XC7Z030-3FFG676E

Series:	Zynq®-7000
Packaging:	Tray
Part Status:	Active
Architecture:	MCU, FPGA
Core Processor:	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:	--
RAM Size:	256KB
Peripherals:	DMA
Connectivity:	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:	1GHz
Primary Attributes:	Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature:	0°C ~ 100°C (TJ)
Package / Case:	676-BBGA, FCBGA
Supplier Device Package:	676-FCBGA (27x27)
Number of I/O:	130
Base Part Number:	XC7Z030

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Introduction to XC7Z030-3FFG676E Embedded - System On Chip (SoC)

The XC7Z030-3FFG676E is a high performance, low power embedded System On Chip (SoC) manufactured by Xilinx. It is a high performance application specific integrated circuit (ASIC) offering the highest levels of integration within a single chip. The XC7Z030-3FFG676E provides a highly efficient solution for high end applications requiring high levels of integration, low power consumption and high performance capabilities.

Application fields for XC7Z030-3FFG676E

The XC7Z030-3FFG676E is ideal for applications that need to process data quickly and accurately, such as those found in the aerospace, automotive, medical and entertainment industries. It is also well-suited for use in telecommunications, scientific, industrial and military applications. The versatility of the system makes it useful for a wide variety of applications, such as computer vision, machine learning, image processing and embedded control systems. The XC7Z030-3FFG676E is also suitable for networking applications, where its powerful networking capabilities can be used to create high speed, low power wireless and wired networks.

Working Principle of XC7Z030-3FFG676E

The XC7Z030-3FFG676E utilizes the Zynq UltraScale+ MPSoC multicore architecture, which is based on 64-bit ARM processors combined with Xilinx FPGA technology. This SoC architecture integrates multiple processor cores, high level programmable logic, communication subsystems and full hardware and software development ecosystem. The multiple processor cores can be used to process data from various sources in parallel, resulting in high data processing throughput and low power consumption. The Xilinx FPGA technology allows for the implementation of complex functions on the chip to provide the highest levels of customization for custom functions. The Zynq UltraScale+ MPSoC also provides for high level programmability, enabling developers to take advantage of the full range of features offered by the architecture.

Conclusion

The XC7Z030-3FFG676E is a highly efficient and powerful System On Chip (SoC) manufactured by Xilinx. It offers the highest levels of integration within a single chip and is ideal for high end applications requiring low power consumption and high performance capabilities. The versatile architecture of the system makes it suitable for use in a wide variety of applications, from aerospace and automotive to telecommunications, scientific and industrial applications. By utilizing a high-level programmable logic and multiple processor cores, the XC7Z030-3FFG676E offers the highest levels of customization while maintaining low power consumption.

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