature tolerance.

The SIP1X30-041BLF socket is a unique socket solution that is designed to ensure a high level of reliability and durability. It provides a secure electrical connection for a variety of ICs and other electrical components, and its adjustable contact pressure helps ensure reliable signal transfer. Additionally, the open frame design and thermally stable substrate materials provide excellent temperature tolerance, making it suitable for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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