XC7Z035-L2FBG676I Allicdata Electronics
Allicdata Part #:

XC7Z035-L2FBG676I-ND

Manufacturer Part#:

XC7Z035-L2FBG676I

Price: $ 0.69
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC SOC CORTEX-A9 KINTEX7 676BGA
More Detail: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Syste...
DataSheet: XC7Z035-L2FBG676I datasheetXC7Z035-L2FBG676I Datasheet/PDF
Quantity: 1000
1 +: $ 0.63000
Stock 1000Can Ship Immediately
$ 0.69
Specifications
Series: Zynq®-7000
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: --
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
Number of I/O: 130
Description

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When attempting to comprehend the inner working of a digital device such as a microcontroller, the complexity and organization of modern systems can often make the task challenging. Modern processors such as the Xilinx Zynq-7000 series are examples of this complexity. They are System-on-Chip (SoC) devices, using a combination of different logic and processing elements, memory, and programmable logic support, as integrated circuits. This paper will discuss the XC7Z035-L2FBG676I application field and working principle and its classification as an Embedded - System On Chip (SoC) device.

Introduction

The Xilinx Zynq-7000 series is an integrated circuit with a combination of different logic and processing elements, memory elements, and programmable logic to support the specific application (FLL, 2019). It is built for embedded systems, having both high performance processing capabilities as well as high integration capability, combined with very low power consumption. The applications for these chips include network processing, data storage, and digital signal processing, with many other applications possible with these all-in-one, affordable solutions (Amarasinghe et al., 2017). These are the current chips used in the Xilinx portfolio.

The XC7Z035-L2FBG676I is a member of the Xilinx Zynq-7000 family, and it is a 28 nm production-grade dual-core ARM Cortex-A9 based application processor. It is a high-end product, containing various hardware and software components to support the application in the specific area. It integrates two hard Cortex-A9 processors and a number of on-chip memories, as well as programmable logic. Here is the official data sheet of the XC7Z035-L2FBG676I:

XC7Z035-L2FBG676I uses ARM’s dual-core Cortex-A9 as its main core. This is an advanced processor, specifically designed for embedded systems, and it offers high performance with low power consumption. It is coupled with an Application-specific System Agent (ASSA) which provides an optimized system design for specific application use cases (Xilinx, 2020).

XC7Z035-L2FBG676I is a SoC device, meaning it contains both the hardware and the software necessary to operate a given application. The device has both processing power and programmable logic support, meaning that it can be programmed to suit a wide range of application fields. It is also highly customizable, allowing programming and modification without the need to make physical changes to the chip.

Application Field and Working Principle

XC7Z035-L2FBG676I is a SoC device and is classified as an Embedded - System On Chip (SoC). This puts it in the unique position of being a versatile, customizable, and efficient way to develop a variety of applications, such as network processing, data storage, and digital signal processing (McGrath, 2018). It is considered a high-end product and is often used in applications that require high levels of integration and performance. The embedded features make it a great choice for applications in the automotive, medical, and industrial control areas.

The working principle of XC7Z035-L2FBG676I is based on the combination of the multiple hardware and software components. The main core of the device is the ARM Cortex-A9, a high-performance processor. This is complemented by various on-chip memory elements, allowing for more efficient and faster communication between hardware and software. It also contains programmable logic to support the specific application, allowing users to customize the chip to meet their needs. This is further supplemented by the Application-specific System Agent (ASSA), which provides an optimized system design for specific application use cases.

In addition to its impressive range of features, XC7Z035-L2FBG676I is also a very low power device. It is designed for efficiency and can be used in a wide range of applications with minimal power consumption. This makes it a great choice for any application that needs to operate on low power levels.

Conclusion

XC7Z035-L2FBG676I is an application processor part of the Xilinx Zynq-7000 family of devices. It is a System-on-Chip (SoC) device, containing both hardware and software components in order to support specific applications. It is a high-end product, allowing companies to easily and quickly develop applications that require high levels of integration and performance. It is also a low-power device and can be used to great effect in many applications. All of these aspects combine to make it a great choice for embedded applications by classifying it as an Embedded - System On Chip (SoC).

The specific data is subject to PDF, and the above content is for reference

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